Patents by Inventor Peng Zou

Peng Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096117
    Abstract: Passive components located outside the IC increase the area of the package and are connected to the circuits inside the IC by long electrical paths that may have high resistance as well as parasitic inductance and capacitance. An IC includes interconnect layers on a surface of a substrate comprising circuits, and the interconnect layers include stacked thin-film inductors formed in interconnect layers to provide noise protection for input signals provided to circuits in the IC while reducing an area of an IC package. The stacked thin-film inductors include a first thin-film inductor stacked between a second thin-film inductor and the surface of the substrate in a direction orthogonal to the surface of the substrate. The thin-film inductors can be formed of layers of magnetic material around a linear interconnect. The interconnect layers may be formed in a back end of line process on one surface of a substrate.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 20, 2025
    Inventors: Anshih Tseng, Peng Zou, Joseph Dibene, Gerard Williams
  • Patent number: 12241378
    Abstract: A gas turbine overspeed protection method includes: a power utilization load of a generator is acquired, and a rotating speed value of a gas turbine is acquired; whether the power utilization load suddenly decreases or disappears is judged, and if so, an eddy current retarder is controlled by a controller to simulate the power utilization load to provide a braking torque for the generator; or, whether the rotating speed value exceeds a set speed range is judged, and if so, the gas turbine is controlled by the controller to reduce fuel supply, and a discharge valve of a gas compressor is opened to discharge a high-pressure gas to reduce the power output and the rotating speed of the gas turbine.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: March 4, 2025
    Assignee: YANTAI JEREH PETROLEUM EQUIPMENT & TECHNOLOGIES CO., LTD.
    Inventors: Dekun Tian, Tao Kou, Wanchun Cha, Zhijie Liu, Xin Li, Jianglei Zou, Libin Zhou, Xu Liu, Zhuqing Mao, Rikui Zhang, Peng Zhang, Jianwei Wang, Jihua Wang, Xiaolei Ji, Xincheng Li, Yuxuan Sun, Yipeng Wu, Chunqiang Lan, Liang Lv
  • Patent number: 12234712
    Abstract: This disclosure generally relates to power generation methods and systems based on gas turbine engines, and particularly to mobile and adaptive power generation systems and methods based on gas turbine engine for supplying mechanical and/or electrical power for fracturing operations at an oil wellsite. Various systems, platforms, components, devices, and methods are provided for flexibly and adaptively configure one of more gas turbines, hydraulic pumps, and electric generators to support both fracturing and electric demands at a well site. The disclosed implementations enable and facilitate a mobile, adaptive, and reconfigurable power system to provide both mechanical and electric power for hydraulic fracturing operation.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: February 25, 2025
    Assignee: Yantai Jereh Petroleum Equipment & Technologies Co., Ltd.
    Inventors: Peng Zhang, Liang Lv, Rikui Zhang, Zhuqing Mao, Jianwei Wang, Chunqiang Lan, Yipeng Wu, Xincheng Li, Ning Feng, Ting Zhang, Jianglei Zou, Haibo Zhang, Ligong Wu, Cong Zhang, Wanchun Zha, Qiong Wu, Jifeng Zhong
  • Patent number: 12221384
    Abstract: A crack self-healing functionally gradient material for ceramic cutting tools and a preparation method thereof. The material for ceramic cutting tools has a symmetrical gradient structure, and based on the percentage by mass, components of each layer include 50%-80% of Ti(C7,N3), 25%-5% of (W7,Ti3)C and 20%-0% of TiSi2; contents of components of layers that are symmetrical relative to a central layer are the same and a thickness is symmetrically distributed; a content of Ti(C7,N3) gradually increases from the surface layer to the central layer, contents of (W7,Ti3)C and TiSi2 gradually decrease by 5% from the surface layer to the central layer, and the contents of Ni and Mo gradually increase from the surface layer to the central layer.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: February 11, 2025
    Assignees: SHANDONG UNIVERSITY, YANSHAN UNIVERSITY
    Inventors: Chuanzhen Huang, Xinyao Cui, Hanlian Liu, Zhenyu Shi, Peng Yao, Xiaolan Bai, Zhen Wang, Longhua Xu, Dun Liu, Shuiquan Huang, Hongtao Zhu, Bin Zou
  • Patent number: 12202060
    Abstract: A milling machine fly-cutter with adjustable cutting-tool geometric angle and milling machine includes a fly-cutter plate body, a plurality of combination grooves are evenly set in the circumferential direction of the fly-cutter plate body, and adjusting assemblies are mounted in the combination grooves. Wherein, the adjusting assemblies include an adjusting block for rake angle and relief angle, an adjusting block for tool cutting edge angle and minor cutting edge angle, an adjusting block for tool cutting edge inclination angle. A first side of the adjusting block is attached with a cutter handle, and a second side is connected with the adjusting block for rake angle and relief angle by the adjusting block for tool cutting edge angle and minor cutting edge angle. The milling machine fly-cutter realizes adjustment of the geometric angles of cutting tool, and is able to adapt to cutter handles of a variety of different specifications.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 21, 2025
    Assignee: SHANDONG UNIVERSITY
    Inventors: Chuanzhen Huang, Zhen Chen, Hanlian Liu, Hongtao Zhu, Bin Zou, Peng Yao, Jun Wang
  • Publication number: 20250020055
    Abstract: A method for processing fused “underground+ground” data in deep formation exploration includes: collecting underground multi-source data by an underground intelligent probing rod, preprocessing the multi-source data to obtain an original digital signal, storing the original digital signal in an underground memory, obtaining continuous depth data by a ground device; performing high-bitrate and low-bitrate compression on the original digital signal, and modulating compressed signals; driving modulated signals by power, so the modulated signal is transmitted in a drilling stem with cable in a form of a power line carrier and then output, or first transmitted in a first section of the drilling stem with cable, re-collected in a short drill pipe with repeater, re-emitted to a second section of the drilling stem with cable, and then output; when a transmission line is disconnected, synchronizing and fusing data; and finally using fused data and the data output by the transmission line as final output data.
