Abstract: A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, the second layer overlying the first metal layer, wherein the first metal layer includes aluminum or copper, and wherein the second layer is less than one micron in thickness and includes logic cells.

Abstract: A resin infusion system uses a housing that has an upper flexible diaphragm and a lower flexible diaphragm such that the two diaphragms form a cavity. A fiber reinforcement mat is positioned within the cavity. A mold is positioned below the lower diaphragm. A flow plate has a series of V-shaped grooves and is positioned either underneath the lower diaphragm or overtop the upper diaphragm so that the grooves press into the respective diaphragm. A vacuum is created within the housing causing resin to be drawn into the cavity with the resin interacting with the grooves increasing the turbulence of the resin flow. Once the reinforcement mat is properly wetted, the mold is pressed into the lower diaphragm.