Patents by Inventor Peng Lin

Peng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953568
    Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: April 9, 2024
    Assignee: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng Li, Qiancheng Lv, Bing Tian, Zejie Tan, Zhiming Wang, Jie Wei, Renze Chen, Xiaopeng Fan, Zhong Liu, Zhenheng Xu, Senjing Yao, Licheng Li, Yuehuan Lin, Shengrong Liu, Bofeng Luo, Jiaming Zhang, Xu Yin
  • Patent number: 11955401
    Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
  • Publication number: 20240113034
    Abstract: A method for forming a semiconductor package is provided. The method includes forming a first alignment mark in a first substrate of a first wafer and forming a first bonding structure over the first substrate. The method also includes forming a second bonding structure over a second substrate of a second wafer and trimming the second substrate, so that a first width of the first substrate is greater than a second width of the second substrate. The method further includes attaching the second wafer to the first wafer via the first bonding structure and the second bonding structure, thinning the second wafer until a through-substrate via in the second substrate is exposed, and performing a photolithography process on the second wafer using the first alignment mark.
    Type: Application
    Filed: February 8, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Hung LIN, Wei-Ming WANG, Chih-Hao YU, PaoTai HUANG, Pei-Hsuan LO, Shih-Peng TAI
  • Patent number: 11947072
    Abstract: The system comprises a rainfall monitoring module, a self-calibration and rainfall measurement module, a central processing module, a water level monitoring module, and a drainage module. The rainfall monitoring module is configured to monitor rainfall and send a rainfall signal to the central processing module. The self-calibration and rainfall measurement module is configured to transmit ultrasonic signals and receive calibration echo signals to compute the calibrated flight time, and transmit ultrasonic signals to the water surface in the bucket and receive the measured echo signal reflected by the water surface to obtain the measured flight time under the control of the central processing module. The central processing module is configured to receive the rainfall signal to start the water level monitoring module and the self-calibration and rainfall measurement module, which are used to calculate the rainfall value and output it in a fixed format.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 2, 2024
    Assignee: Hainan Acoustics Laboratory, Institute of Acoustics, Chinese Academy of Sciences
    Inventors: Songbin Li, Mingyong Yuan, Peng Liu, Daoyou Lin
  • Publication number: 20240106084
    Abstract: Embodiments of the present application provide a battery cell, a battery, a power consumption device, and a method and device for producing a battery cell. The battery cell includes: a housing having an opening; an electrode assembly accommodated in the housing; an end cover configured to cover the opening and provided with an electrode terminal; and a support, disposed in the housing, where the support and the electrode assembly are arranged in a first direction, the support and the end cover are arranged in a second direction, and the first direction is perpendicular to the second direction, the support abuts against the electrode assembly in the first direction so as to limit the electrode assembly.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Denghua LIN, Xinxiang CHEN, Zhijun GUO, Yulian ZHENG, Peng WANG, Haizu JIN
  • Publication number: 20240107691
    Abstract: A display device includes first and second display modules and first and second turning pieces that include a first coupling piece, a first turning piece, a second turning piece, and a third turning piece, a second coupling piece and a guiding device. When the first and second display modules are switched between folding and unfolding, the first turning piece pivots relative to the first coupling piece and the second turning piece, and the third turning piece pivots relative to the second coupling piece and the second turning piece. When the display module is switched from folded to unfolded, the other side of the first display module relative to the side is pulled, the side of the first display module is guided by one end of the guiding device and slides to the other end, the first and second display modules are symmetrically unfolded with the side edge as the center.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: CHIEN-FENG CHANG, TSUNG-HUAI LEE, YU-HUNG HSIAO, CHAN-PENG LIN, SHANG-CHIEN WU
  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Patent number: 11942373
