Abstract: A visual editor for generating a custom email message. An editor interface may display an approximation of an email message. A user may customize content and layout of an email message through the editor interface. A user interface system may track such customizations to enable faster remote operations to be performed on content of the email message. A plurality of substantially modular renderers may enable a plurality of different output representations to be generated from a single stored representation of the email message.

Abstract: A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (?m).

Abstract: An integrated circuit with increased electromigration lifetime and allowable current density and methods of forming same are disclosed. In one embodiment, an integrated circuit includes a conductive line connected to at least one functional via, and at least one dummy via having a first, lower end electrically connected to the conductive line and a second upper end electrically unconnected (isolated) to any conductive line. Each dummy via extends vertically upwardly from the conductive line and removes a portion of a fast diffusion path, i.e., metal to dielectric cap interface, which is replaced with a metal to metallic liner interface. As a result, each dummy via reduces metal diffusion rates and thus increases electromigration lifetimes and allows increased current density.

Abstract: The present invention provides apparatus, systems and methods providing a digital scale interface in a global communications shipping management environment so that a shipping management system resident on a server computer device remote from a user client computer device, receive and recognizes a weight of a parcel from the digital scale configured with the remote user client computer device.

Abstract: A tissue imaging system (200) for examining the medical condition of tissue (290) has an illumination optical system (205), which comprises a light source (220), having one or more light emitters, beam shaping optics, and polarizing optics. An optical beamsplitter (260) directs illumination light to an imaging sub-system, containing a spatial light modulator array (300). An objective lens (325) images illumination light from the spatial light modulator array to the tissue. An optical detection system (210) images the spatial light modulator to an optical detector array. A controller (360) drives the spatial light modulator to provide time variable arrangements of on-state pixels. The objective lens operates in a nominally telecentric manner relative to both the spatial light modulator and the tissue. The polarizing optics are independently and iteratively rotated to define variable polarization states relative to the tissue.

Abstract: A method includes receiving a request to install a software release, where the software release is to be installed on a first device and/or a second device. The method also includes initiating installation of the software release on the second device and determining whether or not a user wishes to continue with the installation of the software release. The method further includes initiating installation of the software release on the first device if the user wishes to continue. In addition, the method includes restoring a second software release on the second device if the user does not wish to continue. The first and second devices may represent redundant devices, such as a redundant set of controllers in a process control system or a redundant set of I/O modules that facilitate communication between one or more controllers and one or more process elements in the process control system.

Abstract: A method for caries detection uses an image capture device (30, 32) to obtain fluorescence image data from the tooth (20) by illuminating the tooth to excite fluorescent emission. A first enhanced image of the tooth is then obtained by illuminating the tooth at a first incident angle, obtaining a back-scattered reflectance image data from the tooth tissue, and combining the back-scattered reflectance image data with the fluorescence image data. A second enhanced image of the tooth is then obtained by illuminating the tooth at a second incident angle, obtaining a back-scattered reflectance image data from the tooth tissue, and combining the back-scattered reflectance image data with the fluorescence image data. The first and second enhanced images are then analyzed to select and display the best-contrast image. This method provides high contrast images for carious regions (58) on all tooth surfaces.

Abstract: A wireless marshalling panel includes a field device protocol communication link. The wireless marshalling panel is capable of receiving a message from a wireless device and transmitting a corresponding message to a process controller via the communication link. The panel is also capable of receiving a message from the process controller via the communication link and transmitting a corresponding message to the wireless device. The messages transmitted and received via the communication link may be an analog current signal or a frequency shift keying signal. The wireless marshalling panel may include a second field device protocol communication link and also be capable of receiving a message via the second communication link and transmitting a corresponding message to a second wireless device. The wireless marshalling panel may also be capable of receiving a message from the second wireless device and transmitting a corresponding message via the second communication link.

Abstract: Methods, devices and systems for integrating multiple communication systems including multiple wireless communication protocols into a single system are discussed. In an illustrative example, a communication system includes a device adapted to communicate via first and second wireless communication protocols. The system may further include local area network or other wired sub-network, with the device adapted for first and second protocols also being adapted to operate using the local area network or other wired sub-network.

Abstract: A method includes determining first and second communication paths from a leaf node of a plurality of leaf nodes to first and second gateway nodes, respectively, of a plurality of gateway nodes. The first and second communication paths may include first and second intermediate nodes, respectively, of a plurality of intermediate nodes. A wireless message is sent from the leaf node to the first and second gateway nodes via the first and second communication paths, respectively. Information in the wireless message is communicated from at least one of the first and second gateway nodes to a component of a process control system.

