Abstract: A method for preventing migration of lubrication molecules into adjacent process chambers while coating a thin layer of lubricant over a storage surface of a disc using a vapor lubrication process. The method includes trapping the lubrication molecules that are not deposited onto the storage surface of the discs during the vapor lubrication process by using one or more cold traps including cold trapping surfaces in a vapor lubrication station.

Abstract: An apparatus for performing simultaneous pass-by vapor deposition of a uniform thickness thin film of a lubricant on at least one surface of each of a plurality of substrates, comprising: (a) chamber means having an interior space adapted to be maintained at a reduced pressure below atmospheric pressure, including entrance and exit means at opposite ends thereof; (b) at least one linearly extending vapor source means for supplying the interior space of the chamber with at least one linearly extending stream of lubricant vapor; (c) a substrate/workpiece mounting/supporting means adapted for supporting thereon a plurality of substrates/workpieces; and (d) a transporter/conveyor means for continuously moving the substrate/workpiece mounting/supporting means transversely past the at least one linearly extending stream of lubricant vapor for depositing a uniform thickness thin film of lubricant on the surfaces of each of a plurality of substrates/workpieces carried by the substrate/workpiece mounting/supportin

Abstract: A single, or common, ion beam source is utilized for ion beam deposition (IBD) of defect-free multilayer coatings, e.g., multilayer, carbon-based protective overcoats for magnetic and/or magneto-optical (MO) data recording/information storage and retrieval media such as hard disks. According to the inventive methodology, a plurality of source gas supply means for supplying a single IBD source with different source gases for each of the layers of the multilayer are selectively operated in “vent” and “run” modes by means of a plurality of valves, the opening and closing of which are determined by a programmable gas flow controller. The inventive method and apparatus advantageously provide IBD of multilayer coatings with minimum cross-contamination of individual layers, at a reduced equipment cost and size obtained by elimination of the need for separate ion beam sources and associated vacuum pump means for each constituent layer of the multilayer.

Abstract: Apparatus and method for vapor deposition of a uniform thickness thin film of lubricant on at least one surface of a disk-shaped substrate. The invention has particular utility in depositing thin films of polymeric lubricants onto disc-shaped substrates in the manufacture of magnetic and MO recording media.

Abstract: A single, or common, ion beam source is utilized for ion beam deposition (IBD) of defect-free multilayer coatings, e.g., multilayer, carbon-based protective overcoats for magnetic and/or magneto-optical (MO) data recording/information storage and retrieval media such as hard disks. According to the inventive methodology, a plurality of source gas supply means for supplying a single IBD source with different source gases for each of the layers of the multilayer are selectively operated in “vent” and “run” modes by means of a plurality of valves, the opening and closing of which are determined by a programmable gas flow controller. The inventive method and apparatus advantageously provide IBD of multilayer coatings with minimum cross-contamination of individual layers, at a reduced equipment cost and size obtained by elimination of the need for separate ion beam sources and associated vacuum pump means for each constituent layer of the multilayer.

Abstract: A system and method for sputtering using a plurality of different bias voltages, a plurality of target-cathodes that can be powered at different voltages disposed along said path of travel, and a controller configured to selectively vary the target-cathode voltage and the pallet bias voltage while the pallet moves along the path of travel. The target-cathodes are spaced apart along the path of travel by a distance less than a length of the pallet and on both sides of the path of travel. The controller can include a timing circuit for synchronizing changes in the target-cathode voltages with changes in the pallet bias voltage.

Abstract: Vapor deposition of a uniform thickness thin film of lubricant on at least one surface of a substrate, comprises the steps of: (a) providing an apparatus comprising: (i) a chamber having an interior space maintained below atmospheric pressure; (ii) a substrate loader/unloader for supplying the interior space with at least one substrate and for withdrawing at least one substrate from the interior space; (iii) at least one lubricant vapor source for supplying the interior space with a stream of lubricant vapor; and (iv) a substrate transporter/conveyor for continuously moving at least one substrate past the stream of vapor from the at least one lubricant vapor source; (b) supplying the interior space with a substrate having at least one surface; (c) continuously moving the substrate past the stream of lubricant vapor and depositing a uniform thickness thin film of the lubricant on the at least one surface; and (d) withdrawing the lubricant-coated substrate from the interior space.

Abstract: A sputtering apparatus for depositing layers of material onto a substrate includes a vacuum chamber, a first target and a second target positioned within the vacuum chamber. A source of power is placed in electrical communication with the first target and the second target. A switch alternately connects the source of power between the first target and the second target. The first target and the second target are different materials. The switch connects power to the first target when the transport mechanism positions the substrate near the first target and the switch connects power to the second target when the transport mechanism positions the substrate closer to the second target.

Abstract: A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fabricating multiple annular rings including each of the basic metal constituents of the desired alloy and attaching the annular rings to the cooling tube such that the exposed outer portions of the annular rings provide a homogeneous layer of the desired alloy on the non-planar substrates during sputtering.

Abstract: Selective deposition of a layer of a material, such as a thick protective overcoat, onto a selected substrate area, such as the inner or CSS landing zone, is achieved using a sputtering target assembly comprising a target/cathode having a planar sputtering surface including an erosion track area, a collimating shield positioned proximate the sputtering surface and surrounding at least a portion of the erosion track area, the collimating shield including an inwardly facing wall, and a blocking shield centrally positioned over the surface of the target/cathode and including an outwardly facing wall, wherein the inwardly facing wall of the collimating shield and the outwardly facing wall, wherein the inwardly facing wall of the collimating shield and the outwardly facing wall of the central blocking shield form an open-ended collimating channel for directing sputtered particles onto the selected substrate area.

