Abstract: The invention provides a wafer-level package for a micromirror array. The wafer-level package includes a substrate including a wafer having a substrate surface with a plurality of actuatable micromirrors coupled to the substrate surface. An optical window is attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface. A beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity.

Abstract: The invention provides a micromirror for directing a beam of light. The micromirror includes a mirror plate movably coupled to a substrate and a lower reinforcement rib connected to a lower surface of the mirror plate. The lower reinforcement rib is formed in a rib trench within the substrate when at least a portion of the mirror plate is formed. The lower reinforcement rib reinforces the mirror plate to minimize mirror plate curvature. A system for directing a beam of light and a method of fabricating a reinforced micromirror is also disclosed.

Abstract: An optical switching core is disclosed that includes a plurality of input optical tiles and output optical tiles for directing optical beams between various input and output ports coupled to optical fibers. Each of the optical tiles includes a collimating optics array for transmitting a plurality of incoming optical beams and a transparent beam directing array optically coupled to said collimating optics array for redirecting said plurality of incoming optical. Two or more optical tiles are rotated about an optical axis with respect to one another to provide a compact, modular design. Drive electronics may be incorporated on tile or off tile to control the beam directing devices.

Abstract: An optical switching core is disclosed that includes a plurality of beam directing devices coupled to a substrate for redirecting a plurality of incoming optical beams to at least one of a plurality of output ports. The substrate includes a plurality of electrical conductors electrically coupled to the plurality of beam directing devices.