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin, a second fin and a third fin therebetween. A first insulating structure includes a first insulating layer formed between the first and third fins, a capping structure covering the first insulating layer, a first insulating liner covering sidewall surfaces of the first insulating layer and the capping structure and a bottom surface of the first insulating layer, and a second insulating liner formed between the first insulating liner and the first fin and between the first insulating liner and the third fin. The second insulating structure includes a second insulating layer formed between the second fin and the third fin and a third insulating liner formed between the second insulating layer and the second fin and between the second insulating layer and the third fin.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chu-An Lee, Chen-Hao Wu, Peng-Chung Jangjian, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao
  • Publication number: 20240096722
    Abstract: In an embodiment, a package includes a first device and a second device attached to a first redistribution structure, wherein the second device includes a second redistribution structure, a first die disposed over the second redistribution structure, a first encapsulant extending along sidewalls of the first die, a first via extending through the first encapsulant, a third redistribution structure disposed over the first encapsulant and including a first metallization pattern connecting to the first via, a second die disposed over the third redistribution structure, and a second encapsulant extending along sidewalls of the second die, the first die and the second die being free of through substrate vias. The package also includes a third encapsulant disposed over the first redistribution structure and surrounding sidewalls of the first device and the second device, wherein top surfaces of the second encapsulant and the third encapsulant are level with each other.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 21, 2024
    Inventors: Kuo-Chung Yee, Chia-Hui Lin, Shih-Peng Tai
  • Publication number: 20240096830
    Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Yi Huang, Yu-Hung Lin, Wei-Ming Wang, Chen Chen, Shih-Peng Tai, Kuo-Chung Yee
  • Patent number: 11933713
    Abstract: The present disclosure provides a determining device for the weathering resistant capability of clastic rocks in a tunnel based on feldspar features, which overcomes the shortcomings of current evaluation methods, is easy to operate, can be used to detect the type, content, and crystal structure of feldspar in a rock stratum, and integrates the information by combining a computer deep learning method to determine the weathering resistant capability of clastic rocks containing different types of feldspar in a tunnel, with high accuracy.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 19, 2024
    Assignee: SHANDONG UNIVERSITY
    Inventors: Shucai Li, Zhenhao Xu, Ruiqi Shao, Fumin Liu, Huihui Xie, Tengfei Yu, Peng Lin, Dongdong Pan
  • Patent number: 11928304
    Abstract: A smart digital computer platform is disclosed that collects, analyzes, and/or renders appropriate information about fugitive emissions identified by a sensor network-based emissions monitoring system in a facility. More specifically to the methods used by the smart digital computer platform to analyze, filter, and transform the collected monitoring data into a visual output that is capable of being rendered on a graphical user interface (GUI) on a screen display with, in some embodiments, a restricted form factor. For example, smart analytics may be used to cull, filter, and transform the data displayed in a pop-up dialog box on a GUI. In another example, the transformed data may be translated into a visual, graphical element that conveys an abundance of appropriate, tailored information to a particular type of user viewing the GUI.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: March 12, 2024
    Assignee: Molex, LLC
    Inventors: Ling-Ying Lin, Alissa Nedossekina, Wenfeng Peng, Alexander Chernyshov
  • Patent number: 11927608
    Abstract: The present disclosure relates to an AC/DC closed-loop current sensor, including a magnetism gathering iron core, a TMR chip, a signal processing circuit, a signal generator, and a feedback coil. The TMR chip is arranged at an air gap of the magnetism gathering iron core and connected to the signal processing circuit. The signal processing circuit is connected to the signal generator. The feedback coil is wound around the magnetism gathering iron core and connected to the signal generator. The signal processing circuit is configured to select from the induced signal of the TMR chip and make an amplification to obtain a current signal component and send the current signal component to the signal generator. The signal generator is configured to adjust a current output to the feedback coil based on the current signal component, and output a measurement result of the selected current signal component.