Abstract: A method and apparatus to provide a substantially steady-state concentration of one or more molecular components, each molecular component having a different vapor pressure, to a vapor deposition chamber. Particularly, the method and apparatus will provide one or more molecular components whose concentration in the vapor deposition chamber, that is, whose weight average molecular weight does not vary with time by more than 50%, preferably by no more than 70%, during deposition of a particular lubricant.

Abstract: A collimator system is disclosed for use in an in-line pass-by sputtering system during the fabrication of recording media to improve the data storage density and read/write performance characteristics of the media. The collimator system includes a collimator shield and a collimator honeycomb. The shield includes a rectangular tube having a flange and a frame at inner and outer ends, respectively. The various components of the shield in part serve to prevent possible contamination of substrates due to target atom accumulation on the chamber walls during the sputtering process. The collimator honeycomb is provided for blocking target atoms from contacting the substrate at low incident angles. The collimator honeycomb is comprised of a plurality of collimators which are identical to each other. In a preferred embodiment, the collimators have a hexagonal cross-section taken from a perspective perpendicular to the substrate. The collimators may also have other geometric shapes.

Abstract: A sputtering target assembly for depositing onto a selected substrate area comprises a target/cathode having a planar sputtering surface including an erosion track area, a collimating shield positioned proximate to the sputtering surface, surrounding at least a portion of the erosion track area, and including an inwardly facing wall, and a blocking shield centrally positioned over the surface of the target/cathode and including an outwardly facing wall, wherein the inwardly facing wall of the collimating shield and the outwardly facing wall of the central blocking shield form an open-ended channel for directing sputtered particles onto the selected substrate area. A method for utilizing the target assembly for selectively depositing a thicker protective overcoat layer on the inner CSS or landing zone relative to the outer data zone of disk-shaped recording media is provided.

Abstract: A magnetically enhanced hollow cathode sputter source for providing a sputtered particle flux containing an increased proportion of ionized target material comprises a four-sided, box-shaped chamber open at the top and defining an interior space. Each of the interiorly facing surfaces of the chamber comprises the target material and a magnet means extends continuously around the exterior surface of the four vertical sides of the chamber for providing a sputtering plasma generated within the interior space with a racetrack-shaped electron Hall drift current. An electrically biasable substrate is positioned opposite the open top for receiving sputtered particle flux for deposition thereon.

Abstract: A sputtering apparatus for depositing layers of material onto a substrate includes a vacuum chamber, a first target and a second target positioned within the vacuum chamber. A source of power is placed in electrical communication with the first target and the second target. A switch alternately connects the source of power between the first target and the second target. The first target and the second target are different materials. The switch connects power to the first target when the transport mechanism positions the substrate near the first target and the switch connects power to the second target when the transport mechanism positions the substrate closer to the second target.

Abstract: A method for preventing migration of lubrication molecules into adjacent process chambers while coating a thin layer of lubricant over a storage surface of a disc using a vapor lubrication process. The method includes trapping the lubrication molecules that are not deposited onto the storage surface of the discs during the vapor lubrication process by using one or more cold traps including cold trapping surfaces in a vapor lubrication station.

Abstract: A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fabricating multiple annular rings including each of the basic metal constituents of the desired alloy and attaching the annular rings to the cooling tube such the exposed outer portions of the annular rings provide a homogeneous layer of the desired alloy on the non-planar substrates during sputtering.

Abstract: A method and apparatus for sputter deposition of metal alloys with improved compositional uniformity is provided, wherein a first, narrow width target is provided with a sputtering surface comprised of a metal alloy including metal elements having different angular distributions of sputtered atoms, and a wider width substrate having a deposition surface is moved past the sputtering surface, whereby the deposition surface traverses all arrival angles of the sputtered atoms thereby compensating for the different angular distributions of the sputtered atoms. The inventive methodology finds particular utility in the manufacture of magnetic and magneto-optical (MO) recording media.

Abstract: A method for depositing on a substrate surface a thin film layer comprising a target material comprises providing a cathode including a target having a sputtering surface comprised of the target material, with the target sputtering surface facing the substrate surface with a space therebetween, and sputtering the target material onto the substrate surface by applying a plurality of negative voltage pulses to the cathode while simultaneously applying a bias voltage to the substrate. Embodiments include depositing thin film layers onto static or moving substrates and application of constant or time-varying substrate bias voltage. The invention finds particular utility in the formation of high purity layers in the automated manufacture of magnetic data/information storage and retrieval media.

Abstract: Embodiments of the invention are directed to an etching apparatus for removing impurities from the surface of a substrate, such as a pallet and disc. Embodiments of the etching apparatus comprise a magnetic source, a cleaning chamber, a substrate transportation mechanism and a power source. The magnetic source is placed within the cleaning chamber, or vacuum chamber, which is configured to bombard the magnetic source with plasma. The substrate transportation mechanism resides within the cleaning chamber and is used to pull the pallet through the chamber between the spacing between the magnet towers. The power source, which is a DC source, is coupled to the pallet and produces an electric field which ionizes the plasma.