Patents by Inventor Pei Wei

Pei Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080290004
    Abstract: A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.
    Type: Application
    Filed: May 25, 2007
    Publication date: November 27, 2008
    Inventors: Pei Wei TSAI, Chak Tong SZE, Sai Kit WONG, Fong Shing YIP
  • Patent number: 7345884
    Abstract: A heat-dissipating fan includes a housing, an impeller, and a circuit board. The housing includes an air channel and a base. The base is mounted in one end of the air channel for supporting the circuit board. The impeller is rotatably mounted on the base and includes a hub and a plurality of blades. The circuit board includes at least one heat-generating electronic element mounted thereon. The heat-generating electronic element extends out of the hub in relation to a longitudinal direction of the housing, with at least one portion of the heat-generating electronic element located on a downstream side of the blades for dissipating heat generated by the heat-generating electronic element.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: March 18, 2008
    Assignee: Sunonwealth Electic Machine Industry Co., Ltd.
    Inventors: Alex Horng, Hao-An Shieh, Pei-Wei Lo
  • Publication number: 20070223891
    Abstract: A frequency-variable PWM motor drive circuit includes a drive IC member, a Hall IC member, a PWM converter circuit and a compensation unit. The drive IC member electrically connects with the Hall IC member, the drive IC member further includes a pin electrically connected with the compensation unit and the PWM converter circuit. The PWM converter circuit has a PWM input pin to receive a PWM signal, and converts it into a voltage signal. The compensation unit connects between the pin of the drive IC member and the PWM converter circuit. In operation, the compensation unit can improve a waveform of the voltage signal supplied from the PWM converter circuit, and then output it to the pin of the drive IC member. Consequently, the drive IC member can be steadily operated at predetermined motor speeds under various frequencies of the PWM signals.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 27, 2007
    Inventors: Alex Horng, Chung-Ken Cheng, Pei-Wei Lo
  • Publication number: 20070217149
    Abstract: A heat-dissipating fan includes a housing, an impeller, and a circuit board. The housing includes an air channel and a base. The base is mounted in one end of the air channel for supporting the circuit board. The impeller is rotatably mounted on the base and includes a hub and a plurality of blades. The circuit board includes at least one heat-generating electronic element mounted thereon. The heat-generating electronic element extends out of the hub in relation to a longitudinal direction of the housing, with at least one portion of the heat-generating electronic element located on a downstream side of the blades for dissipating heat generated by the heat-generating electronic element.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Inventors: Alex Horng, Hao-An Shieh, Pei-Wei Lo
  • Patent number: 7265514
    Abstract: A frequency-variable PWM motor drive circuit includes a drive IC member, a Hall IC member, a PWM converter circuit and a compensation unit. The drive IC member electrically connects with the Hall IC member, the drive IC member further includes a pin electrically connected with the compensation unit and the PWM converter circuit. The PWM converter circuit has a PWM input pin to receive a PWM signal, and converts it into a voltage signal. The compensation unit connects between the pin of the drive IC member and the PWM converter circuit. In operation, the compensation unit can improve a waveform of the voltage signal supplied from the PWM converter circuit, and then output it to the pin of the drive IC member. Consequently, the drive IC member can be steadily operated at predetermined motor speeds under various frequencies of the PWM signals.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: September 4, 2007
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Chung-Ken Cheng, Pei-Wei Lo
  • Patent number: 7151975
    Abstract: A system for monitoring wafer throughput per hour in a wafer furnace includes a database, an analysis unit, a comparison unit, and an output unit. The database includes two or more operation histories of the wafer furnace. The analysis unit is coupled to the database. The analysis unit includes logic that retrieves at least one operation history from the database, determines a standard process time and a specification range for the retrieved operation history, and receives a current process time for the current process. The comparison unit, which is coupled to the analysis unit, includes logic that compares the standard process time and the specification range to the current process time. The output unit, which is coupled to the comparison unit, includes logic that outputs a comparison result. A method for monitoring wafer throughput per hour in a wafer furnace also is described.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: December 19, 2006
    Assignee: Macronix International Co., Ltd.
