Abstract: In a method of bonding a low-resistance solder type light emitting diode chip, a copper substrate is prepared; an insulating layer is coated on the copper substrate; a conductive layer is formed on the insulating layer; a solder paste is coated onto the conductive layer by silk screen printing; a the chip is placed on the conductive layer and heated to melt the solder paste coated between the conductive layer and the chip; and finally the copper substrate is cooled such that the solder paste forms a solder layer to mount the chip onto the conductive layer.

Abstract: An LED illumination device includes a die casting lamp cover, a plurality of LED modules, a reflection cover, and a transparent module. A top surface of the die casting lamp cover protrudes forth to form a plurality of heat dissipating fins, and the LED modules are assembled in an accommodating room of the die casting lamp cover. The LED modules respectively include a LED lamp assembly and an isothermal vapor chamber. The reflection cover includes a plurality of openings surroundingly arranged on outside of the LED modules correspondingly. The transparent module are arranged under the die casting lamp cover and enclosed in the accommodating room. The LED illumination device can uniformly disperse light beams from the LED modules to outside for reducing energy loss, and further can efficiently dissipate heat to reduce chances of damaging the LEDs because of high temperature.

Abstract: A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.

Abstract: An LED lamp device has a lamp seat, in which a lamp trough is formed by being recessed inwardly, and the inner edge surface of the lamp seat is formed as an arc surface. The front and rear parts in longitudinal direction of the lamp trough are also bent inwardly. Three rows of lamp set are arranged along the longitudinal sides in the lamp trough. These lamp sets have a plurality of LEDs as light-emitting elements. The lamp sets at left and right rows are inclined inwardly according to the curvature of the inner edge surface. In the meantime, the lamp sets at front and rear sides of one row are also inclined inwardly. Under this arrangement, the plural lamp sets not only can enhance the illumination of the lamp, but also can concentrate its light-emitting operation, for solving a shortcoming of light dispersal in most light sources.

Abstract: An LED lamp with heat dissipation mechanism having double heat pipe and tridimensional LEDs arrangement is disclosed. The lamp is composed of a heat-dissipation unit, a heat pipe whose one end is mounted on the heat-dissipation unit, a plurality of LED units mounted on an outer surface of the heat pipe, a fin module encompassing the heat-dissipation unit and a reflector mounted on a bottom of the heat-dissipation unit. The heat-dissipation unit has two basin-like casings. The LED units on the heat pipe are towards the reflector. Thus the reflector concentrates the light from the LED units.

Abstract: A solar plate assembly includes a base, a condenser, a solar chip set and a heat-dissipating module. The condenser is connected to one side of the base. The solar chip set is provided within the base and arranged to correspond to the condenser, thereby to absorb the light refracted by the condenser and transform it into electricity as output. Further, the heat-dissipating module is connected to one side of the solar chip set, thereby to dissipate the heat generated by the solar chip set. With the above arrangement, the light intensity per unit area is increased to improve the electricity as output. Further, the heat not being transformed into electricity can be conducted to the heat-dissipating module, so that each solar chip can be continuously operated at a suitable temperature.

Abstract: A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

Abstract: A light source structure of a backlight module includes a casing, a heat sink, a plurality of light source generators, a first reflecting element and a second reflecting element. If a light emitting component of the light source generator is lit, a spot light source of the light emitting component is passed through an optical lens in a light pipe and converted into a linear light source to be projected onto an oblique surface of the first reflecting element. The oblique surface converts the linear light source into a planar light source to be projected from an opening of a casing to an oblique surface of the second reflecting element. The oblique surface of the second reflecting element guides the planar light source into the light guide plate, such that the light in the light guide plate is diffused uniformly to provide sufficient brightness to the light guide plate.

Abstract: An LED illumination apparatus includes a lamp housing, an LED module, distal covers and a light-transmitting hood. The lamp housing has a base, a heat sink at the top of the base, a heat dissipating channel between two adjacent heat sinks, and a receiving portion on an internal side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, a plurality of LED lamps in the lampshade, and a connecting portion on the fixing base and coupled to the corresponding receiving portion. Each distal cover seals the front and back of the lamp housing, and the light-transmitting hood is connected under the lamp housing, and a containing space enclosed by the lamp housing, distal cover and light-transmitting hood for installing the LED module. The invention can simplify the manufacturing processes and reduce the material cost and development time.

Abstract: In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board.

Abstract: In a quick assembling structure for LED lamp and heat dissipating module, the LED lamp set includes a casing and an LED module, and the casing has a containing hole, a stopping member protruded from an internal edge of the containing hole, a plurality of support stands extended outward from an external edge of the containing hole, and a latch portion formed on an internal side of the support stand. The LED module is contained in the containing hole of the casing and includes a base board and a plurality of LEDs fixed onto the bottom of the base board, and the heat dissipating module has an isothermal board installed on a side of the support stand of the casing, and a surface of the isothermal board is attached onto the base board of the LED module, and another surface is latched to a latch portion of the support stand. Such arrangement not only greatly reduces the labor cost for the assembling process, but also lowers the material cost for the screws.

Abstract: A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

Abstract: In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board.

Abstract: In a quick assembling structure for LED lamp and heat dissipating module, the LED lamp set includes a casing and an LED module, and the casing has a containing hole, a stopping member protruded from an internal edge of the containing hole, a plurality of support stands extended outward from an external edge of the containing hole, and a latch portion formed on an internal side of the support stand. The LED module is contained in the containing hole of the casing and includes a base board and a plurality of LEDs fixed onto the bottom of the base board, and the heat dissipating module has an isothermal board installed on a side of the support stand of the casing, and a surface of the isothermal board is attached onto the base board of the LED module, and another surface is latched to a latch portion of the support stand. Such arrangement not only greatly reduces the labor cost for the assembling process, but also lowers the material cost for the screws.

Abstract: An improved arrangement of light-emitting diodes of a LED lamp includes a circuit board and a plurality of light-emitting diodes. The surface of the circuit board is provided with a layer of conductive circuit, so that the light-emitting diodes can be arranged on the circuit board and electrically connected to the conductive circuit. On the surface of the circuit board provided with the conductive circuit, an imaginary circle is defined. Further, the light-emitting diodes are distributed on the circuit board along the imaginary circle to form a circular arrangement.

Abstract: An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

Abstract: A lamp with multiple light emitting faces includes a heat-dissipation unit, an isothermal body, a plurality of light-emitting units, a lampshade and a reflection shell. The heat-dissipation unit includes two round hollow casings. The isothermal body is arranged on a bottom face of the heat-dissipation unit and integral with the heat-dissipation unit. The isothermal body includes a plurality of outer planes and each plane is defined with a groove. The light-emitting units are arranged in the groove to provide lamp in multiple planes. The lampshade includes a plurality of heat dissipating plates and an accommodation space is defined at center of the lampshade to accommodate the heat-dissipation unit. The reflection shell is assembled with the heat-dissipation unit and the lampshade and the reflection shell is around the isothermal body.