Abstract: A hydrogel for cell-laden bioprinting, bioink, and a preparation method and an application thereof, relates to the technical field of biomedical polymer hydrogels. The hydrogel for cell-laden bioprinting is polymer gel formed by adding a cell-specific material into a matrix of alginate and gelatin and crosslinking and curing, wherein the cell-specific material is polypeptide selected according to different laden cells. The structures printed using the hydrogel may have the advantages such as adjustable mechanical properties, adjustable porosity, high biocompatibility, high printing accuracy, and high customizability, which may widely support the printing of human tissues and organs such as spinal cord, cartilage, and heart, and has good prospects for applications in tissue repair, organ transplantation and so on.

Abstract: A device for defibrillation and monitoring, a monitoring component, and a component for defibrillation and monitoring, are disclosed. The device for defibrillation and monitoring includes a host and a monitoring apparatus, which are assembled and disassembled through a detachably connection. The host is capable of independently performing defibrillation operations and display defibrillation information at least. Therefore, when it is necessary to go out for defibrillation operation alone, only the host is carried to medical assistance facilities. This monitoring apparatus can independently implement monitoring functions. When it is necessary to go out for implementing separate monitoring operations, just the monitoring apparatus is carried to the medical assistance facilities. Therefore, the user flexibly selects the devices they carry according to their requirements, improving the convenience of use.

Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.

Abstract: A biosensor for determining an analyte is disclosed. The sensor has a sensor module covered at least partially by a biocompatibility layer. The biocompatibility layer has a polymer having —CO—NR1R2 side groups, wherein R1 and R2 are independently selected from —H and C1 to C6 alkyl. A method for producing the biosensor, as well as to uses and methods of using related to the biosensor, are also disclosed.

Abstract: An alumina-based ceramic tool material with low thermal expansion and a preparation process thereof, accordingly, the ceramic tool material may have both the high hardness of alumina ceramics after the hot pressing sintering, and reduces the thermal expansion coefficient of the overall ceramic material by adding the Sc2W3O12 as the negative thermal expansion phase, which improves the thermal shock resistance of ceramic tools in high-speed cutting engineering and meets the requirements of large temperature range during the machining of nickel-based superalloys. Moreover, the composite material does not use metal binder and has strong thermal stability even in the high-speed machining under extreme heat-force-chemistry coupling, so it has a high machining compatibility for nickel-based superalloys.

Abstract: An aspect relates to a method of forming an integrated circuit (IC) package, including: forming a thin-film inductor (TFI) over a first dummy carrier wafer; attaching an integrated circuit (IC) die to and over the TFI; attaching a second dummy carrier wafer to and over the IC die; removing the first dummy carrier wafer from the TFI; attaching at least one solder bump to and under the TFI; and removing the second dummy carrier wafer from the IC die. Another aspect relates to a method of forming an IC package, including forming a first redistribution layer (RDL) over a through-silicon via (TSV); forming a second RDL under the TSV; forming a thin-film inductor (TFI) over the first RDL; and attaching at least one integrated circuit (IC) die to the second RDL or the TFI.

Abstract: A polymorphic network control system and a polymorphic network control system method supporting terminal mobile access. A network architecture is redesigned based on the idea of separation of an identifier from a locator. In this network mode, the three-layer protocol is no longer a traditional IP message, but a message carrying a locator and an identifier. The polymorphic SDN network controller is responsible for forwarding the data packet to a destination corresponding to a destination locator. When the network location of a mobile device is changed, the transmission connection established based on the identifier will suspend communication due to the disconnection of the physical link. When the mobile device is re-accessed and a new forwarding path is established, the transmission connection can recover communication.

Abstract: An electronic device has a power rail that is driven by voltage regulators and provides a rail voltage. Each voltage regulator has an output interface electrically coupled to the power rail to deliver up to a predefined regulator current to the power rail. In each voltage regulator, a voltage regulator controller has an input coupled to the output interface by a feedback path and controls a drive path coupled to the output interface. A bypass unit is coupled to the drive path and voltage regulator controller and operates in a standby mode or an operational mode. In the standby mode, the bypass unit bypasses the feedback path and the respective voltage regulator does not deliver current to the power rail, while in the operational mode, the bypass unit does not bypass the feedback path and the respective voltage regulator delivers up to the predefined regulator current to the power rail.

Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.

Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.

