Abstract: An interference-type torque split differential includes a differential housing, a first differential gear and an interference-type torque split module. The first differential gear is provided in the differential housing. The interference-type torque split module is provided outside the differential housing and has a second differential gear, a first brake source and a second brake source. The second differential gear is connected with the first differential gear. The first brake source and the second brake source are at two sides of the second differential gear, respectively. The first brake source or the second brake source provides multiple stages of clamping force for performing torque split.

Abstract: A dual-shaft push-moving varying speed device includes a drive unit; an input shaft, having at least an odd-numbered input gear and at least an even-numbered input gear is coupled with the drive unit; an output shaft, having an end thereof penetrate through the input shaft and the drive unit, and the another end thereof possesses an output gear; a transmission shaft, including at least an odd-numbered output gear, at least an even-numbered output gear, and a transmission gear where the odd-numbered output gear is meshed with the corresponding odd-numbered input gear while the even-numbered output gear is meshed with the corresponding even-numbered input gear, and the transmission gear is meshed with the output gear; and at least a push-moving fork, being furnished between the odd-numbered input gear and the even-numbered input gear, selectively pushes the odd-numbered input gear and the even-numbered input gear to move.

Abstract: An interference-type torque split differential includes a differential housing, a first differential gear and an interference-type torque split module. The first differential gear is provided in the differential housing. The interference-type torque split module is provided outside the differential housing and has a second differential gear, a first brake source and a second brake source. The second differential gear is connected with the first differential gear. The first brake source and the second brake source are at two sides of the second differential gear, respectively. The first brake source or the second brake source provides multiple stages of clamping force for performing torque split.

Abstract: A dual-shaft push-moving varying speed device includes a drive unit; an input shaft, having at least an odd-numbered input gear and at least an even-numbered input gear is coupled with the drive unit; an output shaft, having an end thereof penetrate through the input shaft and the drive unit, and the another end thereof possesses an output gear; a transmission shaft, including at least an odd-numbered output gear, at least an even-numbered output gear, and a transmission gear where the odd-numbered output gear is meshed with the corresponding odd-numbered input gear while the even-numbered output gear is meshed with the corresponding even-numbered input gear, and the transmission gear is meshed with the output gear; and at least a push-moving fork, being furnished between the odd-numbered input gear and the even-numbered input gear, selectively pushes the odd-numbered input gear and the even-numbered input gear to move.

Abstract: A dual-shaft clutch varying speed device includes a drive unit, an input shaft, an output shaft, a housing, at least an odd-numbered clutch unit and at least an even-numbered clutch unit. The input shaft having an input gear is coupled with the drive unit. The output shaft, having an end thereof penetrate through the input shaft and the drive unit, has at least an odd-numbered output gear and at least an even-numbered output gear. The housing has a housing gear. The at least one odd-numbered clutch unit being furnished at the inner part of the housing has an odd-numbered clutch shaft and an odd-numbered clutch gear which is meshed with the odd-numbered output gear. The at least one odd-numbered clutch unit has an even-numbered clutch shaft and an even-numbered clutch gear which is meshed with the even-numbered output gear.

Abstract: A transmission mechanism includes first and second transmission, first and second shafts, a clutch, and a one-way bearing. In the first gear, power is output through the first driving transmission and the one-way bearing; and in the second gear, the power is output through the clutch, the second driving transmission and the one-way bearing.

Abstract: A system and a method for temperature sensing of three-dimensional integrated circuits are revealed. The three-dimensional integrated circuit is formed by stacking of a plurality of chip layers that execute specific functions. The chip layer includes a master layer and at least one slave layer. The master layer is disposed with a master temperature sensor while a first thermal conductive part is arranged at the slave layer where heat is detected. The first thermal conductive part and the master temperature sensor are connected by a thermal conductive structure. Thereby temperature of various points at different chip layers is conducted to the same chip layer by Through Silicon Vias to be measured and calibrated. The design complexity and the implementation cost of the temperature sensing system are significantly reduced.

Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.