Abstract: The present invention relates to a laser fuse structure for high power applications. Specifically, the laser fuse structure of the present invention comprises first and second conductive supporting elements (12a, 12b), at least one conductive fusible link (14), first and second connection elements (20a, 20b), and first and second metal lines (22a, 22b). The conductive supporting elements (12a, 12b), the conductive fusible link (14), and the metal lines (22a, 22b) are located at a first metal level (3), while the connect elements (20a, 20b) are located at a second, different metal level (4) and are connected to the conductive supporting elements (12a, 12b) and the metal lines (22a, 22b) by conductive via stacks (18a, 18b, 23a, 23b) that extend between the first and second metal levels (3, 4).

Abstract: A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (?m).

Abstract: A method includes creating a plurality of function blocks. The function blocks are defined by at least one user. The method also includes identifying a plurality of data flows between the function blocks. Each data flow includes at least one of: a flow of data from an output of one of the function blocks and a flow of data into an input of one of the function blocks. The method further includes identifying at least one value for at least one property of one or more of the function blocks. The function blocks, data flows, and at least one property value define a serial interface protocol for communicating over a serial interface. The data flows may be identified by presenting symbols representing the function blocks to the at least one user via a graphical user interface and allowing the at least one user to link inputs and outputs of the symbols.

Abstract: A bottle. The bottle may include a cup with a number of first conical sections, a lid with a number of second conical sections, and a closure positioned on the lid. The upper conical sections mate with the lower conical sections.

Abstract: An integrated circuit with increased electromigration lifetime and allowable current density and methods of forming same are disclosed. In one embodiment, an integrated circuit includes a conductive line connected to at least one functional via, and at least one dummy via having a first, lower end electrically connected to the conductive line and a second upper end electrically unconnected (isolated) to any conductive line. Each dummy via extends vertically upwardly from the conductive line and removes a portion of a fast diffusion path, i.e., metal to dielectric cap interface, which is replaced with a metal to metallic liner interface. As a result, each dummy via reduces metal diffusion rates and thus increases electromigration lifetimes and allows increased current density.

Abstract: The present invention provides a plurality of Enterprises with a single online user interface with which the Enterprise can provide Enterprise Shippers, shipping origination users and shipping intermediary users with an automated parcel management system for a plurality of supported Carriers for a plurality of services. The present invention provides for the hierarchical definition of users, including the establishment of at least one user for each Enterprise as a Super-Administrator with the highest level of privileges and authority for the Enterprise, and the identification of other users as Sub-Administrators, Desktop Users and Shipping Station Users. The present invention also provides for the hierarchical definition of organizational units within each Enterprise, including the definition of sites, groups within a site, and users within a group.

Abstract: A semiconductor interconnect structure and method providing an embedded barrier layer to prevent damage to the dielectric material during or after Chemical Mechanical Polishing. The method employs a combination of an embedded film, etchback, using either selective CoWP or a conformal cap such as a SiCNH film, to protect the dielectric material from the CMP process as well as subsequent etch, clean and deposition steps of the next interconnect level.

Abstract: The present invention provides a method and apparatus for processing ideas and managing intellectual property assets. The present invention provides a patent portfolio development portal for control and implementation of a workflow for the management of ideas such as intellectual property assets. The intellectual property assets comprise proprietary concepts and ideas captured or described in documents which are filed as applications for patent, trade marks, service marks or copyright. In the case of ideas, the intellectual property assets may also be published in defensive publications or held privately as trade secrets. The present invention provides an interface for comparing an intellectual property concept to other intellectual property concepts in a data base. The comparison enables easy access to similar and related intellectual property concepts so that similar concepts can be used to boot strap descriptions of new ideas based on improvements over and new combinations of other ideas.

Abstract: Apparatus and method for adhesively attaching a first member to a second member, such as components of a data storage device. Preferably, an adhesive is applied to the first member and exposed to ultraviolet light. The second member is placed onto the adhesive, and heat is applied to finalize curing. The adhesive is subsequently cooled to a temperature below a glass transition temperature (Tg) of the adhesive to detach the first and second members. Respective mating surfaces of the first and second members are preferably provided with different adhesive coupling characteristics, such as by provision of a surface adhesive promotor or a micro-texturized pattern to only one member. In this way, upon detachment of the first and second members, substantially all of the adhesive is removed from the other member. A filler material further establishes adhesive thickness and enhances structural unity of the adhesive during detachment of the respective members.

Abstract: The invention predicts premature dielectric breakdown in a semiconductor. At least one dielectric breakdown mode is calculated for the semiconductor wafer. If a one mode is calculated, premature dielectric breakdown will be associated with any semiconductor with a breakdown voltage less than a predetermined standard deviation of a plurality of breakdown voltages within said calculated mode. If multiple modes are calculated, the mode that most accurately represents dielectric breakdown for the semiconductor wafer is determined and premature dielectric breakdown will be associated with any semiconductor with a breakdown voltage less than a predetermined standard of the calculated mode that most accurately represents dielectric breakdown for the semiconductor wafer.