    Type: Application
    Filed: December 28, 2023
    Publication date: January 16, 2025
    Applicants: CHINA UNIVERSITY OF GEOSCIENCES (WUHAN), Institute of Rock and Soil Mechanics, Chinese Academy of Sciences
    Inventors: Yuyong JIAO, Xuefeng YAN, Yule HU, Zengqiang HAN, Yiteng WANG, Luyi SHEN, Junpeng ZOU, Fei ZHENG, Peng ZHANG
  • Publication number: 20250022151
    Abstract: A method for aligning a laser point cloud and an image based on deep learning includes: collecting data by using a laser ladar and a camera, to obtain laser point cloud data and a two-dimensional (2D) image respectively; dividing preprocessed point cloud data into triangular meshes to obtain a three-dimensional (3D) mesh model of the point cloud data; determining a relative location relationship between a laser radar and the multi-function camera, and constructing a virtual camera in the 3D mesh model to capture a simulated 2D image at a same location and angle as those of the camera; and aligning, by using a convolution neural network (CNN), the 2D image captured by the camera and the simulated 2D image captured by the virtual camera to generate aligned images that map onto each other.
    Type: Application
    Filed: December 28, 2023
    Publication date: January 16, 2025
    Applicants: CHINA UNIVERSITY OF GEOSCIENCES (WUHAN), Institute of Rock and Soil Mechanics, Chinese Academy of Sciences
    Inventors: Xuefeng YAN, Yuyong JIAO, Yule HU, Zengqiang HAN, Yiteng WANG, Luyi SHEN, Junpeng ZOU, Fei ZHENG, Peng ZHANG
  • Patent number: 12161976
    Abstract: Provided by the present invention is a method for preparing a porous polymer semipermeable membrane, wherein a hydrophobic polynorbornene polymer and a hydrophilic small-molecule crosslinking agent containing a thiol functional group are mixed and dissolved in a solvent capable of dissolving both of them to obtain a coating solution; the coating solution is applied onto the surface of a biosensor electrode and dried such that the hydrophobic component and the hydrophilic component undergo phase separation; then, a membrane is formed and crosslinking is carried out, the unreacted hydrophilic small-molecule crosslinking agent is removed, and re-drying is carried out to obtain a porous polymer semipermeable membrane; also disclosed is a product.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: December 10, 2024
    Assignee: Dreisam (Beijing) Medical Technology Co., Ltd.
    Inventor: Peng Zou
  • Publication number: 20240372772
    Abstract: This application provides a communication method and apparatus in a high-frequency scenario. The method includes: A transmit-end device may modulate S bitstreams according to a mapping rule corresponding to a first modulation scheme for a higher-order modulation signal to be received by a receive-end device, to generate M lower-order modulation signals, where S is equal to 1 or M, and M is an integer greater than or equal to 2; and then send the M lower-order modulation signals through a line of sight LOS channel, so that a modulation order of a signal transmitted by a transmit end can be reduced.
    Type: Application
    Filed: July 1, 2024
    Publication date: November 7, 2024
    Inventors: Meng Shi, Rongkuan Liu, Jiayin Zhang, Peng Zou
  • Publication number: 20240356790
    Abstract: Embodiments of this application disclose a modulation method. A first communication apparatus generates a first symbol stream based on a symbol type quantity, a probability distribution corresponding to a first symbol of each symbol type, a bit quantity corresponding to each first symbol, and a first original bit stream, the bit quantity corresponding to each first symbol is a bit quantity required by each first symbol that is represented by using a bit, and first symbols of different symbol types correspond to different probability distributions and/or different signal amplitudes; and the first communication apparatus generates a first quadrature amplitude modulation (QAM) symbol stream based on the first symbol stream and a second original bit stream.
