Abstract: An integrated grating element system includes a first transparent layer formed on an optoelectronic substrate layer which includes at least two optoelectronic components, a first grating layer disposed on the first transparent layer which includes at least two sub-wavelength grating elements formed therein aligned with active regions of the optoelectronic components, and a second grating layer placed at a distance from the first grating layer such that light propagates between a diffraction grating element formed within the second grating layer and the at least two sub-wavelength grating elements.

Abstract: A system includes a chassis and a slot in the chassis. The slot has a depth dimension along which a removable module may be moved to insert the module in the slot and remove the module from the slot. The system includes waveguides, which have couplers that are arranged at different depths of the slot to couple the waveguides to the module in response to the module being inserted into the slot.

Abstract: A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.

Abstract: An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.

Abstract: Bidirectional optical multiplexing employs a high contrast grating as one or both of a beam-forming lens and a relay mirror. A bidirectional optical multiplexer includes the beam-forming lens to focus light. The light is one or both of a light beam internal to and another light beam external to the bidirectional optical multiplexer. The bidirectional optical multiplexer further includes an optical filter and the relay mirror. The optical filter is to selectively pass a portion of the internal light beam at a first wavelength and to reflect portions of the internal light beam at other wavelengths. The relay mirror is to reflect the internal light beam along a zigzag propagation path between the optical filter and the relay mirror.

Abstract: A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.

Abstract: Techniques relating to optical shuffling are described herein. In an example, a system for shuffling a plurality of optical beams is described. The system includes a plurality of sources to output respective beams of light. The system further includes a plurality of receivers to receive respective beams of light. The system further includes a shuffling assembly including a plurality of sub-wavelength grating (SWG) sections. Each of the plurality of SWG sections is for defining optical paths of the plurality of beams. The plurality of SWG sections includes at least one reflecting SWG section to reflect and direct light from a respective one of the plurality of sources toward a respective one of the plurality of receivers.

Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.

Abstract: Loss compensated optical switching includes an optical crossbar switch and a wafer bonded semiconductor amplifier (SOA). The optical crossbar switch has a plurality of input ports and a plurality of output ports and is on a substrate of a first semiconductor material. The wafer bonded SOA includes a layer of second semiconductor material that is wafer bonded to a surface of the substrate such that a portion of the wafer bonded SOA semiconductor material layer overlies a portion of a port of the plurality of input ports. The second semiconductor material of the wafer bonded SOA is different from the first semiconductor material of the substrate.

Abstract: A device includes a first element and a second element. The first element includes a plurality of mirrors formed as concave features on the first element. The second element is to support a plurality of filters. The first element is coupleable to the second element to align the plurality of mirrors relative to the plurality of filters to operate as a multiplexer or de-multiplexer.

Abstract: An example apparatus comprises an optical connector coupled to at least one optical fiber cable; an optical interface coupled to the optical connector and to the at least one optical fiber cable, the optical interface to receive or transmit an optical signal; and an alignment collar releasably coupled to the optical connector and coupled to a substrate, wherein the optical interface is in alignment with at least one optical device coupled to the substrate.

Abstract: An optical connector includes a first optical fiber and a second optical fiber. A first planar lens is positioned to operate on light exiting the first optical fiber to create a predetermined change in a wave front of the light. A second planar lens is positioned to accept the light from the first planar lens, the second planar lens focusing the light onto the second optical fiber. The first planar lens and second planar lens each include a regularly spaced array of posts with periodically varying diameters.

Abstract: A monolithically integrated, self-aligning, optical-fiber ferrule for a pigtailed opto-electronic module. The ferrule includes a body, a cavity defined within the body, a lateral alignment structure, and an optical-fiber stop. The cavity is to accept and align an optical fiber with an end of the cavity to face an optical aperture of an opto-electronic component. The lateral alignment structure is to self-align laterally the optical fiber with the optical aperture. The optical-fiber stop is coupled to the body, to self-align vertically the optical fiber. The body, the cavity, the lateral alignment structure and the optical-fiber stop are integrated together as a portion of a monolithically integrated chip. A system and a pigtailed opto-electronic engine that include the ferrule are also provided.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: Techniques related to optical connectors are described. A ferrule includes an optical pathway for light transmission through the ferrule. In examples, a sub-wavelength grating (SWG) assembly is integrated in the ferrule, aligned with an end of the optical pathway.

Abstract: A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided.

Abstract: A device for converting and optionally processing an optical signal comprises an optical cable having an optical-electrical conversion device at one end, the optical-electrical conversion device to convert the optical signal to an electrical signal or an electrical signal into an optical signal; a electrical package to removably receive the optical-electrical conversion device and generate processed signal; and a general circuit board attached to the electrical package and operable to receive the processed signal.

Abstract: An optical power splitter includes a zig-zag and a reflector element associated with the zig-zag. The zig-zag is to split an input signal based on the reflector element, and output a plurality of split signals.

Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.

Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.