Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Abstract: An optical transceiver module is provided with an elongated delatching pull tab that that enables an optical transceiver module to be easily delatched and pulled from a cage without having to first unplug optical fiber cables from the module and without having to rotate a bail. Thus, the number of manual actions that need to be performed by a user to remove the module from a cage is drastically reduced, which makes simplifies the removal process and makes the design well suited for use in hot-pluggable environments. In addition, the delatching pull tab obviates the need for pins or screws, thereby improving manufacturing yield by reducing the likelihood that the module will be damaged during the manufacturing process. In addition, by eliminating pins or screws and a bail from the design, there are fewer moving parts that can wear out over time.

Abstract: An opto-electronic communication module includes a housing, an electro-optical assembly, and a retainer that helps maintain alignment of an optical port. The electro-optical assembly includes a circuit substrate, an opto-electronic communication device mounted on the circuit substrate, and an optics module having an optical connection portion extending into the opening of the housing to define the optical port. The retainer can be, for example, a clip that contacts the housing and fits over the optical connection portion of the optics module to maintain the optical connection portion in alignment with the opening of the housing.

Abstract: A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: A flexible dust cover is provided for use with a parallel optical communications module for preventing airborne matter, such as dirt, dust, and gases from entering the module. The flexible dust cover fits snugly to the module to protect components of the module and the optical pathways of the module from airborne matter. The flexible dust cover has an elasticity that allows it to be temporarily deformed from its original shape to a stretched state by application of a stretching force to enable the module to be inserted into a central opening formed in the cover. The force is then removed, causing the cover to attempt to return to its original, non-stretched shape. When this happens, interior surfaces of the cover form a snug fit about exterior surfaces of the module. This snug fit fills in air gaps in the module that would otherwise be exposed to the environment.

Abstract: An opto-electronic communication module includes a housing, an electro-optical assembly, and a retainer that helps maintain alignment of an optical port. The electro-optical assembly includes a circuit substrate, an opto-electronic communication device mounted on the circuit substrate, and an optics module having an optical connection portion extending into the opening of the housing to define the optical port. The retainer can be, for example, a clip that contacts the housing and fits over the optical connection portion of the optics module to maintain the optical connection portion in alignment with the opening of the housing.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: Methods and apparatuses are provided for preventing flex circuits of optical transceiver modules from being damaged during the process of manufacturing and assembling the optical transceiver modules. Preventing the flex circuits from being damaged during the manufacture and assembly processes increases yield and decreases costs. In addition, the methods and apparatuses that are used to prevent the flex circuits from being damaged also allow the processes of forming the mechanical bends and inserting the modules into their respective housings to be automated. Automating these processes further increases yield and decreases costs.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Abstract: An optical transceiver module is provided with an elongated delatching pull tab that that enables an optical transceiver module to be easily delatched and pulled from a cage without having to first unplug optical fiber cables from the module and without having to rotate a bail. Thus, the number of manual actions that need to be performed by a user to remove the module from a cage is drastically reduced, which makes simplifies the removal process and makes the design well suited for use in hot-pluggable environments. In addition, the delatching pull tab obviates the need for pins or screws, thereby improving manufacturing yield by reducing the likelihood that the module will be damaged during the manufacturing process. In addition, by eliminating pins or screws and a bail from the design, there are fewer moving parts that can wear out over time.

Abstract: An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A consumer input/output (CIO) optical transceiver module, an active optical cable that incorporates a CIO optical transceiver module, and a method for using a CIO optical transceiver module in an active optical cable are provided. In contrast to optical transceiver modules currently used in active optical cables, which utilize parallel arrays of laser diodes and parallel arrays of photodiodes, the CIO optical transceiver module includes two singlet laser diodes and two singlet photodiodes for providing two high-speed transmit channels and two high-speed receive channels, respectively. Because the singlet laser diodes and photodiodes of the CIO optical transceiver module are less costly than the parallel arrays of laser diodes and parallel arrays of photodiodes that are used in known active optical cables, the CIO optical transceiver module can be manufactured at relatively low costs with high quality, and therefore is well suited for consumer applications.

Abstract: A lens device has a body with a base surface, a plurality of lenses on the base surface, and a plurality of projections extending above the base surface and defining a protective plane above the plurality of lenses. The plurality of projections can include, for example, post-like regions, ridge-like regions, or a combination thereof.

Abstract: A lens device has a body with a base surface, a plurality of lenses on the base surface, and a plurality of projections extending above the base surface and defining a protective plane above the plurality of lenses. The plurality of projections can include, for example, post-like regions, ridge-like regions, or a combination thereof.

Abstract: A consumer input/output (CIO) optical transceiver module, an active optical cable that incorporates a CIO optical transceiver module, and a method for using a CIO optical transceiver module in an active optical cable are provided. In contrast to optical transceiver modules currently used in active optical cables, which utilize parallel arrays of laser diodes and parallel arrays of photodiodes, the CIO optical transceiver module includes two singlet laser diodes and two singlet photodiodes for providing two high-speed transmit channels and two high-speed receive channels, respectively. Because the singlet laser diodes and photodiodes of the CIO optical transceiver module are less costly than the parallel arrays of laser diodes and parallel arrays of photodiodes that are used in known active optical cables, the CIO optical transceiver module can be manufactured at relatively low costs with high quality, and therefore is well suited for consumer applications.

Abstract: An active optical cable is provided that is well suited for consumer applications. In contrast to known Quad Small Form-Factor Pluggable (QSFP) active optical cables, the active optical cable incorporates at least one consumer input/output (CIO) optical transceiver module that is well suited for consumer applications. The plug housing of the known QSFP active optical cable has been modified to house at least one CIO optical transceiver module that utilizes laser diode and photodiode singlets, rather than the parallel laser diode and photodiode arrays used in the known QSFP active optical cables. These features reduce the overall cost of the active optical cable and make it well suited for consumer applications.

Abstract: A method for delaying an air purge of a fuel cell stack at system shut-down until the temperature of the stack is reduced below a predetermined temperature. The fuel cell stack includes an anode side, a cathode side, an anode input, a cathode input and an anode exhaust. A temperature sensor monitors the temperature of a cooling fluid flowing through the stack. The anode side of the fuel cell stack is purged at the stack shut-down by directing air from the cathode input line to the anode input line after the temperature of the cooling fluid is reduced to the predetermined temperature.