    Type: Grant
    Filed: September 18, 2023
    Date of Patent: March 12, 2024
    Assignee: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng Li, Qiancheng Lv, Bing Tian, Xiaopeng Fan, Zhong Liu, Zhiming Wang, Renze Chen, Jie Wei, Xu Yin, Zejie Tan, Zhenheng Xu, Senjing Yao, Licheng Li, Yuehuan Lin, Shengrong Liu, Bofeng Luo, Jiaming Zhang
  • Publication number: 20240076795
    Abstract: An ionically resistive ionically permeable element for use in an electroplating apparatus includes ribs to tailor hydrodynamic environment proximate a substrate during electroplating. In one implementation, the ionically resistive ionically permeable element includes a channeled portion that is at least coextensive with a plating face of the substrate, and a plurality of ribs extending from the substrate-facing surface of the channeled portion towards the substrate. Ribs include a first plurality of ribs of full maximum height and a second plurality of ribs of smaller maximum height than the full maximum height. In one implementation the ribs of smaller maximum height are disposed such that the maximum height of the ribs gradually increases in a direction from one edge of the element to the center of the element.
    Type: Application
    Filed: January 19, 2022
    Publication date: March 7, 2024
    Inventors: Stephen J. Banik, II, Gabriel Hay Graham, Bryan L. Buckalew, Robert Rash, Lee Peng Chua, Frederick Dean Wilmot, Chien-Chieh Lin
  • Publication number: 20240079392
    Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang WANG, Tso-Jung Chang, Jeng-Shien Hsieh, Shih-Ping Lin, Chih-Peng Lin, Chieh-Yen Chen, Chen-Hua Yu
  • Publication number: 20240066626
    Abstract: A laser cutting light spot control system. The system includes an upper computer (1) and a laser cutting light spot control apparatus (2), wherein the upper computer is in communication connection with a main processor (3), and the upper computer is used for acquiring a light spot track parameter inputted by an operator, and transmitting the inputted light spot track parameter to the main processor; and the main processor fits the inputted light spot track parameters by means of a graphics processing module (4), so as to form light spot track graphics data, i.e., a cutting coordinate set. A storage module (5) is used for storing the light spot track parameter inputted by the operator, and the cutting coordinate set. The present application further relates to a laser cutting light spot control method.
    Type: Application
    Filed: October 31, 2022
    Publication date: February 29, 2024
    Inventors: Gaoling Lin, Mingjie Sun, Mandun Niu, Qinming Zhang, Chengshun Zhang, Peng Liu
  • Patent number: 11895787
    Abstract: The present invention provides a multi-directional multi-joint turning piece and a display device including the multi-directional multi-joint turning piece. The multi-directional multi-joint turning piece is configured to connect a first display module and a second display module to provide a first display module unfolded or folded with the second display module. The multi-directional multi-joint turning piece includes a first coupling piece, a first turning piece, a second turning piece, a third turning piece, and a second coupling piece, wherein the first coupling piece is connected to the first display module, the second coupling piece is connected to the second display module, the first coupling piece is pivoted to the first turning piece, the first turning piece is pivoted to the second turning piece, the second turning piece is pivoted to the third turning piece, and the third turning piece is pivoted to the second coupling piece.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: February 6, 2024
    Assignee: STAR ASIA VISION CORPORATION
    Inventors: Chien-Feng Chang, Tsung-Huai Lee, Yu-Hung Hsiao, Chan-Peng Lin, Shang-Chien Wu
  • Patent number: D1017051
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: March 5, 2024
    Assignee: ZBEATS, INC.
    Inventors: Bin Fang, Jeffrey Triolo, Zheng Lin, Peng Zhang
  • Patent number: D1018997
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 19, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Zheng Gu, Peng Zhou, Wenbo Wang, Xiaojuan Zhu, Ling Lin, Zhao Xia Jin, Tiecheng Qu, Weiming Zhou, Yolanda Wang, Anncy Zhou
  • Patent number: D1018999
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 19, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Ling Lin, Peng Zhou, Xiaojuan Zhu, Weiming Zhou, Zheng Gu, Lyndon Liu