Abstract: A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect.

Abstract: A light source module includes a base, at least one light emitting diode device, a reflector and a transparent plate. The light emitting diode device is arranged on the base. The reflector is arranged on the base and around the light emitting diode device. The transparent plate is arranged on the reflector and forms a plurality of Fresnel lens portions facing the light emitting diode device. The Fresnel lens portions are aligned along a predetermined direction. The invention further provides a street lamp having the abovementioned light source module.

Abstract: A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly.

Abstract: A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect.

Abstract: An LED lamp with lower manufacturing costs is disclosed. The LED lamp includes a lamp set, a plurality of light-emitting modules and a transparent cover. The lamp set having an accommodating space is a barlike body composed of a lampshell and two covers. The lampshell is constituted by two lateral lampshells and one middle lampshell connected therebetween. The lateral lampshells and the middle lampshell are connected together by a fixing structure. The two covers seal the front and rear sides of the lamp set separately. Furthermore, plural light-emitting modules are installed on the interior surface of the lampshell, and the transparent cover is fixed to cover the lamp set.

Abstract: An LED lamp with heat dissipation mechanism having double heat pipe and tridimensional LEDs arrangement is disclosed. The lamp is composed of a heat-dissipation unit, a heat pipe whose one end is mounted on the heat-dissipation unit, a plurality of LED units mounted on an outer surface of the heat pipe, a fin module encompassing the heat-dissipation unit and a reflector mounted on a bottom of the heat-dissipation unit. The heat-dissipation unit has two basin-like casings. The LED units on the heat pipe are towards the reflector. Thus the reflector concentrates the light from the LED units.

Abstract: A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board includes an insulating heat-conductive material, and a conductive circuit layer provided on a surface of the insulating heat-conductive material and formed of a plurality of sections of circuits.

Abstract: A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: A light emitting diode (LED) lighting set includes an aluminum extrusion radiating base, an LED module, a light focus plate, a diaphanous cover and two electrical connectors. The LED module has a substrate settled onto the radiating base and a plurality of LED lamps electrically connected onto the substrate. The light focus plate is fixed onto the radiating base and correspondingly formed under the LED lamps. The diaphanous cover connects the radiating base and correspondingly formed under the light focus plate. The electrical connectors separately connect two ends of the radiating base and also electrically connect the substrate. The aluminum extrusion radiating base, the diaphanous cover and the two electrical connectors define a closed space together, and the LED module and the light focus plate are received in the closed space; therefore, the LED lighting set has good heat dissipating performance and the usage life-span is greatly improved.

Abstract: An illumination device of a lamp base improvement of a street lamp to change the projection direction is disclosed. A lamp base formed a plurality of brackets inside. Bottoms of the brackets are longitudinally set to be slanted. Lighting modules corresponding to the brackets are disposed along the bottoms. A transparent mask is combined to the lamp base to cover those lighting modules. Whereby, it can provide an LED street lamp which can change the projection direction.

Abstract: An LED driver circuit sequentially and repeatingly switches a plurality of LED arrays to result in blink with high frequency. A PWM generator outputs n series of high frequency periodic PWM signals. The period (T) and duty cycle (d) of each series of PWM signal are the same as each other, but pulse portions of the PWM signals sequentially follow over time, i.e. d=1/n. Each PWM signal is sent to a dimming constant current source for separately outputting a driving power with the same timing as the input PWM signals to one of the LED arrays, so that the LED arrays make a high frequency blink. The blink frequencies of each and overall LED arrays are 1/T Hz and n/T Hz, respectively. The driving current of LEDs can be increased over a rated average forward current IAVG because they are not lit up continuously. By persistence of vision of the eye, a visual effect with continuity and high brightness can be obtained.

Abstract: A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.

Abstract: An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

Abstract: A light source structure of a backlight module includes a casing, a heat sink, a plurality of light source generators, a first reflecting element and a second reflecting element. If a light emitting component of the light source generator is lit, a spot light source of the light emitting component is passed through an optical lens in a light pipe and converted into a linear light source to be projected onto an oblique surface of the first reflecting element. The oblique surface converts the linear light source into a planar light source to be projected from an opening of a casing to an oblique surface of the second reflecting element. The oblique surface of the second reflecting element guides the planar light source into the light guide plate, such that the light in the light guide plate is diffused uniformly to provide sufficient brightness to the light guide plate.

Abstract: An LED illumination apparatus includes a lamp housing, an LED module, distal covers and a light-transmitting hood. The lamp housing has a base, a heat sink at the top of the base, a heat dissipating channel between two adjacent heat sinks, and a receiving portion on an internal side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, a plurality of LED lamps in the lampshade, and a connecting portion on the fixing base and coupled to the corresponding receiving portion. Each distal cover seals the front and back of the lamp housing, and the light-transmitting hood is connected under the lamp housing, and a containing space enclosed by the lamp housing, distal cover and light-transmitting hood for installing the LED module. The invention can simplify the manufacturing processes and reduce the material cost and development time.

Abstract: In a method for manufacturing a tag integrated circuit flexible board, first a copper foil, an insulating heat-conductive material and a base material coated with an adhesive layer are prepared. After being treated by a hot-pressing process, the copper foil, the insulating heat-conductive material and the base material are combined together to form a continuous band-like or sheet-like copper foil flexible board. A photo-etching process is performed to etch the cooper foil. The surface of the insulating heat-conductive material is formed with a conductive circuit layer formed of a plurality of sections of circuits. The surface of the plurality of sections of circuits is plated with a silver metallic layer. Electronic components are soldered on the circuits and an outer covering body is packaged thereon. Finally, the copper foil flexible board is cut, so that the base material has a plurality of integrated circuit flexible boards thereon.

Abstract: A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board includes an insulating heat-conductive material, and a conductive circuit layer provided on a surface of the insulating heat-conductive material and formed of a plurality of sections of circuits.

Abstract: In a method for manufacturing a tag integrated circuit flexible board, first a copper foil, an insulating heat-conductive material and a base material coated with an adhesive layer are prepared. After being treated by a hot-pressing process, the copper foil, the insulating heat-conductive material and the base material are combined together to form a continuous band-like or sheet-like copper foil flexible board. A photo-etching process is performed to etch the cooper foil. The surface of the insulating heat-conductive material is formed with a conductive circuit layer formed of a plurality of sections of circuits. The surface of the plurality of sections of circuits is plated with a silver metallic layer. Electronic components are soldered on the circuits and an outer covering body is packaged thereon. Finally, the copper foil flexible board is cut, so that the base material has a plurality of integrated circuit flexible boards thereon.