Abstract: Systems and methods related to quality and permission controlled request qualification is provided. These systems and methods include receiving a user request, wherein the user request is a natural language request, and wherein the request includes a credential token. The request is then validated in a first trusted computing environment, wherein the validation utilizes the credential token to determine if the user request is rejected or approved. When the user request is approved, the user request is qualified to a qualified request by matching the user request to one of a plurality of templates. Additionally, an algorithm is applied to protected information responsive to the qualified request in a separate second trusted computing environment. In yet a third trusted computing environment the output from applying the algorithm to the protected information is validated to generate a final validation report.

Abstract: Systems and methods related to the generation of a hypothesis is presented. First a user inputs at least one research paper or study. The at least one research paper or study is mined by an AI algorithm for a set of data requirements. The set of data requirements may be combined with a tailored prompt into a generative AI system to generate a data specification. Next, within a secure enclave, the data specification may be combined with natural language (NL) prompts to interrogate data sets from a plurality of data stewards. A data set from the interrogated data sets that meets the data specification is selected. The data set is then encrypted, used to generate and train an AI model.

Abstract: Systems and methods related to the generation and application of dynamic policies in a zero-trust computing environment are provided. In some embodiments, the method of dynamic policy application comprises receiving a query. Data and an algorithm are then processed in response to the query on a runtime server within a trusted computing environment to generate a result. A dynamic outbound policy is generated responsive to a data steward. It is used to validate the result. The result may be shared as output when the result meets the criteria of the dynamic outbound policy, otherwise the result may be rejected when the result fails to meet the criteria of the dynamic outbound policy. In addition to the dynamic outbound policy, the query may also be subjected to an inbound policy. This process may all occur in an iterative way within a Jupyter Notebook environment.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: Systems and methods for distributed key generation is provided. In some embodiments, a public key and a private key are generated using elliptical curve cryptography (ECC) at a group of trusted parties. In some cases, an elliptical curve digital signature algorithm may be employed. Each party also generates a commitment and a blinding factor. The blinding factor may be a randomized polynomial integer. The parties use the commitments from the other parties to validate the public keys before receipt and combining the public keys into a group/aggregate public key. Content encryption keys (CEK) are then encrypted at each of the trusted parties using these aggregate public keys to generate wrapped content encryption keys (WCEK). Private keys are sharded and a sharded private key is generated at each party using the pieces of shards received by the trusted party. Subsequently, criteria may be received that allows for the release of these sharded private keys back to a trusted environment/enclave.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A stylus input device can allow a user to interface with an external electronic device. The stylus can provide an additional or alternative input to the external electronic device in response to a user applying a compressive force to the device housing. The stylus can include multiple sensors to provide a signal in response to the compressive force applied to the stylus.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Abstract: Systems and methods for providing a user interface (UI) between an air traffic control transcription (ATCT) page on a portable device and a destination avionics system. The method includes parsing ATC messages into a target avionic system and respective avionic data, mapping the target avionic system to a destination avionic system, and rendering a target UI button on the ATCT page. The method displays a data preview window with the respective avionic data and a GUI object representing each of one or more destination avionic systems, which, when selected, causes the avionic data to be sent to the selected destination avionic system. The method also enables user activity on a cockpit display page to update the ATCT page with relevant updates.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A stylus input device can allow a user to interface with an external electronic device. The stylus can provide an additional or alternative input to the external electronic device in response to a user applying a compressive force to the device housing. The stylus can include multiple sensors to provide a signal in response to the compressive force applied to the stylus.

Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.