Abstract: A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Abstract: A projection display may include a spatial light modulator that receives light from a light source via an analog modulator. The analog modulator may be a liquid crystal device. The bit depth may be increased by modulating the light from the lamp, for example to account for different pixel luminance levels.

Abstract: A projection display system may use a microdisplay that has pixels that are dedicated to only one narrow wavelength band. A suitable optical filter for each primary display color may be formed from a small number of optical layers, taking advantage of both the rounded profile and narrow range of the emission peaks in a typical projection light source. Thus, groups of pixels may be dedicated to each wavelength band of the display. A planarization layer may be coated on dichroic filter elements that are applied to a cover glass to provide the dedicated wavelengths for each pixel. The planarization layer may smooth out any surface irregularities resulting from the deposition of the dichroic layers on the cover glass.

Abstract: A technique includes pulse width modulating a beam of a light to establish a pixel intensity. The technique includes controlling a light source to modulate an illumination of the beam to create different tonal resolution ranges for the pixel intensity.

Abstract: A lamp synchronization signal may be used in an LCOS imaging environment, such as a projection system.

Abstract: A technique includes pulse width modulating an illuminating beam of a light to establish a pixel intensity and modulating the illuminating beam to create different tonal resolution ranges for the pixel intensity.

Abstract: A compensator for a display may include a diffraction grating formed by making grooves in the surface of a glass plate. In some embodiments, the diffraction grating acting as a wave plate may be separate from the light engine and in other embodiments, it may be integrated into the cover glass of the light engine.

Abstract: A method and apparatus for rapid prototyping and fabrication of passivated microfluidic structures is disclosed. The method and apparatus may be used to fabricate and passivate the channel in one system.

Abstract: A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further includes passivating the embedded microfluidic structure by locally heating the microfluidic structure surface in a reactive atmosphere, wherein the passivated microfluidic structure is suitable for transporting a fluid.

Abstract: A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Abstract: A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.

Abstract: A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Abstract: By measuring the quiescent current of optical display elements, such as liquid crystal on silicon optical displays, an automated test may be implemented to determine device functionality. As a result, the costs associated with conventional optical or machine vision testing may be substantially reduced.

Abstract: A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Abstract: A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.

Abstract: An apparatus for fabricating encapsulated micro-channels in a substrate is described. The apparatus includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access windows are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access windows, the one or more micro-channels are formed within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access windows along the dimensions of the desired micro-channels. Accordingly, the apparatus is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the apparatus enables the rapid prototyping of integrated circuits.

Abstract: A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.

Abstract: A method for fabricating encapsulated micro-channels in a substrate is described. The method includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access holes are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access holes, the one or more micro-channels are formed, via the access holes, within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access holes along the dimensions of the desired micro-channels. Accordingly, the method is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the method enables the rapid prototyping of integrated circuits.

Abstract: A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Abstract: In one embodiment, the present invention includes a method including the following acts. A light source is scanned over a surface of an integrated circuit. A photo-induced current is measured from a fiducial in the integrated circuit. The current is correlated to a position of the light source as the scanning progresses.