Abstract: An example device in accordance with an aspect of the present disclosure includes a base to be mounted to a system board. A wicking region at the base is to wick adhesive into the wicking region to seal the base to the system board.

Abstract: An optical connector assembly (OCA) includes a connector housing to maintain alignment between optical components housed within the OCA and photoelectric converters on an optoelectronic substrate (OES) assembly. The optical components include a ferrule and an optical cable. The ferrule is optically coupled to the optical cable. The OCA includes a ferrule holder to hold the ferrule within the OCA, and a spring located between the connector housing and the ferrule holder. The spring is to apply a separating force between the ferrule holder and the connector housing. The OCA includes a gasket coupled to the connector housing. The coupling of the connector housing to a socket compresses the gasket to provide a seal between the connector housing and the socket.

Abstract: An optical assembly is provided that includes a base sub-assembly a mounting point for an optical socket connector. The optical assembly further comprises a cover sub-assembly to be coupled to the base sub-assembly and a carrier to receive an optical fiber ferrule and permit opto-mechanical coupling between the optical fiber ferrule and the optical socket connector when the base-sub assembly is coupled to the cover sub-assembly.

Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.

Abstract: A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.

Abstract: A system for interfacing a ferrule with a socket includes a socket, a cover to optically couple a ferrule to the socket, and a gasket interposed between the cover and the ferrule. The gasket applies a compression force against the ferrule to secure the ferrule to the socket.

Abstract: Examples herein relate to a Wavelength Division Multiplexing (WDM) optical module configured for M optical fibers, N WDM wavelengths and M×N optical signals. The module comprises an active silicon interposer, the interposer comprises a (M/2)×N array of photodetectors established on a front side of the interposer and N chips for the N WDM wavelengths. Each chip comprises M lenses for M optical signals, the M lenses established on a back side of a GaAs substrate, the M lenses comprising a first group of M/2 lenses to focus M/2 optical input signals onto M/2 photodetectors of the (M/2)×N array, and a second group of M/2 lenses to collimate M/2 optical output signals, and M/2 Vertical Cavity Surface Emitting Lasers (VCSELs) established on a front side of the GaAs substrate to generate the M/2 optical output signals.

Abstract: Examples herein relate to devices with optical ports in fan-out configurations. An electrical device may have a substrate with an electrical port on a first face of the substrate and a plurality of optical ports on a second face of the substrate. The plurality of optical ports may be positioned in a fan-out configuration on the second face of the substrate. The electrical device may also have an integrated circuit with an electrical connection and a plurality of optical connections. A first face of the integrated circuit may be coupled to the substrate. The electrical connection of the integrated circuit may be communicatively coupled to the electrical port of the substrate, and the plurality of optical connections may be communicated coupled to the plurality of optical ports of the substrate.

Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract: Examples herein relate to devices with optical ports in fan-out configurations. An electrical device may have a substrate with an electrical port on a first face of the substrate and a plurality of optical ports on a second face of the substrate. The plurality of optical ports may be positioned in a fan-out configuration on the second face of the substrate. The electrical device may also have an integrated circuit with an electrical connection and a plurality of optical connections. A first face of the integrated circuit may be coupled to the substrate. The electrical connection of the integrated circuit may be communicatively coupled to the electrical port of the substrate, and the plurality of optical connections may be communicated coupled to the plurality of optical ports of the substrate.

Abstract: An example method of manufacturing an optical interface. An optical socket may be provided that has an alignment feature that is to engage an optical connector, and first solder attachment pads. A printed circuit board may be provided that has an active optical device and second solder attachment pads. The optical socket may be connected to the printed circuit board by reflowing solder between the first and second solder attachment pads. The first and second solder attachment pads, the alignment feature, and the active optical device are positioned such that, while reflowing the solder, the solder automatically forces the optical socket into an aligned position.

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract: An example device in accordance with an aspect of the present disclosure includes a slab to transmit light, and a plurality of lenses and filters disposed on first and second surfaces of the slab. The lenses include an anti-reflective coating on at least one of the plurality of lenses at an end of the slab to couple light through the anti-reflective coating, and a reflective coating disposed on remaining ones of the plurality of lenses to cause the lenses to reflect light. The filters are offset from the lenses to form an optical zig-zag.

Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.

Abstract: Various embodiments of the present invention are directed to optical interconnects. In one embodiment of the present invention, an optical interconnect comprises a laser configured to output an optical signal and a laser-diode driver electronically coupled to the laser. The laser-diode driver induces the laser to output the optical signal in response to an electrical signal received by the laser-diode driver. The optical interconnect includes a diffractive optical element and a plurality of photodetectors. The optical interconnect is positioned to receive the optical signal and configured to split the optical signal into a plurality of optical signals, and each photodetector converts one of the plurality of optical signals into an electrical signal that is output on a separate signal line.

Abstract: In the examples provided herein, a mounting substrate includes a plurality of filter chips, where each filter chip includes a thin film filter coating on a surface of a different substrate, and the plurality of filter chips are positioned adjacent to each other in a row. A first edge of a first filter chip is flush with a first edge of the mounting substrate, a second edge of the first filter chip is flush with a second edge of the mounting substrate, and the first edge and second edge share a common corner. The flush edges of the first filter chip and the mounting substrate are reference surfaces, the plurality of filter chips are coupled to the mounting substrate via an epoxy, and the reference surfaces are to mate to connector reference surfaces on a connector.

Abstract: Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.

Abstract: A device for optically coupling two photonic elements may comprise an interposer where each photonic element is axially aligned with an optical pathway in the interposer. Also included is an optics assembly configured to direct a photonic signal along the optical pathway; and a mechanical guide assembly configured to reduce the relative tilt and rotation of photonic elements. Another such device may comprise two connectors where each connector comprises an optical pathway element in which an optics assembly is situated and a photonic element aligned with the optical pathway element. A mechanical guide assembly secures the optical pathway elements in a position so as to reduce the relative tilt and rotation of the photonic elements. A connection for optically coupling two computing units can comprise a partition situated between the computing units and on which an interposer is mounted.

Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.