Abstract: The invention predicts premature dielectric breakdown in a semiconductor. At least one dielectric breakdown mode is calculated for the semiconductor wafer. If a one mode is calculated, premature dielectric breakdown will be associated with any semiconductor with a breakdown voltage less than a predetermined standard deviation of a plurality of breakdown voltages within said calculated mode. If multiple modes are calculated, the mode that most accurately represents dielectric breakdown for the semiconductor wafer is determined and premature dielectric breakdown will be associated with any semiconductor with a breakdown voltage less than a predetermined standard of the calculated mode that most accurately represents dielectric breakdown for the semiconductor wafer.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A crack stop void is formed in a low-k dielectric layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The crack stop void is formed simultaneously with the formation of an interconnect structure.

Abstract: The present invention includes systems and methods for the controlled deployment of software in a web-based environment where multiple versions of a single application are supported to provide field experience of various versions before general deployment. The systems and methods of the invention support backwards compatibility, which allows older versions of the same software to be accessed concurrently with newer (revised) versions. Likewise, data item opaqueness is supported whereby data items not recognized by a software level or tier are not rejected but are passed on to another tier or level where they may be recognized.

Abstract: The present invention includes system and methods for the continued operation of a carrier management system having one or more user terminals that normally communicate with at least one data center over a network (online), when the one or more user terminals are unable to communicate with the data center (offline). Once communication is re-established between the one or more user terminal and the data center, local files and data on the user terminals that were used to rate and ship packages while offline are synchronized between the one or more user terminals and the data center.

Abstract: A system and method are disclosed for facilitating enhanced call awareness. A system incorporating teachings of the present disclosure may include an interface that receives a signal associated with a call to a telephone number. A call information engine may be coupled to the interface and may recognize that a party to the call subscribes to an enhanced call activity service. In some cases, the party may be a called party or a calling party, and the activity may include an incoming call to the telephone number, an outgoing call, a missed call, or a waiting voicemail message. A memory may maintain a data network address for the party, and a messaging engine may initiate sending of a message containing call information to the data network address. The message may be sent in response to a trigger signal output by a notification engine without consideration for whether or not a telephone line associated with the telephone number is busy.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A method for fabricating a molding tool for mold glass optical elements therewith is taught. The method comprises the steps of figuring the molding tool to have a predetermined mold surface; applying an attenuating coating to the predetermined mold surface; implanting metal ions through the attenuating coating and into the predetermined mold surface; and removing the attenuating coating leaving the predetermined mold surface with metal ions implanted therein. The method of fabrication allows for the molding tool made therewith to be used for molding optical elements from eco-glasses such as titania at high temperatures without generating adverse surface chemistry effects in the molded element.

Abstract: There is presented an assembly for prevention of urinary incontinence in humans, the assembly comprising an applicator and an elastomer body. The applicator is adapted to position the elastomer body in the urethra of a female or male and includes a support portion for retaining the elastomer body, and a manipulable portion for positioning the elastomer body in the urethra. There is further presented a method for preventing an unwanted discharge of urine, utilizing the aforesaid assembly.