Patents by Inventor Peiching Ling

Peiching Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170133562
    Abstract: A package structure is provided, which includes: a light emitting element having a first surface, a second surface opposite to the first surface, and a side surface adjacent to and connected with the first surface and the second surface; a fluorescent layer covering the first surface and the side surface of the light emitting element; a transparent layer covering the fluorescent layer with an inclined surface formed at an outer side of the transparent layer; and a reflective layer formed on the inclined surface and covering an outer side of the fluorescent layer. Therefore, light can be prevented from leakage from the outer side of the fluorescent layer. A method for fabricating the package structure is also provided.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 11, 2017
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20170115601
    Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.
    Type: Application
    Filed: January 5, 2017
    Publication date: April 27, 2017
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20170084795
    Abstract: A method for forming a phosphor material on a surface of a target is provided, which includes the steps of: providing a chamber for receiving the phosphor material constituted by a plurality of particles, wherein a grid is disposed on or beneath a surface constituted by the phosphor material in the chamber, and the grid has a plurality of fine lines SN each having opposite first and second ends, N being a positive integer greater than 1; exposing the surface of the target to the phosphor material; and creating a charge on the plurality of particles, generating an electric field between the chamber and the surface of the target and oscillating the plurality of fine lines, so as to drive the plurality of particles toward the surface of the target and to be deposited on the surface of the target.
    Type: Application
    Filed: September 17, 2015
    Publication date: March 23, 2017
    Inventors: Peiching Ling, Dezhong Liu
  • Patent number: 9586216
    Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: March 7, 2017
    Assignee: ACHROLUX INC.
    Inventors: Peiching Ling, DeZhong Liu
  • Patent number: 9559273
    Abstract: A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: January 31, 2017
    Assignee: ACHROLUX INC.
    Inventors: Peiching Ling, DeZhong Liu
  • Publication number: 20170009340
    Abstract: A method for dispensing powder includes: providing a device for dispensing powder, the device including a framework, warps connected to the framework, a trough for receiving powder, an actuating member for displacing at least one of the framework and the trough, and an action source for the powder to be detached from the warps and dispensed on an object; supplying the powder to the warps and generating an electric field for the powder to carry an electric charge and become charged powder; and providing a force, by the action source, to at least one of the framework and the warps for the charged powder to be detached from the warps, the charged powder moving dependent on the electric field and being dispensed on the object. The warps have equal amounts of charged powder carried thereon, allowing the charged powder to be distributed evenly.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 12, 2017
    Inventors: Peiching Ling, Dezhong Liu
  • Patent number: 9480125
    Abstract: A light-emitting structure and a method of fabricating the light-emitting structure. The method includes covering an LED die provided on a carrier with a uniform phosphor layer, with an accommodation space constituted by the carrier and the uniform phosphor layer; and forming in the accommodation space a first light-pervious body such that the uniform phosphor layer in various shapes is formed on the LED die. The light-emitting structure thus fabricated has excellent optical property.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: October 25, 2016
    Assignee: ACHROLUX INC
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20160218263
    Abstract: A package structure is provided, which includes a light emitting element having opposite first and second sides, a coating body combined with side faces of the light emitting element, a fluorescent layer disposed on the second side, and a metal structure disposed on the first side. As the coating body is in contact with and combined with the side faces of the light emitting element, light will not be emitted from the side faces of the light emitting element. Therefore, the heat generated is reduced, and issues such as yellowing of the encapsulant and poor luminous efficiency due to overheating of the fluorescent powder are avoided. Further, the metal structure enhances the heat dissipation. A method for manufacturing the package structure is also provided.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 28, 2016
    Inventor: Peiching Ling
  • Publication number: 20160155915
    Abstract: A method of manufacturing a light-emitting package structure is provided. The method includes disposing at least one light emitting element on a carrier and forming a reflective material. The light emitting element has opposite first and second sides and a plurality of third sides connected to the first side and the second side. The light emitting element is disposed on the carrier via the second side. The reflective material is formed on the third side of the light emitting element, so as to form a reflective film.
