Abstract: A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.

Abstract: An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.

Abstract: A parallel optical communications module includes a top lens and a bottom lens that are spaced from one another to inhibit mechanical forces acting upon the top lens from being transferred to the bottom lens, which is optically aligned with an opto-electronic light source or light detector. The top lens has a reflector portion configured to redirect the optical signals between the bottom lens and one or more optical fibers.

Abstract: An optical communications module is provided with a moving pin latching/delatching system that includes an elongated pull tab that is easily accessible and a latch base having a proximal end that is mechanically coupled to a distal end of the pull tab. The latch base has a latch locking pin disposed on a distal end thereof for engaging a latch opening of a cage when the module is mated with the cage and the latch base is in the latched position. When a pull force of sufficient magnitude is exerted on the pull tab in a direction away from the cage parallel to a longitudinal axis of the pull tab, the latch base is moved from a latched position to a delatched position, which causes the pin to move from an extended position to a retracted position in which the pin is disengaged from the opening of the cage.

Abstract: A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

Abstract: In some aspects, the invention teaches pharmaceutical compositions that include a TGF-beta ligand trap, and methods of using a TGF-beta ligand trap to treat, prevent, or reduce the progression rate of pulmonary hypertension (PH). The invention also provides methods of using a TGF-beta ligand trap to treat, prevent, or reduce the progression rate of a variety of conditions including, but not limited to, pulmonary vascular remodeling, pulmonary fibrosis, right ventricular hypertrophy, diseases associated with excessive TGF-beta signaling, diseases associated with excessive GDF15 signaling, and diseases associated with excessive PAI-1 signaling. The invention further provides methods of using a TGF-beta ligand trap to reduce right ventricular systolic pressure in a subject.

Abstract: An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Abstract: An optical communications module includes a housing that accommodates at least one optical receptacle having a cylindrical connector portion. The module further includes at least one deformable constraining member made of a material having a Young's modulus that allows the deformable constraining member to take on an initial deformity upon application of a compression force, but permits only a partial reversal of the deformity upon reduction or removal of the compression force. The initial deformity is created when the deformable constraining member is pressed against the cylindrical connector portion during assembly of the module. The initial deformity includes a deformed contour portion that conforms to at least a part of the cylindrical connector portion of the optical receptacle and prevents wiggling of the cylindrical connector portion after the cylindrical connector portion is pushed during assembly into an alignment notch provided in a lower housing portion of the module.

Abstract: An optical communications module includes a module housing, a printed circuit board (PCB), a device mounting block, at least one opto-electronic device, at least one signal processing integrated circuit (IC), and a top lens device. The opto-electronic device is mounted on the device mounting block. An upper surface of the signal processing IC has a signal contact array in electrical contact with a corresponding signal pad array on the PCB lower surface. The top lens device has a fiber port configured to communicate optical signals with a fiber-optic cable at the forward end of the module housing, a device port configured to communicate the optical signals with the opto-electronic device, and a reflector portion configured to redirect the optical signals at a non-zero angle between the fiber port and the device port.

Abstract: A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

Abstract: A parallel optical communications module includes a top lens and a bottom lens that are spaced from one another to inhibit mechanical forces acting upon the top lens from being transferred to the bottom lens, which is optically aligned with an opto-electronic light source or light detector. The top lens has a reflector portion configured to redirect the optical signals between the bottom lens and one or more optical fibers.

Abstract: In a method for making an optical communications module, elements in the optical signal path are aligned relative to a lens mounting frame. The frame is attached to the surface of a printed circuit board. The frame bears fiducial markings. An opto-electronic device is then aligned relative to the frame using the fiducial markings. One or more bottom lens devices are aligned relative to the lens mounting frame using the fiducial markings. Finally, a top lens device is attached to the lens mounting frame over the bottom lens devices.

Abstract: An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Abstract: An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Abstract: A flexible dust cover is provided for use with a parallel optical communications module for preventing airborne matter, such as dirt, dust, and gases from entering the module. The flexible dust cover fits snugly to the module to protect components of the module and the optical pathways of the module from airborne matter. The flexible dust cover has an elasticity that allows it to be temporarily deformed from its original shape to a stretched state by application of a stretching force to enable the module to be inserted into a central opening formed in the cover. The force is then removed, causing the cover to attempt to return to its original, non-stretched shape. When this happens, interior surfaces of the cover form a snug fit about exterior surfaces of the module. This snug fit fills in air gaps in the module that would otherwise be exposed to the environment.