Abstract: A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.

Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.

Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.

Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.

Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.

Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.

Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.

Abstract: A charge transfer circuit for an imaging array incorporates a number of concatenated charge transfer stages. Each stage has a charge storage element for storing accumulated charge generated by a photo-detector responsive to electromagnetic radiation incident thereon, and a transfer element to which the charge storage element is coupled. A first voltage driver is coupled to the storage element and a second voltage driver coupled to the transfer element. By selectively applying respective potential conditions to the storage elements and to the transfer elements of each stage of the array the accumulated charge stored in each storage element is transferred to the storage element of the next stage of the array to provide an integrated signal at the circuit output.

Abstract: A charge integration circuit incorporates first and second capacitors, and first and second reference voltage supplies. A first switch controls integration of charge in the first capacitor and selectively resets the first capacitor to the first reference voltage. A second switch selectively resets the second capacitor to the first reference voltage. A current mirror coupled to the capacitors effects discharge of the second capacitor by a quantity of charge equivalent to the charge integrated on the first capacitor so as to effectively transfer charge therebetween at the end of an integration period.

Abstract: A compressor or turbine type rotary machine for compressing or expanding a dangerous gas, e.g. a gas that is toxic or explosive, comprises a closed enclosure formed outside the stator around a shaft passage receiving the shaft of the rotor, the enclosure being delimited by a bell and being filled with a liquid under pressure, a wet type mechanical seal being disposed between the rotor shaft and the stator, inside the stator. The liquid contained in the enclosure is put under pressure, and a magnetic coupling is provided to link the rotor shaft to an outside shaft. The invention makes it possible to prevent any leakage of dangerous gas from the inside to the outside of the rotary machine.

Abstract: In a digital speech encoding system wherein the transmitter substitutes for the original speech signal to be encoded (1) certain parameters supplied by an analysis circuit defining, within successive time frames, the characteristics of a synthesis filter modeling the vocal tract and located at a receiver connected to the transmitter via a low-bit-rate data link, and (2) a multipulse excitation signal intended for said synthesis filter and supplied by a pulse generating circuit which determines the pulse position and amplitudes by successive approximation minimizing the mean squared error between the original speech signal and the synthetic speech signal obtained from the filter, the pulse generating circuit adds to the amplitude of each of the pulses, at the end of the approximation routine, a corrective term that is a function of the value of the partial derivative of the mean squared error taken relative to the amplitude of the pulse under consideration, taken as an independent variable.

Abstract: New lubricant additive compositions containing at least one alkenyl succinimide of the formula: ##STR1## in which R is an alkenyl group of C.sub.20 -C.sub.200,m is a whole number from 1 to 3,n is a whole number from 0 to 2, withm+n being from 1 to 3.They are produced from the reaction of an alkenyl succinic anhydride comprising a C.sub.20 -C.sub.200 alkenyl group and at least one amine of the formula: ##STR2## in which x is a whole number from 1 to 3. The additive compositions are useful in lubricating oils.