Patents by Inventor Paul R. McHugh

Paul R. McHugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250188640
    Abstract: An edge shield for reducing electrical current crowding of a wafer, having a first side and a second side, during jet array electroplating, including one or more rings disposed below a second side of the wafer and configured to restrict current flow to an edge of the wafer, and at least one opening configured to allow electrolyte flow to pass through. Further, a system for reducing electrical current crowding of a wafer during jet array electroplating, including a chamber where, when the wafer is placed inside the chamber, there is a first gap between a wall of the chamber and an edge of the wafer and a second gap between a jet array and the second side of the wafer, and an edge shield disposed in the second gap, wherein the edge shield includes at least one opening configured to allow electrolyte flow to escape the chamber.
    Type: Application
    Filed: December 6, 2023
    Publication date: June 12, 2025
    Applicant: APPLIED Materials, Inc.
    Inventors: Gregory J. Wilson, Paul R. McHugh
  • Publication number: 20250118572
    Abstract: Exemplary anneal chambers may include a base that defines a chamber interior. The base may include a cooling plate within the chamber interior. The base and the cooling plate may be integral with one another. The chambers may include a lid that is coupled with the base. The chambers may include a heater plate mounted in the chamber interior alongside the cooling plate. The chambers may include a transfer hoop movably coupled within the chamber interior. The base may define a first transfer hoop recess about at least a portion of the heater plate. The base may define a second transfer hoop recess about at least a portion of the cooling plate.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Nolan L. Zimmerman, Deepak Saagar Kalaikadal, Matthew Paul McHugh, Daniil Oliferovskiy
  • Publication number: 20250116028
    Abstract: Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Nolan L. Zimmerman, Randy A. Harris, John L. Klocke, Eric J. Bergman, Keith Edward Ypma
  • Publication number: 20250051951
    Abstract: A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current. To determine the current characteristics, a model of a substrate may be simulated during the plating process to generate data points that relate characteristics of the plating process and a pattern on the substrate to a range nonuniformity of material formed on the substrate during the plating process. Using information from the data points, values for the forward and reverse currents may be derived and provided to the plating chamber to execute the plating process.
    Type: Application
    Filed: October 28, 2024
    Publication date: February 13, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Charles Sharbono, Jing Xu, John L. Klocke, Sam K. Lee, Keith Edward Ypma
  • Publication number: 20250006519
    Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 2, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Kyle M. Hanson, Eric J. Bergman, Gregory J. Wilson, Paul R. McHugh, Benjamin Clay Bradley, Aaron Paul Juntunen, Deepak Saagar Kalaikadal, Daniel Durado, Carl Campbell Stringer, James Jay Tripp, Jason A. Rye, John L. Klocke
  • Publication number: 20240413011
    Abstract: A method of plating substrates may include receiving characteristics of a plating chamber and characteristics of a substrate to be placed in the plating chamber to be provided as inputs to a trained model. An inference operation using the trained model may be performed to generate a recipe for the plating chamber. The recipe may include characteristics of a forward plating current and characteristics of a reverse de-plating current that may be applied in order to add and remove metal to maintain co-planarity and pillar quality. The plating operation may be performed on the substrate using the recipe that was output from the trained model to cause a current to be applied to the plating liquid in the plating chamber to deposit a metal on exposed portions of the substrate, wherein the current comprises alternating cycles of the forward plating current; and the reverse de-plating current.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 12, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Jing Xu, John L. Klocke, Paul R. McHugh, Marvin L. Bernt
  • Patent number: 12146235
    Abstract: A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current. To determine the current characteristics, a model of a substrate may be simulated during the plating process to generate data points that relate characteristics of the plating process and a pattern on the substrate to a range nonuniformity of material formed on the substrate during the plating process. Using information from the data points, values for the forward and reverse currents may be derived and provided to the plating chamber to execute the plating process.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: November 19, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Charles Sharbono, Jing Xu, John L. Klocke, Sam K. Lee, Keith Edward Ypma
  • Patent number: 12116686
    Abstract: A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer, a second semiconductor processing station configured perform measurements indicative of a thickness of the material after the material has been deposited on the first semiconductor wafer, and a controller. The controller may be configured to receive the measurements from the second station; provide an input based on the measurements to a trained model that is configured to generate an output that adjusts an operating parameter of the first station such that the thickness of the material is closer to a target thickness; and causing the first station to deposit the material on a second wafer using the operating parameter as adjusted by the output.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: October 15, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, Adam Marc McClure, Paul R. McHugh, Gregory J. Wilson, John L Klocke
  • Patent number: 12104269
    Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: October 1, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson
  • Publication number: 20240160117
    Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).
