Patents by Inventor Pengkai Ji

Pengkai Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978584
    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: May 7, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Shouyu Hong, Jianping Ying, Jianhong Zeng, Chaofeng Cai, Ganyu Zhou, Pengkai Ji
  • Publication number: 20240105690
    Abstract: A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Inventors: Pengkai JI, Shouyu HONG, Haoyi YE, Jianhong ZENG
  • Patent number: 11937328
    Abstract: This disclosure relates to techniques for a wireless device to perform millimeter wavelength communication with increased reliability and power efficiency using sensor inputs. The sensor inputs may include motion, rotation, or temperature measurements, among various possibilities. The sensor inputs may be used when performing beamforming tracking, antenna configuration, transmit and receive chain measurements and selection, and/or in any of various other possible operations.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: March 19, 2024
    Assignee: Apple Inc.
    Inventors: Wei Zhang, Pengkai Zhao, Shiva Krishna Narra, Sriram Subramanian, Madhukar K. Shanbhag, Sanjeevi Balasubramanian, Junsung Lim, Jia Tang, Galib A. Mohiuddin, Yu-Lin Wang, Zhu Ji, Johnson O. Sebeni
  • Publication number: 20240080780
    Abstract: Apparatuses, systems, and methods for providing maximum transmit power control when utilizing multiple radio access technologies. For example, a wireless communication device comprising two cellular radios may intend to transmit on the first radio, while concurrently transmitting on the second radio. To ensure compliance with a maximum transmit power limitation, the device may determine an allowed transmit power level of the first radio, representing a difference between the maximum transmit power limitation and the current transmit power level being transmitted by the second radio. The device may also determine a threshold power level for a communication by the first radio. If the allowed transmit power level meets the threshold power level, then the device may transmit the first communication having a power level between the threshold power level and the allowed transmit power level. Otherwise, the device may forego transmission of the first communication.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 7, 2024
    Inventors: Haitong Sun, Johnson O. Sebeni, Zhu Ji, Dawei Zhang, Wei Zhang, Yuchul Kim, Tianyan Pu, Pengkai Zhao, Wei Zeng, Jia Tang, Ping Wang, Wanping Zhang, Yang Li
  • Patent number: 11901113
    Abstract: Provided are an inversely coupled inductor and a power module. The inversely coupled inductor includes a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. The power supply module includes the above inversely coupled inductor, which is in turn stacked on, and electrically connected to, the packaged chip module. By arranging the two windings to cross with each other on the outside of the first passage of the magnetic core, the same type terminal (such as input pins or output pins) of the inversely coupled inductor can be located on the same side.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: February 13, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Pengkai Ji, Jinping Zhou, Shouyu Hong, Jianhong Zeng
  • Patent number: 11876084
    Abstract: A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: January 16, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Pengkai Ji, Shouyu Hong, Haoyi Ye, Jianhong Zeng
  • Patent number: 11855550
    Abstract: The disclosure provides a power supply module, including a transformer including magnetic core and winding, and a rectifier circuit electrically connected to the winding, wherein the magnetic core further comprises: a first and a second cover plate opposite to each other; a first magnetic column; and a second magnetic column having a magnetic flux in opposite direction to that of the first magnetic column, the first and second magnetic column connected between the first and the second cover plate; the winding further includes: a first winding wound onto the first magnetic column; and a second winding wound onto the second magnetic column, wherein the first and second winding have a shared winding portion at least partially located between the first and second magnetic column; the rectifier circuit includes a plurality of rectifier components including first to fourth rectifier component electrically connected to form a full bridge rectifier circuit.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: December 26, 2023
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Pengkai Ji, Yibing Cheng
  • Patent number: 11812545
    Abstract: The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: November 7, 2023
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu Hong, Qingdong Chen, Sansan Guo, Wulong Cong, Yiqing Ye, Chongfeng Zheng, Ganyu Zhou, Pengkai Ji
  • Patent number: 11758645
    Abstract: The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: September 12, 2023
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu Hong, Qingdong Chen, Sansan Guo, Wulong Cong, Yiqing Ye, Chongfeng Zheng, Ganyu Zhou, Pengkai Ji
  • Publication number: 20230253149
    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Shouyu HONG, Jianping YING, Jianhong ZENG, Chaofeng CAI, Ganyu ZHOU, Pengkai JI
  • Publication number: 20230207539
    Abstract: A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Inventors: Pengkai JI, Shouyu HONG, Haoyi YE, Jianhong ZENG
  • Patent number: 11676756