    Inventors: Topas Chang, Hsin Ten Wang, Chieh Chung Chang, Chuan Hua Chiu, Pei-Wei Kuo
  • Patent number: 6967475
    Abstract: The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: November 22, 2005
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Ching Man Stanley Tsui, Chak Tong Albert Sze, Pei Wei Tsai, Lap Kei Eric Chow
  • Publication number: 20050177263
    Abstract: A system for monitoring wafer throughput per hour in a wafer furnace includes a database, an analysis unit, a comparison unit, and an output unit. The database includes two or more operation histories of the wafer furnace. The analysis unit is coupled to the database. The analysis unit includes logic that retrieves at least one operation history from the database, determines a standard process time and a specification range for the retrieved operation history, and receives a current process time for the current process. The comparison unit, which is coupled to the analysis unit, includes logic that compares the standard process time and the specification range to the current process time. The output unit, which is coupled to the comparison unit, includes logic that outputs a comparison result. A method for monitoring wafer throughput per hour in a wafer furnace also is described.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 11, 2005
    Inventors: Topas Chang, Hsin Wang, Chieh Chang, Chuan Chiu, Pei-Wei Kuo
  • Publication number: 20050162151
    Abstract: The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.
    Type: Application
    Filed: January 22, 2004
    Publication date: July 28, 2005
    Inventors: Ching Man Stanley Tsui, Chak Tong Albert Sze, Pei Wei Tsai, Lap Kei Eric Chow
  • Patent number: 6819853
    Abstract: We propose a technique for fabricating stacked photonic lightwave circuits (PLCs), with both high and low refractive index steps, comprising the use of etched PECVD dielectric layers for the light guiding structures and which are surrounded and separated by an interlayer PLC cladding (IPC) comprising a non-conformal layer of sol-gel, whose composition, refractive index and thickness can be tailored to the requirements of the device.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 16, 2004
    Assignee: Denselight Semiconductor Pte Ltd.
    Inventors: Yee Loy Lam, Pei Wei Tan, Hwi Siong Lim, Yuen Chuen Chan
  • Patent number: 6655045
    Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: December 2, 2003
    Assignee: ASM Assembly Automation Limited
    Inventors: Yiu Ming Cheung, Pei Wei Tsai, Yu Sze Cheung
  • Patent number: 6582288
    Abstract: A diaphragm for a chemical mechanical polisher is composed of a rubber layer and a fiber layer. The size and shape of the diaphragm are suitably designed according to a gap and relative shifting between the rotary unit and holder to prevent creasing of the diaphragm and thereby decrease friction with a sidewall of the rotary unit and holder. The fibrous layer can improve the strength of the diaphragm in order to improve the lifetime of the diaphragm, reduce the frequency of maintenance of the polisher, and increase throughput.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: June 24, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Pei Wei Yeh, Sun Kuo Lang
  • Publication number: 20030063836
    Abstract: We propose a technique for fabricating stacked photonic lightwave circuits (PLCs), with both high and low refractive index steps, comprising the use of etched PECVD dielectric layers for the light guiding structures and which are surrounded and separated by an interlayer PLC cladding (IPC) comprising a non-conformal layer of sol-gel, whose composition, refractive index and thickness can be tailored to the requirements of the device.
    Type: Application
    Filed: September 17, 2002
    Publication date: April 3, 2003
    Inventors: Yee Loy Lam, Pei Wei Tan, Hwi Siong Lim, Yuen Chuen Chan
  • Publication number: 20020182778
    Abstract: A flexible package fabrication method, which enables the IC chip packaging film and the inner lead automated bonding to be simultaneously done. The method includes the steps of preparing a base member, electroplating a circuit having inner leads, outer leads, test lines/test terminals on the base member, covering the top side of the circuit with a polyimide passivation film or layer of flexible solder protective paint, bonding the bumps of a bumped IC chip or passive element to the inner leads of the circuit by thermocompression bonding, removing the base member, and covering the bottom side of the circuit with a polyimide passivation layer or layer of flexible solder protective paint.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 5, 2002
    Inventors: Pei-Wei Wang, Chin-Jung Chang
  • Publication number: 20020133971
    Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.