    Type: Application
    Filed: November 25, 2015
    Publication date: June 2, 2016
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20160141476
    Abstract: The present disclosure provides a method of manufacturing a package structure. The method includes: providing a plurality of conductive portions and a light emitting element; encapsulating the light emitting element and the conductive portions by an encapsulant with a lateral surface of the light emitting element electrically insulated from the conductive portions; electrically connecting the light emitting element to the conductive portions by a conductive element. Accordingly, several methods can be selected to form the conductive element with no conventional limitations. The present disclosure further provides a package structure and a carrier.
    Type: Application
    Filed: November 18, 2015
    Publication date: May 19, 2016
    Inventors: Peiching Ling, Dutta Vivek, Dezhong Liu
  • Publication number: 20160141462
    Abstract: A molded substrate is provided, including: a release film; and a plurality of phosphor particles formed on the release film, wherein the phosphor particles have gaps therebetween. A method of manufacturing a package structure is also provided, including: disposing at least one light emitting element on a carrier; forming a transparent adhesive layer on a surface of the light emitting element; disposing the molded substrate on the transparent adhesive layer with the phosphor particles disposed between the transparent adhesive layer and the release film; filling the transparent adhesive layer into the gaps of the phosphor particles to form a phosphor layer; and removing the release film, so as to obtain an even phosphor layer.
    Type: Application
    Filed: November 18, 2015
    Publication date: May 19, 2016
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20160020367
    Abstract: A method for fabricating a package structure is provided. At least one light emitting component is sucked and adhered to a carrier. An encapsulating member encapsulates the light emitting component. A conductive component is connected to the light emitting component.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 21, 2016
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20150333238
    Abstract: A package structure is provided, which includes a metal element, a light emitting element disposed on the metal element, an insulative body encapsulating the light emitting element, a conductive adhesive coupled to the light emitting element, and a phosphor layer covering the light emitting element and the conductive adhesive. By using the conductive adhesive as a circuit, the fabricating cost can be reduced for meeting the low-profile requirement. The present invention further provides a method of fabricating the package structure.
    Type: Application
    Filed: May 19, 2015
    Publication date: November 19, 2015
    Inventors: Peiching Ling, Dezhong Liu
  • Publication number: 20150155461
    Abstract: A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 4, 2015
    Applicant: ACHROLUX INC.
    Inventors: Peiching Ling, DeZhong Liu
  • Publication number: 20150114288
    Abstract: A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.
    Type: Application
    Filed: August 18, 2014
    Publication date: April 30, 2015
    Inventors: Peiching Ling, DeZhong Liu
  • Patent number: 8994050
    Abstract: A method of transferring a uniform phosphor layer on an article and a light-emitting structure having a uniform phosphor layer. The method includes disposing a surface of the article in a proximity of a carrier having the uniform phosphor layer on a surface thereon, and causing the uniform phosphor layer to be secured to the surface of the article. Therefore, the uniform phosphor layer is secured to the articles according to a contour of the article.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: March 31, 2015
    Assignee: ARCHOLUX, Inc.
    Inventor: Peiching Ling
  • Publication number: 20150014738
    Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.
    Type: Application
    Filed: January 23, 2013
    Publication date: January 15, 2015
    Inventor: Peiching Ling
  • Publication number: 20140299908
    Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.
    Type: Application
    Filed: May 2, 2014
    Publication date: October 9, 2014
    Inventor: Peiching Ling
  • Publication number: 20140302244
    Abstract: A method for forming a uniform film layer structure, including providing a phosphorous powder and a first surface of an object, wherein the phosphorous powder has a plurality of phosphorous particles, at least a portion of a surface of each of the phosphorous particles is covered with an adhesive material, and the first surface does not contact the phosphorous powder; and adsorbing the phosphorous powder to the first surface of the object by using an electrostatic adsorption method.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 9, 2014
    Applicant: ACHROLUX INC.
    Inventors: Peiching Ling, DeZhong Liu
  • Patent number: 8803185
    Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: August 12, 2014
    Inventors: Peiching Ling, Vivek B. Dutta