Patents by Inventor Paul Tervo
Paul Tervo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040061514Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 2, 2003Publication date: April 1, 2004Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Publication number: 20040027145Abstract: A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted about a central opening so that the probing needles or needles included therein terminate below the opening in a pattern suitable for probing a test subject workpiece. A plurality of pogo pin receiving pad sets, each including a guard pad, occupy the periphery of the board. Each guard pad is electrically connected to a trace from the layer of conductive traces. The pad sets may be connected to the probing devices by low noise cables or traces. Air trenches separate the pad sets for reducing cross talk and signal settling times.Type: ApplicationFiled: July 7, 2003Publication date: February 12, 2004Inventors: Paul A. Tervo, Clarence E. Cowan
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Publication number: 20040017214Abstract: A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted about a central opening so that the probing needles or needles included therein terminate below the opening in a pattern suitable for probing a test subject workpiece. A plurality of pogo pin receiving pad sets, each including a guard pad, occupy the periphery of the board. Each guard pad is electrically connected to a trace from the layer of conductive traces. The pad sets may be connected to the probing devices by low noise cables or traces. Air trenches separate the pad sets for reducing cross talk and signal settling times.Type: ApplicationFiled: March 13, 2003Publication date: January 29, 2004Inventors: Paul A. Tervo, Clarence E. Cowan
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Publication number: 20030205997Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: May 19, 2003Publication date: November 6, 2003Applicant: Cascade Microtech, Inc., an Oregon corporationInventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6642732Abstract: To reduce noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.Type: GrantFiled: December 2, 2002Date of Patent: November 4, 2003Assignee: Cascade Microtech, Inc.Inventors: Clarence E. Cowan, Paul A. Tervo, John L. Dunklee
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Patent number: 6636059Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: October 9, 2002Date of Patent: October 21, 2003Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20030132767Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.Type: ApplicationFiled: November 29, 2000Publication date: July 17, 2003Inventors: Paul A. Tervo, Kenneth R. Smith, Clarence E. Cowan, Mike P. Dauphinais, Martin J. Koxxy
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Publication number: 20030117157Abstract: A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted about a central opening so that the probing needles or needles included therein terminate below the opening in a pattern suitable for probing a test subject workpiece. A plurality of pogo pin receiving pad sets, each including a guard pad, occupy the periphery of the board. Each guard pad is electrically connected to a trace from the layer of conductive traces. The pad sets may be connected to the probing devices by low noise cables or traces. Air trenches separate the pad sets for reducing cross talk and signal settling times.Type: ApplicationFiled: December 6, 2002Publication date: June 26, 2003Inventors: Paul A. Tervo, Clarence E. Cowan
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Patent number: 6559668Abstract: A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted about a central opening so that the probing needles or needles included therein terminate below the opening in a pattern suitable for probing a test subject workpiece. A plurality of pogo pin receiving pad sets, each including a guard pad, occupy the periphery of the board. Each guard pad is electrically connected to a trace from the layer of conductive traces. The pad sets may be connected to the probing devices by low noise cables or traces. Air trenches separate the pad sets for reducing cross talk and signal settling times.Type: GrantFiled: January 24, 2000Date of Patent: May 6, 2003Assignee: Cascade Microtech, INCInventors: Paul A. Tervo, Clarence E. Cowan
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Publication number: 20030080765Abstract: To reduce noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.Type: ApplicationFiled: December 2, 2002Publication date: May 1, 2003Inventors: Clarence E. Cowan, Paul A. Tervo, John L. Dunklee
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Publication number: 20030057979Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 17, 2002Publication date: March 27, 2003Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Publication number: 20030048110Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: October 9, 2002Publication date: March 13, 2003Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6512391Abstract: To reduce noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.Type: GrantFiled: June 24, 2002Date of Patent: January 28, 2003Assignee: Cascade Microtech, Inc.Inventors: Clarence E. Cowan, Paul A. Tervo, John L. Dunklee
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Patent number: 6492822Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 30, 2001Date of Patent: December 10, 2002Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 6486687Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: February 6, 2002Date of Patent: November 26, 2002Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20020167329Abstract: To reduce noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.Type: ApplicationFiled: June 24, 2002Publication date: November 14, 2002Inventors: Clarence E. Cowan, Paul A. Tervo, John L. Dunklee
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Patent number: 6445202Abstract: The chuck of a probe station is shielded from capacitive currents generated by fluctuation of the power to the thermal unit of a thermal chuck. The thermal chuck includes a chuck for supporting a device under test; a thermal unit for modifying the temperature of the chuck and a conductive member capacitively coupled to but free from direct electrical connection to the thermal unit. The conductive member is electrically connected to the controller supplying power to the thermal units. The conductive member intercepts substantially all of the capacitive currents emanating from the operation of the thermal unit and provides a conductive path to return these currents to the controller. An extension of the probe station's conductive environmental enclosure is capacitively coupled to the conductive member so as to intercept capacitive currents emanating from the conductive member and conduct these currents to ground outside of the environmental enclosure.Type: GrantFiled: June 30, 1999Date of Patent: September 3, 2002Assignee: Cascade Microtech, Inc.Inventors: Clarence E. Cowan, Paul A. Tervo, John L. Dunklee
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Publication number: 20020093353Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: February 6, 2002Publication date: July 18, 2002Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6380751Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: June 20, 2001Date of Patent: April 30, 2002Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20020043981Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 30, 2001Publication date: April 18, 2002Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner