Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.

Abstract: A detection system for detecting a fluorescent layer formed in a fluorescent layer forming system is disclosed. The detection system of the present invention includes a light source module, a light detecting module and a light transmitting module, wherein the light source module emits a detecting light to a fluorescent layer, the detecting light is then converted by the fluorescent layer to a light to be detected, the light to be detected is received by the light detecting module, and detection data are formed. A control instruction is transmitted to the fluorescent layer forming system according to the control instruction to control the fluorescent layer forming system, such that a desired fluorescent layer is formed on an object, and optical property of fluorescent layers in each fabrication is consistent.

Abstract: A method for forming a phosphor material on a surface of a target is provided. The method includes the steps of: providing a chamber for receiving the phosphor material, which is constituted by a plurality of particles; exposing the surface of the target to the phosphor material; and creating a charge on the plurality of particles and generating an electric field between the chamber and the surface of the target, so as to drive the plurality of particles toward the surface of the target and to be deposited on the surface of the target.

Abstract: A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-previous encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-previous encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.

Abstract: A light-emitting structure and a method of fabricating the light-emitting structure. The method includes covering an LED die provided on a carrier with a uniform phosphor layer, with an accommodation space constituted by the carrier and the uniform phosphor layer; and forming in the accommodation space a first light-pervious body such that the uniform phosphor layer in various shapes is formed on the LED die. The light-emitting structure thus fabricated has excellent optical property.

Abstract: A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.

Abstract: A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.

Abstract: A method for forming wavelength-conversion LED encapsulant structure includes forming an LED encapsulant structure body, forming a layer of a wavelength-conversion material on a first surface, disposing the first surface to cause the wavelength-conversion material to be in contact with a surface region of the LED encapsulant structure body, applying a pressure between the first surface and the surface region of the LED encapsulant structure body, and causing at least a portion of the wavelength-conversion material to be at least partially embedded in the surface region of the LED encapsulant structure body.

Abstract: A method for forming a layer of an LED phosphor material includes disposing a first surface in a proximity of a powder that includes an LED phosphor material, forming electrostatic charges on the first surface, and forming a layer of the LED phosphor material on the first surface at least partially by using the electrostatic charges. In an embodiment, the method includes disposing the first surface in an interior of a chamber and forming an airborne distribution of the powder in the interior of the chamber in a vicinity of the first surface. In another embodiment, the method includes providing a reservoir of the powder and applying to said phosphor powder an electrostatic charge opposite to that of said electrostatic charge on the first surface.

Abstract: A method for forming a layer of phosphor material on an LED encapsulant structure includes forming a layer of a phosphor material on a first surface, disposing the first surface to cause the phosphor material to be in contact with a surface of the LED encapsulant structure, applying a pressure between the first surface and the surface of the LED encapsulant structure, and causing the layer of the phosphor material to be attached to the LED encapsulant structure.

Abstract: A method of transferring a uniform phosphor layer on an article and a light-emitting structure having a uniform phosphor layer. The method includes disposing a surface of the article in a proximity of a carrier having the uniform phosphor layer on a surface thereon, and causing the uniform phosphor layer to be secured to the surface of the article. Therefore, the uniform phosphor layer is secured to the articles according to a contour of the article.

Abstract: A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.

Abstract: A method for forming wavelength-conversion LED encapsulant structure includes forming an LED encapsulant structure body, forming a layer of a wavelength-conversion material on a first surface, disposing the first surface to cause the wavelength-conversion material to be in contact with a surface region of the LED encapsulant structure body, applying a pressure between the first surface and the surface region of the LED encapsulant structure body, and causing at least a portion of the wavelength-conversion material to be at least partially embedded in the surface region of the LED encapsulant structure body.

Abstract: A method for forming a layer of phosphor material on an LED encapsulant structure includes forming a layer of a phosphor material on a first surface, disposing the first surface to cause the phosphor material to be in contact with a surface of the LED encapsulant structure, applying a pressure between the first surface and the surface of the LED encapsulant structure, and causing the layer of the phosphor material to be attached to the LED encapsulant structure.

Abstract: A method for forming a layer of an LED phosphor material includes disposing a first surface in a proximity of a powder that includes an LED phosphor material, forming electrostatic charges on the first surface, and forming a layer of the LED phosphor material on the first surface at least partially by using the electrostatic charges. In an embodiment, the method includes disposing the first surface in an interior of a chamber and forming an airborne distribution of the powder in the interior of the chamber in a vicinity of the first surface. In another embodiment, the method includes providing a reservoir of the powder and applying to said phosphor powder an electrostatic charge opposite to that of said electrostatic charge on the first surface.

Abstract: A memory device includes a composite dielectric layer overlying a substrate. The composite dielectric layer includes a first dielectric layer, a bonding interface, and a second dielectric layer. The first and the second dielectric layers are bonded together at the bonding interface. A first plurality of conductive lines overlies the combined dielectric layer. One or more semiconductor switching devices formed in a single-crystalline semiconductor layer overlie and are coupled with one of the first plurality of conductive lines. The memory device also has one or more two-terminal memory elements, each of which overlies and is coupled to a corresponding one of the single-crystalline switching device. A second plurality of conductive lines overlies the memory elements. In the memory device, each of the memory elements is coupled to one of the first plurality of conductive lines and one of the second plurality of conductive lines.

Abstract: The present invention is a wavelength-selective optical transmission system that includes a first waveguide for transmitting a multiplexed optical signal therethrough. The system further includes a second waveguide coupled to the first waveguide wherein a least one of the first and second waveguides have a set of wavelength-selective Bragg gratings disposed near a coupling section between the first and second waveguides to reflect a reflecting optical signal back to the first waveguide and for transmitting a contra-directional optical signal and a co-directional optical signal having respectively a contra-directional selected wavelength and a co-directional selected wavelength corresponding to the Bragg gratings. One of the contra-directional and co-directional wavelengths is chosen as a designated wavelength, and the reflecting optical signal and one of the contra-directional or co-directional optical signals are outside of a predefined range surrounding the designated wavelength.

Abstract: The present invention is a wavelength-selective optical transmission system that includes a first waveguide for transmitting a multiplexed optical signal therethrough. The system further includes a second waveguide coupled to the first waveguide wherein a least one of the first and second waveguides have a set of wavelength-selective Bragg gratings disposed near a coupling section between the first and second waveguides to reflect a reflecting optical signal back to the first waveguide and for transmitting a contra-directional optical signal and a co-directional optical signal having respectively a contra-directional selected wavelength and a co-directional selected wavelength corresponding to the Bragg gratings. One of the contra-directional and co-directional wavelengths is chosen as a designated wavelength, and the reflecting optical signal and one of the contra-directional or co-directional optical signals are outside of a predefined range surrounding the designated wavelength.

Abstract: The present invention discloses a switching matrix configuration to reduce the optical propagation losses and coupling losses. The switching matrix comprises M horizontal waveguides interested with 2N vertical waveguides, where M and N are positive integers and the optical switching system is configured to receive a multiplexed input optical signal from a horizontal waveguide disposed next to an i-th horizontal waveguide where i is a closest integer to a positive real number M/2.

Abstract: A wavelength selective switch. The switch comprises an input waveguide for carrying an optical signal having a wavelength ?i. Also included is an output waveguide having a Bragg grating adapted for coupling the wavelength ?i into the output waveguide in a coupling zone. Finally, provided is a heater element that can selectively provide thermal energy to the coupling zone such that the Bragg grating does not couple the wavelength ?i.