    Type: Application
    Filed: June 25, 2024
    Publication date: October 24, 2024
    Inventors: Meng SHI, Peng ZOU, Jiayin ZHANG
  • Publication number: 20240356793
    Abstract: Embodiments of this application disclose a modulation method, a demodulation method, and a related apparatus. A first communication apparatus can ensure, by performing technical solutions of this application, a shaping gain brought by using probabilistic constellation shaping modulation in a high-frequency scenario. The method in embodiments of this application includes: The first communication apparatus determines probability distributions of constellation points in a target probabilistic shaping constellation diagram based on a Maxwell-Boltzmann distribution parameter and a phase noise parameter. The first communication apparatus modulates a first original bit stream and a second original bit stream based on the probability distributions of the constellation points in the target probabilistic shaping constellation diagram, to obtain a first quadrature amplitude modulation QAM symbol stream.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 24, 2024
    Inventors: Meng Shi, Peng Zou, Jiayin Zhang
  • Patent number: 12117214
    Abstract: A compressor includes a housing, and a drive assembly, a compression assembly and an expansion assembly which are provided in the housing; the compression assembly is connected to and driven by the drive assembly, and is configured to perform multi-stage compression on a refrigerant under drive of the drive assembly; the expansion assembly is connected to the drive assembly and is configured to expand the refrigerant compressed by the compression assembly. A refrigeration cycle device includes the above-mentioned compressor.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 15, 2024
    Assignee: Gree Green Refrigeration Technology Center Co., Ltd. of Zhuhai
    Inventors: Yusheng Hu, Huijun Wei, Peng Zou, Ouxiang Yang, Jian Wu
  • Publication number: 20240258364
    Abstract: An integrated circuit (IC) package, including an integrated circuit (IC) die including an input/output (I/O) pad, and a vertical thin-film inductor (TFI) extending vertically substantially from the I/O pad to a solder bump.
    Type: Application
    Filed: December 6, 2023
    Publication date: August 1, 2024
    Inventors: Anshih TSENG, Peng ZOU, Joseph DIBENE, Gerard WILLIAMS
  • Publication number: 20240105762
    Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Peng Zou, Syrus Ziai
  • Patent number: 11925460
    Abstract: A biosensor for determining an analyte is disclosed. The sensor has a sensor module covered at least partially by a biocompatibility layer. The biocompatibility layer has a polymer having —CO—NR1R2 side groups, wherein R1 and R2 are independently selected from —H and C1 to C6 alkyl. A method for producing the biosensor, as well as to uses and methods of using related to the biosensor, are also disclosed.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 12, 2024
    Assignee: Roche Diabetes Care, Inc.
    Inventor: Peng Zou
  • Publication number: 20240072023
    Abstract: An aspect relates to a method of forming an integrated circuit (IC) package, including: forming a thin-film inductor (TFI) over a first dummy carrier wafer; attaching an integrated circuit (IC) die to and over the TFI; attaching a second dummy carrier wafer to and over the IC die; removing the first dummy carrier wafer from the TFI; attaching at least one solder bump to and under the TFI; and removing the second dummy carrier wafer from the IC die. Another aspect relates to a method of forming an IC package, including forming a first redistribution layer (RDL) over a through-silicon via (TSV); forming a second RDL under the TSV; forming a thin-film inductor (TFI) over the first RDL; and attaching at least one integrated circuit (IC) die to the second RDL or the TFI.
    Type: Application
    Filed: February 22, 2023
    Publication date: February 29, 2024
    Inventors: Anshih TSENG, Peng ZOU
  • Patent number: 11881783
    Abstract: An electronic device has a power rail that is driven by voltage regulators and provides a rail voltage. Each voltage regulator has an output interface electrically coupled to the power rail to deliver up to a predefined regulator current to the power rail. In each voltage regulator, a voltage regulator controller has an input coupled to the output interface by a feedback path and controls a drive path coupled to the output interface. A bypass unit is coupled to the drive path and voltage regulator controller and operates in a standby mode or an operational mode. In the standby mode, the bypass unit bypasses the feedback path and the respective voltage regulator does not deliver current to the power rail, while in the operational mode, the bypass unit does not bypass the feedback path and the respective voltage regulator delivers up to the predefined regulator current to the power rail.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: January 23, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Peng Zou, Xijian Lin, Gang Ren, Joseph Dibene, Syrus Ziai
  • Patent number: 11855124
    Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: December 26, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Peng Zou, Syrus Ziai
  • Publication number: 20230387181
    Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.
    Type: Application
    Filed: April 13, 2023
    Publication date: November 30, 2023
    Inventors: Peng ZOU, Syrus ZIAI
  • Publication number: 20230311068
    Abstract: Provided by the present invention is a method for preparing a porous polymer semipermeable membrane, wherein a hydrophobic polynorbornene polymer and a hydrophilic small-molecule crosslinking agent containing a thiol functional group are mixed and dissolved in a solvent capable of dissolving both of them to obtain a coating solution; the coating solution is applied onto the surface of a biosensor electrode and dried such that the hydrophobic component and the hydrophilic component undergo phase separation; then, a membrane is formed and crosslinking is carried out, the unreacted hydrophilic small-molecule crosslinking agent is removed, and re-drying is carried out to obtain a porous polymer semipermeable membrane; also disclosed is a product.
    Type: Application
    Filed: September 8, 2021
    Publication date: October 5, 2023
    Inventor: Peng Zou