Abstract: The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.

Abstract: Some embodiments of the present disclosure provide a compressor and an air conditioner with the compressor. The compressor includes: a first compression part, a second compression part, an intermediate cavity and an intermediate passage. Refrigerant discharged from the first compression part enters the intermediate cavity. The intermediate passage communicates with the intermediate cavity and an inner cavity of the second compression part. A bottom port of the intermediate passage is located at a bottom of the intermediate cavity, and air supplement refrigerant and/or the refrigerant discharged from the first compression part are used to convey accumulated oil in the intermediate cavity to the inner cavity of the second compression part. When only the refrigerant is used to convey the accumulated to the inner cavity of the second compression part, at least a part of the intermediate passage is located outside of a housing assembly of the compressor.

Abstract: An electronic device has a power rail that is driven by voltage regulators and provides a rail voltage. Each voltage regulator has an output interface electrically coupled to the power rail to deliver up to a predefined regulator current to the power rail. In each voltage regulator, a voltage regulator controller has an input coupled to the output interface by a feedback path and controls a drive path coupled to the output interface. A bypass unit is coupled to the drive path and voltage regulator controller and operates in a standby mode or an operational mode. In the standby mode, the bypass unit bypasses the feedback path and the respective voltage regulator does not deliver current to the power rail, while in the operational mode, the bypass unit does not bypass the feedback path and the respective voltage regulator delivers up to the predefined regulator current to the power rail.

Abstract: A spectroscopic assembly may include a spectrometer. The spectrometer may include an illumination source to generate a light to illuminate a sample. The spectrometer may include a sensor to obtain a spectroscopic measurement based on light, reflected by the sample, from the light illuminating the sample. The spectroscopic assembly may include a light pipe to transfer the light reflected from the sample. The light pipe may include a first opening to receive the spectrometer. The light pipe may include a second opening to receive the sample, such that the sample is enclosed by the light pipe and a base surface when the sample is received at the second opening. The light pipe may be associated with aligning the illumination source and the sensor with the sample.

Abstract: A spectroscopic assembly may include a spectrometer. The spectrometer may include an illumination source to generate a light to illuminate a sample. The spectrometer may include a sensor to obtain a spectroscopic measurement based on light, reflected by the sample, from the light illuminating the sample. The spectroscopic assembly may include a light pipe to transfer the light reflected from the sample. The light pipe may include a first opening to receive the spectrometer. The light pipe may include a second opening to receive the sample, such that the sample is enclosed by the light pipe and a base surface when the sample is received at the second opening. The light pipe may be associated with aligning the illumination source and the sensor with the sample.

Abstract: A semiconductor device includes a plurality of voltage regulators arranged in a field programmable array and a power array controller coupled to the plurality of voltage regulators. The power array controller is configured to control the plurality of voltage regulators to output power to a plurality of power rails. Each power rail provides a respective rail current at a respective rail voltage. The power array controller is configured to for each of the plurality of power rails, determine the respective rail current associated with the respective power rail, select a subset of voltage regulators according to at least the respective rail current, and enable the subset of voltage regulators to generate the respective rail voltage and provide the respective rail current collectively.

Abstract: A semiconductor device has a power rail that provides a rail voltage. The power rail is electrically coupled to a plurality of voltage regulators, and each voltage regulator includes an output interface electrically coupled to the power rail, and a first drive path and a second drive path both coupled to the output interface, and an intra-regulator balancing circuit. The first and second drive paths are coupled in parallel with each other, and operate during a first phase and a second phase, at an operating frequency, to provide a first path current and a second path current to the power rail, respectively. The intra-regulator balancing circuit senses the first and second path currents and controls a first duty cycle of the first phase and/or a second duty cycle of the second phase based on a difference of the first and second path currents.

Abstract: A semiconductor device includes a substrate having a surface and a thin film inductor formed on top of the surface of the substrate and having a conductive wire, a first stack of magnetic layers and a second stack of magnetic layers. The conductive wire is disposed between the first and second stacks of magnetic layers, and the thin film inductor is configured to provide a magnetic field in the first and second stacks of magnetic layers in response to a current passing through the conductive wire. The first stack of magnetic layers has a first edge portion extending in parallel with a longitudinal axis of the conductive wire, and the second stack of magnetic layers has a second edge portion that covers the first edge portion conformally and is separated from the first edge portion by an insulation layer.

Abstract: This disclosure relates to a process for forming a membrane on an analyte sensor and further relates to an analyte sensor obtainable by this process. This disclosure also relates to a process for forming a sensing layer on an electrode of an analyte sensor and to an analyte sensor having the sensing layer obtainable by the inventive process as well as the membrane obtainable by the inventive process. The analyte sensors obtainable by the inventive processes may be used for conducting an analyte measurement of a body fluid of a user or a patient. This disclosure may be applied in the field of home care as well as in the field of professional care, such as in hospitals. Other applications are generally feasible.

Abstract: The invention disclose a power supply circuit. The power supply circuit includes one or a plurality of first-stage voltage conversion circuits and one or a plurality of second-stage voltage conversion circuits; an input end of the first-stage voltage conversion circuit is coupled to a power supply; the first-stage voltage conversion circuit is configured to convert a first voltage received at the input end into a second voltage, where the second voltage is less than the first voltage; an input end of the second-stage voltage conversion circuit is coupled to an output end of the first-stage voltage conversion circuit; the second-stage voltage conversion circuit is configured to convert the second voltage into a third voltage, and supply the third voltage to a load.

