Abstract: A semiconductor device includes a bridge carrier, a first die, a second die, a first encapsulant, a cap carrier, a third die, and a second encapsulant. The bridge carrier includes a carrier substrate and a bridge redistribution structure disposed on the carrier substrate. The first die and the second die are disposed side by side on the bridge carrier. The bridge redistribution structure electrically connects the first die and the second die. The first encapsulant laterally encapsulates the first die and the second die. The cap carrier is disposed over the first die and the second die. The third die is located between the first die and the cap carrier. The second encapsulant laterally encapsulates the third die.

Abstract: A current regulation system includes a current regulation module and a current distribution module. The current regulation module is coupled to a first power source and a second power source. The current regulation module is configured to derive a first current from the first power source, and derive a second current from the second power source when coupled to a load. The current distribution module is coupled to the first power source, the second power source and the current regulation module. The current distribution module makes the current regulation module regulate the first current and the second current according to a first electric quantity of the first power source and second electric quantity of the second power source.

Abstract: A voltage control system includes a first voltage converter, a second voltage converter and a voltage monitoring module. The first voltage converter is coupled to a first power source and configured to convert first electrical energy of the first power source into a first output voltage. The second voltage converter is coupled to a second power source and configured to convert second electrical energy of the second power source into a second output voltage. The voltage monitoring module is coupled to the first voltage converter and the second voltage converter. The voltage monitoring module is configured to regulate the first output voltage or the second output voltage by controlling the first voltage converter and the second voltage converter according to the first output voltage and the second output voltage.

Abstract: A current regulation system includes a current regulation module and a current distribution module. The current regulation module is coupled to a first power source and a second power source. The current regulation module is configured to derive a first current from the first power source, and derive a second current from the second power source when coupled to a load. The current distribution module is coupled to the first power source, the second power source and the current regulation module. The current distribution module makes the current regulation module regulate the first current and the second current according to a first electric quantity of the first power source and second electric quantity of the second power source.

Abstract: A voltage control system includes a first voltage converter, a second voltage converter and a voltage monitoring module. The first voltage converter is coupled to a first power source and configured to convert first electrical energy of the first power source into a first output voltage. The second voltage converter is coupled to a second power source and configured to convert second electrical energy of the second power source into a second output voltage. The voltage monitoring module is coupled to the first voltage converter and the second voltage converter. The voltage monitoring module is configured to regulate the first output voltage or the second output voltage by controlling the first voltage converter and the second voltage converter according to the first output voltage and the second output voltage.

Abstract: A method of forming an integrated circuit includes forming at least one opening through a first surface of a substrate. The method further includes forming at least one conductive structure in the at least one opening. The method further includes removing a portion of the substrate to form a processed substrate having the first surface and a second surface opposite the first surface and to expose a portion of the at least one conductive structure adjacent to the second surface. The at least one conductive structure continuously extending from the first surface through the processed substrate to the second surface of the processed substrate, at least one sidewall of the at least one conductive structure spaced from a sidewall of the at least one opening by an air gap.

Abstract: Apparatus, and methods of manufacture thereof, in which metal is deposited into openings, thus forming a plurality of metal pads, a plurality of through-silicon-vias (TSVs), a plurality of metal lines, a plurality of first dummy structures, and a plurality of second dummy structures. Ones of the plurality of first dummy structures each have a first width that is at least about three times greater than a second width of each of the plurality of metal lines, and ones of the plurality of second dummy structures each have a third width that is at least about five times greater than the second width of each of the plurality of metal lines.

Abstract: Apparatus, and methods of manufacture thereof, in which metal is deposited into openings, thus forming a plurality of metal pads, a plurality of through-silicon-vias (TSVs), a plurality of metal lines, a plurality of first dummy structures, and a plurality of second dummy structures. Ones of the plurality of first dummy structures each have a first width that is at least about three times greater than a second width of each of the plurality of metal lines, and ones of the plurality of second dummy structures each have a third width that is at least about five times greater than the second width of each of the plurality of metal lines.

Abstract: Apparatus, and methods of manufacture thereof, in which metal is deposited into openings, thus forming a plurality of metal pads, a plurality of through-silicon-vias (TSVs), a plurality of metal lines, a plurality of first dummy structures, and a plurality of second dummy structures. Ones of the plurality of first dummy structures each have a first width that is at least about three times greater than a second width of each of the plurality of metal lines, and ones of the plurality of second dummy structures each have a third width that is at least about five times greater than the second width of each of the plurality of metal lines.

Abstract: Apparatus, and methods of manufacture thereof, in which metal is deposited into openings, thus forming a plurality of metal pads, a plurality of through-silicon-vias (TSVs), a plurality of metal lines, a plurality of first dummy structures, and a plurality of second dummy structures. Ones of the plurality of first dummy structures each have a first width that is at least about three times greater than a second width of each of the plurality of metal lines, and ones of the plurality of second dummy structures each have a third width that is at least about five times greater than the second width of each of the plurality of metal lines.

