Patents by Inventor Paul M. O'Brien

Paul M. O'Brien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector apparatus for IC packs
    Patent number: 5316488
    Abstract: A connector apparatus is disclosed for providing interconnection between two IC packs and a printed circuit board. A header connector is mounted on the printed circuit board and into which the two IC packs are inserted and ejected. Two independent ejector units each have a separate frame to be attached to the header connector and a separate actuator for moving a respective one of the IC packs from its inserted position to its ejected position. Complementary interengaging latches are provided between the separate frames for holding the ejector units in juxtaposition for conjoint attachment to the header connector.
    Type: Grant
    Filed: June 4, 1993
    Date of Patent: May 31, 1994
    Assignee: Molex Incorporated
    Inventors: Michael J. Gardner, Jerry D. Kachlic, Paul M. O'Brien
  • Ejecting means in an IC pack connector apparatus
    Patent number: 5304070
    Abstract: A connector apparatus includes a header connector (10) of a given thickness into which an IC pack is loaded and from which it is ejected. An ejecting member (16) is mounted on the header connector (10) for ejecting the IC pack from the header connector. The ejecting member (16) is configured to lie substantially within the thickness profile of the IC pack. An actuating member (18) is provided for actuating the ejecting member (16) to eject the IC pack from the header connector. The actuating member is configured to lie substantially within the thickness profile of the header connector (FIG. 1 ).
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: April 19, 1994
    Assignee: Molex Incorporated
    Inventors: Dominique Bertho, Paul M. O'Brien