Abstract: Provided by the present invention is a method for preparing a porous polymer semipermeable membrane, wherein a hydrophobic polynorbornene polymer and a hydrophilic small-molecule crosslinking agent containing a thiol functional group are mixed and dissolved in a solvent capable of dissolving both of them to obtain a coating solution; the coating solution is applied onto the surface of a biosensor electrode and dried such that the hydrophobic component and the hydrophilic component undergo phase separation; then, a membrane is formed and crosslinking is carried out, the unreacted hydrophilic small-molecule crosslinking agent is removed, and re-drying is carried out to obtain a porous polymer semipermeable membrane; also disclosed is a product.

Abstract: A conductive ink functional material and a preparation method thereof. The conductive ink functional material is a surface-functionalized metal nanoparticle, and the surface of the metal nanoparticle is bonded to a molecule containing an electronic medium by a covalent bond. A functionalized conductive ink and a preparation method thereof. The ink is prepared from the conductive ink functional material.

Abstract: A device may receive information identifying results of a spectroscopic measurement of an unknown sample. The device may perform a first classification of the unknown sample based on the results of the spectroscopic measurement and a global classification model. The device may generate a local classification model based on the first classification. The device may perform a second classification of the unknown sample based on the results of the spectroscopic measurement and the local classification model. The device may provide information identifying a class associated with the unknown sample based on performing the second classification.

Abstract: The invention disclose a power supply circuit. The power supply circuit includes one or a plurality of first-stage voltage conversion circuits and one or a plurality of second-stage voltage conversion circuits; an input end of the first-stage voltage conversion circuit is coupled to a power supply; the first-stage voltage conversion circuit is configured to convert a first voltage received at the input end into a second voltage, where the second voltage is less than the first voltage; an input end of the second-stage voltage conversion circuit is coupled to an output end of the first-stage voltage conversion circuit; the second-stage voltage conversion circuit is configured to convert the second voltage into a third voltage, and supply the third voltage to a load.

Abstract: The invention disclose a power supply circuit. The power supply circuit includes one or a plurality of first-stage voltage conversion circuits and one or a plurality of second-stage voltage conversion circuits; an input end of the first-stage voltage conversion circuit is coupled to a power supply; the first-stage voltage conversion circuit is configured to convert a first voltage received at the input end into a second voltage, where the second voltage is less than the first voltage; an input end of the second-stage voltage conversion circuit is coupled to an output end of the first-stage voltage conversion circuit; the second-stage voltage conversion circuit is configured to convert the second voltage into a third voltage, and supply the third voltage to a load.

Abstract: A device may receive information identifying results of a spectroscopic measurement of an unknown sample. The device may perform a first classification of the unknown sample based on the results of the spectroscopic measurement and a global classification model. The device may generate a local classification model based on the first classification. The device may perform a second classification of the unknown sample based on the results of the spectroscopic measurement and the local classification model. The device may provide information identifying a class associated with the unknown sample based on performing the second classification.

Abstract: A semiconductor device has a power rail that provides a rail voltage. The power rail is electrically coupled to a plurality of voltage regulators, and each voltage regulator includes an output interface electrically coupled to the power rail, and a first drive path and a second drive path both coupled to the output interface, and an intra-regulator balancing circuit. The first and second drive paths are coupled in parallel with each other, and operate during a first phase and a second phase, at an operating frequency, to provide a first path current and a second path current to the power rail, respectively. The intra-regulator balancing circuit senses the first and second path currents and controls a first duty cycle of the first phase and/or a second duty cycle of the second phase based on a difference of the first and second path currents.

Abstract: A semiconductor device includes a plurality of voltage regulators arranged in a field programmable array and a power array controller coupled to the plurality of voltage regulators. The power array controller is configured to control the plurality of voltage regulators to output power to a plurality of power rails. Each power rail provides a respective rail current at a respective rail voltage. The power array controller is configured to for each of the plurality of power rails, determine the respective rail current associated with the respective power rail, select a subset of voltage regulators according to at least the respective rail current, and enable the subset of voltage regulators to generate the respective rail voltage and provide the respective rail current collectively.

Abstract: The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.

Abstract: Some embodiments of the present disclosure provide a compressor and an air conditioner with the compressor. The compressor includes: a first compression part, a second compression part, an intermediate cavity and an intermediate passage. Refrigerant discharged from the first compression part enters the intermediate cavity. The intermediate passage communicates with the intermediate cavity and an inner cavity of the second compression part. A bottom port of the intermediate passage is located at a bottom of the intermediate cavity, and air supplement refrigerant and/or the refrigerant discharged from the first compression part are used to convey accumulated oil in the intermediate cavity to the inner cavity of the second compression part. When only the refrigerant is used to convey the accumulated to the inner cavity of the second compression part, at least a part of the intermediate passage is located outside of a housing assembly of the compressor.