Abstract: A device may receive training spectral data associated with a manufacturing process that transitions from an unsteady state to a steady state. The device may generate, based on the training spectral data, a plurality of iterations of a support vector machine (SVM) classification model. The device may determine, based on the plurality of iterations of the SVM classification model, a plurality of predicted transition times associated with the manufacturing process. A predicted transition time, of the plurality of predicted transition times, may identify a time, during the manufacturing process, that a corresponding iteration of the SVM classification model predicts that the manufacturing process transitioned from the unsteady state to the steady state. The device may generate, based on the plurality of predicted transition times, a final SVM classification model associated with determining whether the manufacturing process has reached the steady state.

Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.

Abstract: A semiconductor device includes a substrate having a surface and a thin film inductor formed on top of the surface of the substrate and having a conductive wire, a first stack of magnetic layers and a second stack of magnetic layers. The conductive wire is disposed between the first and second stacks of magnetic layers, and the thin film inductor is configured to provide a magnetic field in the first and second stacks of magnetic layers in response to a current passing through the conductive wire. The first stack of magnetic layers has a first edge portion extending in parallel with a longitudinal axis of the conductive wire, and the second stack of magnetic layers has a second edge portion that covers the first edge portion conformally and is separated from the first edge portion by an insulation layer.

Abstract: Compressor and a refrigeration cycle device, relating to the field of refrigeration technology. The compressor includes a housing, and a drive assembly, a compression assembly and an expansion assembly which are provided in the housing; the compression assembly is connected to and driven by the drive assembly, and is configured to perform multi-stage compression on a refrigerant under drive of the drive assembly; the expansion assembly is connected to the drive assembly and is configured to expand the refrigerant compressed by the compression assembly. A refrigeration cycle device includes the compressor.

Abstract: A device may receive training spectral data associated with a manufacturing process that transitions from an unsteady state to a steady state. The device may generate, based on the training spectral data, a plurality of iterations of a support vector machine (SVM) classification model. The device may determine, based on the plurality of iterations of the SVM classification model, a plurality of predicted transition times associated with the manufacturing process. A predicted transition time, of the plurality of predicted transition times, may identify a time, during the manufacturing process, that a corresponding iteration of the SVM classification model predicts that the manufacturing process transitioned from the unsteady state to the steady state. The device may generate, based on the plurality of predicted transition times, a final SVM classification model associated with determining whether the manufacturing process has reached the steady state.

Abstract: Memory security technologies are described. An example processing device includes a processor core and a memory controller coupled to the processor core and a memory. The processor core can determine that an exit condition to transfer control of a resource for a processor core from a first virtual machine monitor (VMM) to a second VMM has occurred. The processor core can also determine whether a control virtual machine control structure (VMCS) link pointer is valid. The processor core can also determine whether a reason value corresponding to the control VMCS link pointer is set. The processor core can also determine whether the reason value is set to zero. The processor core can also determining whether an exception bit corresponding to a specific exception type of a reason value is set. The processor core can also transfer a control of the resource from the first VMM to the second VMM.

Abstract: A method includes decomposing a training set to obtain a principal component matrix having a plurality of principal component vectors. The method also includes variably rejecting portions of a sample spectrum vector that do not correspond to a selected one of the plurality of principal component vectors by incrementally providing a coefficient indicative of the weighting of the selected principal component vector for selected sub-regions. A corrected spectrum vector can be obtained by excluding certain sub-regions of the sample spectrum vector and corresponding principal component vector, multiplying the sample spectrum vector with the principal component matrix for non-excluded sub-regions, providing a predicted interference vector, and subtracting the predicted interference vector from the sample spectrum vector.

Abstract: A processing system includes a first register to store an invalidation mode flag associated with a virtual processor identifier (VPID) and a processing core, communicatively coupled to the first register, the processing core comprising a logic circuit to execute a virtual machine monitor (VMM) environment, the VMM environment comprising a root mode VMM supporting a non-root mode VMM, the non-root mode VMM to execute a virtual machine (VM) identified by the VPID, the logic circuit further comprising an invalidation circuit to execute a virtual processor invalidation (INVVPID) instruction issued by the non-root mode VMM, the INVVPID instruction comprising a reference to an INVVPID descriptor that specifies a linear address and the VPID and responsive to determining that the invalidation mode flag is set, invalidate, without triggering a VM exit event, a memory address mapping associated with the linear address.

Abstract: The systems and methods for enabling a lightweight VMM to efficiently interrupt virtual machines are provided. In some examples, the lightweight VMM is configured to utilize a self IPI to deliver external interrupts to the virtual machines. The self IPI may be generated by writing one or more values, including an identifier of the external interrupt, to an ICR of a programmable interrupt controller. The programmable interrupt controller may retrieve the one or more values from the ICR, identify the external interrupt and process the external interrupt, which culminates in the external interrupt being written to an IDT of a virtual machine targeted for interrupt delivery by the lightweight VMM.

Abstract: This disclosure relates to a biosensor for determining an analyte comprising a sensor module covered at least partially by a biocompatibility layer, wherein said biocompatibility layer comprises a polymer having —CO—NR1R2 side groups, wherein R1 and R2 are independently selected from —H and C1 to C6 alkyl. This disclosure further relates to a method for producing the biosensor, as well as to uses and methods of using related to the biosensor.