Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: The invention discloses a multi-path management method and system for managing paths over which an IO is routed from a host to multiple logical volumes (LUNs) of a storage system, wherein the multiple LUNs of the storage system are mapped to the host, and the method comprises: grouping LUNs with the same paths between the host and the storage system into a group of LUNs; and using one path selection thread for all of LUNs in the group of LUNs to manage the same paths. The method and system lower the amount of work for path management and the amount of required resources.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: There is provided a system for automated handling of live organisms for studying biological development of the organisms. The system has a reservoir for containing a plurality of the organisms, a module for automatically trapping and orientating the organisms in desired positions for imaging purpose, a module for automatically controlling orientation of the organisms leaving the reservoir and entering the trapping and orientating module, and a module for automatically loading the organisms from the reservoir into the orientation control module. The trapping and orientating module may include an array of channels configured to allow flow of fluid and travel of the organisms in the system.

Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.

Abstract: The present invention is concerned with a system and method for introducing a substance into cells. The system has an assembly including a plurality of elongate non-hollow nanoneedles forming a nanoneedle array or patch for delivering the substance into the cells, at least some of the nanoneedles have a non-uniform diameter with a wider upper end, a narrower lower end for penetration into the cells and a length from substantially 200 nm to 100 um. The lower end has a diameter from substantially 20-436 nm. Adjacent nanoneedles are spaced apart by substantially 5-50 um. The nanoneedles are made from a material selected from the group consisting of diamond, cubic boron nitride, carbon nitride, boron nitride, boron carbon nitride, metal borides and essentially boron materials, allowing the nanoneedles to maintain sufficient thinness and yet adequate rigidity during penetration. The nanoneedles are applied onto the cells grown on substrates at a preferred rate from 1 to 5 m/s.

Abstract: Automatic system for efficient delivery of biologics into target organs of zebrafish larvae for high-throughput in vivo screening. The system includes a reservoir containing zebrafish larvae immersed in a hydrogel in its liquid state. A microfluidic component removes a droplet of the hydrogel having a single zebrafish larva contained therein and deposits the droplet on a surface for receiving an array of hydrogel droplets. Structure or substances is provided for inducing the larva to assume a dorsal or lateral orientation within the droplet. A cooler cools the surface to solidify the hydrogel droplets thereby to immobilize the larvae for observation by an optical arrangement that identifies target organs in each larva using an image template-matching algorithm. A pressure driven microinjection needle injects biologics into the target organ of the zebrafish larva for screening studies.

Abstract: A device for intracellular delivery includes a substrate having a diamond layer, and diamond nanoneedles that spaced apart from each other on the diamond layer, the substrate further comprises a silicon layer below the diamond layer, wherein the nanoneedles are cylindrical nanoneedles, and a side surface of the nanoneedles is perpendicular to the diamond layer.

Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.

Abstract: The invention discloses a multi-path management method and system for managing paths over which an IO is routed from a host to multiple logical volumes (LUNs) of a storage system, wherein the multiple LUNs of the storage system are mapped to the host, and the method comprises: grouping LUNs with the same paths between the host and the storage system into a group of LUNs; and using one path selection thread for all of LUNs in the group of LUNs to manage the same paths. The method and system lower the amount of work for path management and the amount of required resources.