Abstract: An optoelectronic assembly includes an optoelectronic device, housed in a transistor outline (TO) package having a base and a signal lead traversing an aperture in the base, and a circuit interconnect coupled to the optoelectronic device and TO package. The circuit interconnect substantially comprises an insulator, and includes a data signal trace, a resistor, and a conductor. The data signal trace, on a first side of the insulator, transmits data signal current between the optoelectronic device and an external device. The resistor, also on the first side, transmits the data signal current between the optoelectronic device and the data signal trace. The resistor is electrically and mechanically connected to the signal lead and to data signal trace. The conductor, on a second side of the insulator, transmits a ground current between the TO package and the external device, and forms a current path substantially parallel to the data signal trace.

Abstract: An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.

Abstract: An optoelectronic assembly includes a transistor outline (TO) package that houses an optoelectronic device. The TO package and the optoelectronic device are coupled to a circuit interconnect. The circuit interconnect includes an insulator having a first side for transmitting a signal current between the optoelectronic device and a device external to the TO package, and a second side for transmitting a ground current between the TO package and the external device. For a predefined operating frequency range, the impedance of the circuit interconnect approximately matches the impedance of the signal leads of the TO package and also approximately matches the impedance of the device external to the TO package. The optoelectronic device may include a laser diode or a photo diode. In addition, the present invention is an optoelectronic transceiver including a transmitter optoelectronic assembly and a receiver optoelectronic assembly.

Abstract: The present invention provides a host board system in which transceivers of two sizes (the larger approximately twice the width of the smaller) can be arbitrarily mixed within a given host board design. This is accomplished by specifying an arrangement of electrical connectors, a guide rail design, a set of transceiver features, and a bezel configuration to meet this need as well as the other requirements of optoelectronic transceivers. Typically, two slots and connectors are lined up behind an opening in a bezel that provides transceiver access to two connectors. So that either double-width or single-width transceivers can be used in the same opening, the double-width transceiver is designed to engage with the connectors in the same position as a single-width transceiver. Further, the slots and connectors are spaced evenly so that all of the slots and connectors can accommodate a single-width transceiver and all adjacent slots and connectors can accommodate a double-width transceiver.

Abstract: An optical assembly includes a first lens positioned along a first axis and configured to focus light from a light source along the first axis, and a second lens positioned along the first axis and configured to focus light from the first lens onto an optical target. A third lens is positioned along a second axis and configured to approximately collimate light from a second light source along the second axis, and a reflector positioned along the second axis is configured to reflect light from the third lens onto a fourth lens. The fourth lens is positioned on a third axis angled from the second axis and configured to focus light from the reflector onto an optical detector. Furthermore, the optical assembly is preferably a single molded optic. The optical assembly may be used in an optoelectronic transceiver having an optical subassembly, including a light source and an optical detector. The optical assembly is used to couple a pair of closely spaced optical fibers to the light source and optical detector.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An optical subassembly and a method of fabricating the same utilize a subassembly body that is formed by molding the subassembly body onto a substrate. Preferably, the subassembly body is constructed of a plastic material that can be molded into a precise shape. The subassembly body and the substrate become an integral unit when the molded plastic material is polymerized. The optical subassembly includes the subassembly body, the substrate, an optical element, an optoelectronic device, and a transmitter or receiver integrated circuit (IC) chip. The optoelectronic device and the transmitter/receiver IC chip are affixed to the substrate. Preferably, the substrate is a flexible circuit having a number of electrical traces. The flexible circuit may be composed of a polymer material. The optoelectronic device is positioned on the substrate such that the optoelectronic device is located within an opening in the subassembly body.

Abstract: An optical fiber faceplate transmits light signals between an optical fiber communications device and optical fibers secured by a fiber optic connector. The optical fiber faceplate includes a plurality of closely spaced optical fiber segments which prevent light signals from diverging as they pass through the faceplate. The diameters of the cores of the optical fiber segments within the faceplate are smaller than the diameters of the optical fibers secured by the fiber optic connector. Therefore, light from optical signals communicated by the optical fibers is received and transmitted through the faceplate via a plurality of optical fiber segments within the faceplate. Consequently, the faceplate does not need to be precisely aligned with either the optical fibers or the optical communications device.