    Abstract: Provided are a coupled inductor and a power module including the coupled inductor. A coupled inductor includes: a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. Another coupled inductor includes: a magnetic core, a first winding and a second winding, where the magnetic core has a first passage and a second passage in parallel, both run through the magnetic core from one end face thereof to another opposite end face, where the first winding and the second winding both penetrate the first passage and the second passage, such that differently-named terminals of the windings are located on the same end face of the magnetic core.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: June 13, 2023
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Pengkai Ji, Jinping Zhou, Shouyu Hong, Jianhong Zeng, Mingzhun Zhang, Min Zhou
  • Patent number: 11664157
    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: May 30, 2023
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Shouyu Hong, Jianping Ying, Jianhong Zeng, Chaofeng Cai, Ganyu Zhou, Pengkai Ji
  • Patent number: 11655553
    Abstract: A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 23, 2023
    Assignee: YUANZHI TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventor: Pengkai Ji
  • Patent number: 11621254
    Abstract: A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: April 4, 2023
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Pengkai Ji, Shouyu Hong, Haoyi Ye, Jianhong Zeng
  • Patent number: 11590695
    Abstract: A photocuring printing system. A developing drum is rotatable and is light-transmissive; the developing drum and a carrier are oppositely arranged and movable with respect to each other; the developing drum has a developing surface on which an electrostatic latent image is formed by the developing engine; a feeder and the developing surface are oppositely arranged; during a rotation of the developing drum, a photocurable material provided by the feeder is selectively attracted by the electrostatic latent image to form a material layer on the developing surface; the material layer is applied, by the developing drum, on a forming surface of the carrier or a cured model on the carrier; and a curing light beam emitted by a curing light source passes through a material-laying side of the developing drum to irradiate the material layer between the developing drum and the carrier to form a cured layer.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: February 28, 2023
    Assignee: YUANZHI TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventor: Pengkai Ji
  • Publication number: 20220392688
    Abstract: The disclosure provides a magnetic element and a power supply module. The magnetic element includes a first and second magnetic column, a first winding formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part, and a second winding formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part sequentially connected. The first left/middle/right metal parts and the second left/middle/right metal parts are formed on a first substrate having a first upper and lower groove in which the first and second magnetic columns are disposed respectively. The magnetic element and the power supply module in the application use circuit boards having symmetric groove structures, the process is simple, thereby facilitating panel production mode, easy for automation, and lowering cost.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 8, 2022
    Inventors: Pengkai JI, Yuxiang ZENG
  • Publication number: 20220393609
    Abstract: A power supply module includes a power supply submodule, a plurality of pins, and a second winding unit. The power supply submodule includes a switch, a magnetic core assembly, and a first winding unit including a first winding portion and a second winding portion. The second winding unit includes a third winding portion connected to the first winding portion via some of the plurality of pins to form a first winding, and a fourth winding portion connected to the second winding portion via some of the plurality of pins to form a second winding. The magnetic core assembly, at least the first winding, and the second winding form a magnetic element. The switch is disposed on and electrically connected to the magnetic element. At least one of the plurality of pins is an output pin via which the power supply module powers an intelligent IC load.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 8, 2022
    Inventors: Pengkai JI, Yuan ZHOU
  • Publication number: 20220392696
    Abstract: A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.
    Type: Application
    Filed: May 24, 2022
    Publication date: December 8, 2022
    Inventor: Pengkai JI
  • Publication number: 20220392689
    Abstract: The disclosure provides a power supply module, including: a pin; a magnetic core including: a first and second magnetic plate arranged in parallel; a first upper wiring layer; a first middle wiring layer; a first lower wiring layer, wherein at least a part of the first upper wiring layer and the first middle wiring layer are connected to form a first winding surrounding the first magnetic plate, at least a part of the first lower wiring layer and the first middle wiring layer are connected to form a second winding surrounding the second magnetic plate. The magnetic core, the first and second winding form a magnetic element electrically connected to a switch. A magnetic loop surrounds a first axis, the first winding surrounds a second axis, the second winding surrounds a third axis, the first, second and third axis are parallel to a plane where the pin is located.
    Type: Application
    Filed: May 24, 2022
    Publication date: December 8, 2022
    Inventor: Pengkai JI