Abstract: Semiconductor packages including at least one semiconductor chip and at least one electronic discrete device, such as a transistor, oscillator, optical sensor, resistor, capacitor, or inductor, are disclosed. The semiconductor chip and the discrete device are electrically coupled to each other, and are encapsulated within a protective encapsulant material. The semiconductor chip and the discrete device are disposed either in an aperture through the substrate or in a pocket of the substrate, thereby allowing for a thin package, even where the discrete device is taller (e.g., 1.5 to 5 times taller) than the semiconductor chip and/or substrate.

Abstract: A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.