    Type: Application
    Filed: April 2, 2021
    Publication date: May 16, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Dmitry LUBOMIRSKY, Kyle M. HANSON, Douglas A. BUCHBERGER, Jr., Alan L. TSO, Rahul KOZHIKKALKANDI, Paul R. MCHUGH, Jiayi SUN, Qiwei LIANG, Nithin Thomas ALEX, Lancelot HUANG, Ellie Y. YIEH
  • Patent number: 11982008
    Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
    Type: Grant
    Filed: January 24, 2023
    Date of Patent: May 14, 2024
    Assignee: APPLIED Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
  • Publication number: 20230411222
    Abstract: A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer and a chemical tank that provides liquid to the processing station during a deposition process. The chemical tank may provide measurements of characteristics of the liquid to a controller. The controller may be configured to receive the measurements from the chemical tank; provide an input based on the measurements to a trained model that is configured to generate an output that adjusts an operating parameter of the first station such that the thickness uniformity of the material is closer to a target thickness uniformity; and cause the first station to deposit the material on a second wafer using the operating parameter as adjusted by the output.
    Type: Application
    Filed: May 24, 2022
    Publication date: December 21, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Sam K. Lee, Paul R. McHugh
  • Publication number: 20230313405
    Abstract: Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.
    Type: Application
    Filed: April 3, 2023
    Publication date: October 5, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson, Kwan Wook Roh, Kyle M. Hanson, Forrest G. Reinhart, David J. Reis, James E. Brown, Nolan L. Zimmerman
  • Publication number: 20230313406
    Abstract: Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.
    Type: Application
    Filed: April 3, 2023
    Publication date: October 5, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Forrest G. Reinhart, Gregory J. Wilson, Kwan Wook Roh, Kyle M. Hanson, James E. Brown, David J. Reis
  • Publication number: 20230279576
    Abstract: A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current. To determine the current characteristics, a model of a substrate may be simulated during the plating process to generate data points that relate characteristics of the plating process and a pattern on the substrate to a range nonuniformity of material formed on the substrate during the plating process. Using information from the data points, values for the forward and reverse currents may be derived and provided to the plating chamber to execute the plating process.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 7, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Charles Sharbono, Jing Xu, John L. Klocke, Sam K. Lee, Keith Edward Ypma
  • Publication number: 20230257900
    Abstract: A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer, a second semiconductor processing station configured perform measurements indicative of a thickness of the material after the material has been deposited on the first semiconductor wafer, and a controller. The controller may be configured to receive the measurements from the second station; provide an input based on the measurements to a trained model that is configured to generate an output that adjusts an operating parameter of the first station such that the thickness of the material is closer to a target thickness; and causing the first station to deposit the material on a second wafer using the operating parameter as adjusted by the output.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 17, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Eric J. Bergman, Adam Marc McClure, Paul R. McHugh, Gregory J. Wilson, John L. Klocke
  • Patent number: 11697887
    Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: July 11, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Nolan L. Zimmerman, Charles Sharbono, Gregory J. Wilson, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal, Kyle M. Hanson
  • Publication number: 20230193504
    Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.
    Type: Application
    Filed: February 17, 2023
    Publication date: June 22, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Paul R. McHugh, Gregory J. Wilson
  • Publication number: 20230167573
    Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
    Type: Application
    Filed: January 24, 2023
    Publication date: June 1, 2023
    Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
  • Publication number: 20230092346
    Abstract: Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle may be include a plurality of ribs that extend upward from the first surface. The plurality of ribs may be arranged in a generally parallel manner about the first surface. The paddle may define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures may have a diameter of less than about 5 mm. The paddle may have an open area of less than about 15%.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Charles Sharbono, Paul R. McHugh, Gregory J. Wilson, John L. Klocke, Nolan L. Zimmerman