Abstract: Techniques are disclosed for using electrical impedance measurements to help determine whether a hypodermic needle has been inserted into the skin, thereby increasing the accuracy of information provided to the stakeholders and/or enabling other functionality based on the determination. This information can be used and/or combined with other information to help determine whether to administer the drug and/or whether the drug has been administered properly.

Abstract: Techniques are disclosed for providing a drug-dispensing device that tracks temperatures to which a drug stored therein is exposed, further providing means for indicating to a user that the drug has been exposed to temperatures outside a suitable temperature range and/or preventing the drug from being dispensed in such cases. According to some embodiments, an electrochromic element may be used to indicate the drug has been exposed to temperatures outside the suitable temperature range.

Abstract: Methods, systems, computer-readable media, and apparatuses for facilitating administering of medicine are disclosed.

Abstract: Techniques are disclosed for providing a flowmeter in a hypodermic needle device to measure the flow of a drug from a reservoir located within a hypodermic needle device through a needle assembly. In some embodiments a valve may be additionally provided to control the flow of the drug from a reservoir located within a hypodermic needle device through a needle assembly. Such functionality can help ensure the proper dosage is dispensed and/or determine when the drug is improperly dispensed.

Abstract: Disclosed herein are techniques for drug delivery measurement. A medicine delivery device includes a cartridge for storing a medicine, a needle assembly coupled to a bottom of the cartridge, a piston located in the cartridge for pushing the medicine to dispense the medicine from the cartridge through the needle assembly, and a sensor configured to measure a distance between the piston and the bottom of the cartridge. The sensor includes a triangulation-based distance measurement unit, a resonant frequency-based distance measurement unit, a time-of-flight-based distance measurement unit, or a frequency-modulated continuous-wave time-of-flight-based distance measurement unit.

Abstract: Methods, systems, computer-readable media, and apparatuses for facilitating administering of medicine are disclosed.

Abstract: Methods, systems, computer-readable media, and apparatuses for facilitating administering of medicine are disclosed.

Abstract: Disclosed herein are techniques for drug delivery measurement. A medicine delivery device includes a cartridge for storing a medicine, a needle assembly coupled to a bottom of the cartridge, a piston located in the cartridge for pushing the medicine to dispense the medicine from the cartridge through the needle assembly, and a sensor configured to measure a distance between the piston and the bottom of the cartridge. The sensor includes a triangulation-based distance measurement unit, a resonant frequency-based distance measurement unit, a time-of-flight-based distance measurement unit, or a frequency-modulated continuous-wave time-of-flight-based distance measurement unit.

Abstract: Disclosed are hypodermic needle devices with a dose dispensing mechanism and methods of using those hypodermic needle devices. The dose dispensing mechanism, which may be an electronically-controlled pump, may be used to measure out a specific dosage amount of a drug while compensating for environmental factors, such as temperature and pressure. This allows the device to be used by patients for self-administration since a specific dosage amount of the drug may be precisely delivered regardless of the environmental conditions at the time of delivery. The specific dosage amount may be set using the device or remotely, and a fingerprint sensor may be used to prevent injecting the drug into the wrong patient.

Abstract: Breathprint sensor systems for verifying the identity of a person using gases produced by the person are disclosed. The breathprint sensor systems include one or more sensors having first response characteristics to compounds in gases and one or more processors being configured to receive a set of test data provided by the one or more first sensors based on an exposure of the one or more first sensors to gases produced by a person and determine whether or not the set of test data verifies the identity of the person. Some aspects of the disclosure relate to a smart inhaler system using a breathprint sensor to assist in delivery of drugs to users through inhalation. Methods for operating breathprint sensor and smart inhaler systems and computer-readable media for implementing the methods are also disclosed.

Abstract: Breathprint sensor systems for verifying the identity of a person using gases produced by the person are disclosed. The breathprint sensor systems include one or more sensors having first response characteristics to compounds in gases and one or more processors being configured to receive a set of test data provided by the one or more first sensors based on an exposure of the one or more first sensors to gases produced by a person and determine whether or not the set of test data verifies the identity of the person. Some aspects of the disclosure relate to a smart inhaler system using a breathprint sensor to assist in delivery of drugs to users through inhalation. Methods for operating breathprint sensor and smart inhaler systems and computer-readable media for implementing the methods are also disclosed.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: A surface-mountable antenna that includes a severable portion is described.

Abstract: A method of forming an image sensor package includes wire bonding bond pads of an image sensor to interior traces on a substrate with bond wires. A first optically curable material is applied to enclose the bond wires. A second optically curable material is applied between a lid and the substrate. The first and second optically curable materials are cured through the lid with ultraviolet radiation. The first and second optically curable materials are cured rapidly without heating thus minimizing the fabrication cost of the image sensor package.

Abstract: Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

Abstract: A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.

Abstract: An optical module includes a window having an interior, e.g., first, surface. The interior surface includes a central region and a peripheral region. A first electronic component is coupled to the peripheral region. The optical module further includes a substrate and an image sensor coupled to the substrate. The window is coupled to the substrate such that the image sensor is aligned with the central region of the window.

Abstract: An image sensor package includes a substrate and an image sensor mounted to the substrate. Bond pads of the image sensor are wirebonded to interior traces on the substrate by bond wires. An encapsulant encloses the bond wires, the encapsulant being formed of a first optically curable material that has been cured. A lid adhesive mounts a lid to the substrate, the lid adhesive being formed of a second optically curable material that has been cured. During fabrication, the first and second optically curable materials are cured rapidly without heating to form the encapsulant and the lid adhesive, respectively, thus minimizing the fabrication cost of the image sensor package.