    Type: Application
    Filed: August 2, 2001
    Publication date: September 26, 2002
    Inventors: Yiu Ming Cheung, Pei Wei Tsai, Yu Sze Cheung
  • Publication number: 20020072314
    Abstract: A diaphragm for a chemical mechanical polisher is composed of a rubber layer and a fiber layer. The size and shape of the diaphragm are suitably designed according to a gap and relative shifting between the rotary unit and holder to prevent creasing of the diaphragm and thereby decrease friction with a sidewall of the rotary unit and holder. The fibrous layer can improve the strength of the diaphragm in order to improve the lifetime of the diaphragm, reduce the frequency of maintenance of the polisher, and increase throughput.
    Type: Application
    Filed: July 13, 2001
    Publication date: June 13, 2002
    Inventors: Pei Wei Yeh, Sun Kuo Lang
  • Patent number: 6299218
    Abstract: A structure for connecting fluid channel of fluid delivery system is disclosed. This connecting structure limits the length of the flow-guiding pipe extending into the delivery channel, to reduce particle contaminates and the probability of crack. The present pipe union connecting structure comprises a first pipe, a second pipe mounted to the first pipe, and an inner pipe extending from the first pipe into the second pipe with a certain extending length. The extending length of the inner pipe is less than the proportion of the minimum distance between the inner wall of the second pipe and the outlet of the inner pipe when standstill, to the tangent value of a certain angle &thgr;, which is the maximum inclined angle between the second pipe and the inner pipe.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: October 9, 2001
    Assignee: Mosel Vitelic Inc.
    Inventors: Pei-Wei Tsai, Hua-Jen Tseng, Chun-Chieh Lee, Gwo-Yuh Yang
  • Patent number: 6291827
    Abstract: A novel insulating apparatus for a conductive line is disclosed. The proposed insulating apparatus can be applied to various conductive lines with different shapes. The problem of short circuit can be solved by the present insulating apparatus with the novel connecting configuration. The present invention comprises a plurality of insulator rings worn on the conductive line in series, wherein the insulator rings are annular cylinders. Each of the annular cylinders has an outer diameter larger than the inner diameter of the ones next to it. In addition, each of the annular cylinders has a length sized according to the desired flexibility of the conductive line.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: September 18, 2001
    Assignee: Mosel Vitelic Inc.
    Inventors: Pei-Wei Tsai, Hua-Jen Tseng, Dong-Tay Tsai, Fu-Chih Huang
  • Patent number: 6206760
    Abstract: The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: March 27, 2001
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Applied Materials, Inc.
    Inventors: Yu-Chia Chang, Jain-Li Wu, Chung-I Cheng, Chih-Chiang Yang, Pei Wei Yeh, Yung-Tai Tseng
  • Patent number: 6130433
    Abstract: The present invention relates to an ion source chamber of a high energy implanter. The ion source chamber comprises a main chamber for generating ions for ion implantation, a vent-pipe having two open ends, one end of the vent-pipe being connected to the main chamber for releasing air from the main chamber, a releasing valve connected to another end of the vent-pipe for releasing the air in the main chamber when the pressure of the air in the main chamber exceeds a predetermined pressure, and a filtering device installed between the vent-pipe and the releasing valve for filtering impurities contained in the air carried by the vent-pipe so as to prevent the impurities from falling into the releasing valve.
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: October 10, 2000
    Assignee: Mosel Vitelic Inc.
    Inventors: Pei-Wei Tsai, Hua-Jen Tseng, Dong-Tay Tsai, Chih-Hsien Chang