Abstract: A method of forming an integrated circuit includes forming at least one opening through a first surface of a substrate. The method further includes forming at least one conductive structure in the at least one opening. The method further includes removing a portion of the substrate to form a processed substrate having the first surface and a second surface opposite the first surface and to expose a portion of the at least one conductive structure adjacent to the second surface. The at least one conductive structure continuously extending from the first surface through the processed substrate to the second surface of the processed substrate, at least one sidewall of the at least one conductive structure spaced from a sidewall of the at least one opening by an air gap.

Abstract: An integrated circuit includes a substrate having a first surface and a second surface. At least one conductive structure continuously extends through the substrate. At least one sidewall of the at least one conductive structure is spaced from a sidewall of the substrate by an air gap.

Abstract: An integrated circuit includes a substrate having a first surface and a second surface. At least one conductive structure continuously extends through the substrate. At least one sidewall of the at least one conductive structure is spaced from a sidewall of the substrate by an air gap.

Abstract: A camera module includes a barrel for receiving at least a first lens, an actuator, and a holder. The actuator includes an annular stator and a carrying member. The stator is connected to the barrel and defines a plurality of spaced parallel inner branches in an inner side thereof. The carrying member is received in the stator and defines a through hole therein for receiving at least a second lens. The carry member defines a plurality of spaced parallel outer branches in the outer sidewall thereof. The outer branches are alternately interleaved between the inner branches and have a voltage thereacross for driving the carrying member to move forward and backward. The holder is connected to the barrel and configured for receiving the barrel and the actuator.

Abstract: The present disclosure provides a focus module including a substrate, a holder, at lease one second magnet, a frame and an elastic element. The substrate includes at least one first magnet and an aperture. The frame is fixed on the substrate and defining a hole receiving the holder. The second magnet is fixed on the holder. At least one of the first magnet and the second magnet is an electromagnet. The elastic element includes a first end, a second end, and at least one U-shape bend connected the first and second ends. The first end is fixed on the side surface of the holder. The second end is fixed on the inner surface of the hole. The two sides of the U-shape bend are parallel to the side surface of the holder and the inner surface of the hole. The present invention also provides a method for manufacturing the focus module.

Abstract: A flash device includes a flash module and a color wheel. The flash module includes a flash lamp and a trigger circuit for triggering the flash lamp. The color wheel includes a color filter disk. The color filter disk includes a number of filter segments, wherein each of the filter segments is capable of being inserted into the light-emitting path of the flash lamp by rotation the color filter disk.

Abstract: The present disclosure provides a focus module including a substrate, a holder, at lease one second magnet, a frame and an elastic element. The substrate includes at least one first magnet and an aperture. The frame is fixed on the substrate and defining a hole receiving the holder. The second magnet is fixed on the holder. At least one of the first magnet and the second magnet is an electromagnet. The elastic element includes a first end, a second end, and at least one U-shape bend connected the first and second ends. The first end is fixed on the side surface of the holder. The second end is fixed on the inner surface of the hole. The two sides of the U-shape bend are parallel to the side surface of the holder and the inner surface of the hole. The present invention also provides a method for manufacturing the focus module.

Abstract: A lens holder coupling a lens to an actuator is disclosed. The actuator includes a vibrator and a driving rod coupled to the vibrator along a vibration direction of the vibrator. The lens holder includes a lens carrier, a transmission member, a guiding member, and a fixing member. The lens carrier is configured for accommodating the lens. The transmission member connected to the lens carrier defines a groove having a transmission axis parallel to an optical axis of the lens receiving the driving rod. The guiding member connected to the lens carrier defines a hole receiving a guide rod substantially parallel to the optical axis of the lens. The fixing member includes a main body and an elastic sheet, the main body being fixed to the transmission member, the elastic sheet extending from the main body and covering the groove and configured for elastically contacting the driving rod.

Abstract: A lens holder coupling a lens to an actuator is disclosed. The actuator includes a vibrator and a driving rod coupled to the vibrator along a vibration direction of the vibrator. The lens holder includes a lens carrier, a transmission member, a guiding member, and a fixing member. The lens carrier is configured for accommodating the lens. The transmission member connected to the lens carrier defines a groove having a transmission axis parallel to an optical axis of the lens receiving the driving rod. The guiding member connected to the lens carrier defines a hole receiving a guide rod substantially parallel to the optical axis of the lens. The fixing member includes a main body and an elastic sheet, the main body being fixed to the transmission member, the elastic sheet extending from the main body and covering the groove and configured for elastically contacting the driving rod.

Abstract: A flash device includes a flash module and a color wheel. The flash module includes a flash lamp and a trigger circuit for triggering the flash lamp. The color wheel includes a color filter disk. The color filter disk includes a number of filter segments, wherein each of the filter segments is capable of being inserted into the light-emitting path of the flash lamp by rotation the color filter disk.