Abstract: A replaceable optical module lamp includes a light-emitting module, a circuit board, a sealing layer, and an optical module. The circuit board and the light-emitting module are electrically connected to each other. The sealing layer encloses the light-emitting module and the circuit board and includes a first assembling structure. The optical module is assembled to the sealing layer and is provided with an assembling hole. The assembling hole of the optical module is surroundingly connected to the sealing layer, so that the light-emitting module is disposed in the optical module. The optical module is provided with a second assembling structure detachably assembled to the first assembling structure to facilitate replacement. Accordingly, cost is reduced, and the optical module can be replaced with ease.

Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.

Abstract: A method for manufacturing an organic light emitting display panel is disclosed. The organic light emitting display panel includes a substrate. The method includes forming a plurality of bank arrays, each of which has a plurality of banks, utilizing a plurality of ink-jet heads, each of which has a plurality of nozzles arranged alternately, to move relative to the substrate along a moving direction perpendicular to a border of the substrate, and utilizing at least one of the plurality of nozzles to drop organic light emitting ink for forming at least one organic light emitting pixel in at least one bank. An oblique angle is formed between an arrangement direction of the plurality of banks and the border of the substrate. Each ink-jet head forms the oblique angle cooperatively with the border of the substrate.

Abstract: A light emitting diode bulb includes a driving circuit board, a lighting unit, and a housing. The driving circuit board has one or more extending parts formed on one side, and a group of electrically connecting pins are disposed on the other side. An electrode is attached to one surface of each of the extending parts. The lighting unit is electrically connected to the electrodes. The housing packages the driving circuit board and the lighting unit, the electrically connected pins extend beyond the housing. The light emitting bulb has advantages of easy manufacture and low cost since the driving circuit board is electrically connected to the lighting unit directly and the housing then packages the driving circuit board and the lighting unit.

Abstract: The present invention provides a sand art simulation system and method, which transfers an image into sand art. Analyze contour lines and feature points of objects in the image to find out which contour line can be drawn at the same time. Divide the image into a plurality of blocks, and analyze sand spilling ways at each block. Simulate sand floating in the air, moving and heaping to make a sand-spread plane. Then draw the contour lines on the sand-spread plane to show the sand art of the image.

Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.

Abstract: A pesticide-free physically pest-isolating transparent polymeric film is formed of a plastic film that has a thickness of 0.03˜1.00 mm and is perforated to include a plurality of holes. The holes have a hole size of 1˜30 mm and a distribution density of 1000˜200000 holes/M2 on the plastic film. The pesticide-free physically pest-isolating transparent polymeric film is proven as a simple but very effective way of pest control. It helps plants fully grow without being attacked by pests in a pesticide-free condition. Further, the pesticide-free physically pest-isolating transparent polymeric film is repeatedly usable, and is therefore an easily operable and economical agricultural aid ideal for use.

Abstract: A pesticide-free physically pest-isolating transparent polymeric film is formed of a plastic film that has a thickness of 0.03˜1.00 mm and is perforated to include a plurality of holes. The holes have a hole size of 1˜30 mm and a distribution density of 1,000˜200,000 holes/M2 on the plastic film. The pesticide-free physically pest-isolating transparent polymeric film is proven as a simple but very effective way of pest control. It helps plants fully grow without being attacked by pests in a pesticide-free condition. Further, the pesticide-free physically pest-isolating transparent polymeric film is repeatedly usable, and is therefore an easily operable and economical agricultural aid ideal for use.

Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.

Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.

Abstract: A system and a method for temperature sensing of three-dimensional integrated circuits are revealed. The three-dimensional integrated circuit is formed by stacking of a plurality of chip layers that execute specific functions. The chip layer includes a master layer and at least one slave layer. The master layer is disposed with a master temperature sensor while a first thermal conductive part is arranged at the slave layer where heat is detected. The first thermal conductive part and the master temperature sensor are connected by a thermal conductive structure. Thereby temperature of various points at different chip layers is conducted to the same chip layer by Through Silicon Vias to be measured and calibrated. The design complexity and the implementation cost of the temperature sensing system are significantly reduced.