Patents by Inventor Pengkai Ji

Pengkai Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210210271
    Abstract: The present disclosure provides a multi-phase coupled inductor, a multi-phase coupled inductor array and a two-phase inverse coupled inductor. The multi-phase coupled inductor includes a magnetic core having longitudinal middle columns and windings respectively wound around the longitudinal middle columns. A magnetic flux direction of a DC magnetic flux generated by a current flowing through any one of the windings is opposite to a magnetic flux direction of a DC magnetic flux generated by a current flowing through other one of the windings, on the longitudinal middle column corresponding to the other one of the windings.
    Type: Application
    Filed: November 27, 2020
    Publication date: July 8, 2021
    Inventors: Pengkai JI, Jinping ZHOU, Mingzhun ZHANG
  • Publication number: 20210187829
    Abstract: A photocuring printing system. A developing drum is rotatable and is light-transmissive; the developing drum and a carrier are oppositely arranged and movable with respect to each other; the developing drum has a developing surface on which an electrostatic latent image is formed by the developing engine; a feeder and the developing surface are oppositely arranged; during a rotation of the developing drum, a photocurable material provided by the feeder is selectively attracted by the electrostatic latent image to form a material layer on the developing surface; the material layer is applied, by the developing drum, on a forming surface of the carrier or a cured model on the carrier; and a curing light beam emitted by a curing light source passes through a material-laying side of the developing drum to irradiate the material layer between the developing drum and the carrier to form a cured layer.
    Type: Application
    Filed: December 24, 2020
    Publication date: June 24, 2021
    Inventor: Pengkai JI
  • Publication number: 20210147992
    Abstract: A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Inventor: Pengkai JI
  • Publication number: 20210066170
    Abstract: The present disclosure provides a power module and a method for manufacturing the power module. The power module includes a chip, a passive element and connection pins. The connection pins are provided on a pin-out surface of the power module, and are electrically connected to at least one of a chip terminal of the chip and the passive element; a projection of the chip on the pin-out surface of the power module does not overlap with a projection of the passive element on the pin-out surface of the power module, and an angle between the terminal-out surface of the chip and the pin-out surface of the power module is greater than 45° and less than 135°.
    Type: Application
    Filed: July 23, 2020
    Publication date: March 4, 2021
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Pengkai JI, Shouyu HONG, Yiqing YE
  • Publication number: 20210045243
    Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Pengkai JI, Jianhong ZENG, Yu ZHANG, Shouyu HONG, Jinping ZHOU, Bau-Ru LU
  • Publication number: 20210005378
    Abstract: The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: Shouyu HONG, Ganyu ZHOU, Zhiheng FU, Yan TONG, Qingdong CHEN, Xiaoni XIN, Jinping ZHOU, Pengkai JI, Yiqing YE
  • Patent number: 10856417
    Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: December 1, 2020
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Pengkai Ji, Jianhong Zeng, Yu Zhang, Shouyu Hong, Jinping Zhou, Bau-Ru Lu
  • Publication number: 20200366091
    Abstract: The disclosure provides a system of providing power to a chip on a mainboard. The system comprises at least one preceding-stage power supply module located on a surface of a mainboard, being DC-DC converters, and configured to receive a first DC voltage and to provide a second DC voltage; and at least one post-stage power supply module located on the same surface of the preceding-stage power supply module of the mainboard. Wherein the post-stage power supply module is electrically connected to the preceding-stage power supply module to receive the second DC voltage, the preceding-stage power supply module and the post-stage power supply module are disposed at same side of the chip, the post-stage power supply module provides a third DC voltage to the chip. A profile projection of the preceding-stage power supply module and the corresponding post-stage power supply module are overlapped with each other over 50%.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Inventors: Haoyi Ye, Jianhong Zeng, Xiaoni Xin, Shouyu Hong, Min Zhou, Yiqing Ye, Pengkai Ji
  • Publication number: 20200359496
    Abstract: A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu HONG, Zhiheng FU, Haoyi YE, Qingdong CHEN, Yiqing YE, Jinping ZHOU, Xiaoni XIN, Pengkai JI, Min ZHOU
  • Publication number: 20200350721
    Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 5, 2020
    Applicant: Delta Electronics,Inc.
    Inventors: Shouyu HONG, Qingdong CHEN, Ganyu ZHOU, Pengkai JI, Yiqing YE, Zhenqing ZHAO
  • Patent number: 10784612
    Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: September 22, 2020
    Assignee: Delta Electronics, Inc.
    Inventors: Shouyu Hong, Qingdong Chen, Ganyu Zhou, Pengkai Ji, Yiqing Ye, Zhenqing Zhao
  • Publication number: 20200260586
    Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Inventors: Shouyu Hong, Jinping Zhou, Min Zhou, Xiaoni Xin, Pengkai Ji, Kai Lu, Le Liang, Zhenqing Zhao
  • Publication number: 20200227205
    Abstract: Disclosed are a method for fabricating an inductor with a vertical winding and an injection molding tooling thereof. The fabrication method includes: providing a conductive member that includes a connection piece, which includes a first surface and a second surface that are oppositely arranged, and a pillar on the first surface; injecting the magnetic material onto a side of the conductive member with the pillar, such that the magnetic material and the conductive member form an integrated structure; and cutting the connection piece to form the vertical winding. The injection molding tooling includes: an upper punch for stamping a magnetic material and a conductive member into an integrated structure, a molding cavity body surrounding a periphery of a pillar of the conductive member, and a lower punch for bearing a connection piece of the conductive member.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 16, 2020
    Inventors: Pengkai JI, Shouyu HONG, Jinping ZHOU, Min ZHOU, Jianhong ZENG, Zhenqing ZHAO
  • Publication number: 20200220474
    Abstract: The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.
    Type: Application
    Filed: December 29, 2019
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Shouyu HONG, Xiaoni XIN, Le LIANG, Zhenqing ZHAO
  • Publication number: 20200219846
    Abstract: A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Xiaoni XIN, Yan CHEN, Qingdong CHEN, Shouyu HONG, Jianhong ZENG, Zhenqing ZHAO
  • Publication number: 20200219647
    Abstract: Provided are an inversely coupled inductor and a power module. The inversely coupled inductor includes a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. The power supply module includes the above inversely coupled inductor, which is in turn stacked on, and electrically connected to, the packaged chip module. By arranging the two windings to cross with each other on the outside of the first passage of the magnetic core, the same type terminal (such as input pins or output pins) of the inversely coupled inductor can be located on the same side.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Jinping ZHOU, Shouyu HONG, Jianhong ZENG
  • Publication number: 20200221582
    Abstract: The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 9, 2020
    Inventors: Shouyu HONG, Qingdong CHEN, Ganyu ZHOU, Yan CHEN, Xiaoni XIN, Pengkai JI
  • Publication number: 20200219648
    Abstract: Provided are a coupled inductor and a power module including the coupled inductor. A coupled inductor includes: a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. Another coupled inductor includes: a magnetic core, a first winding and a second winding, where the magnetic core has a first passage and a second passage in parallel, both run through the magnetic core from one end face thereof to another opposite end face, where the first winding and the second winding both penetrate the first passage and the second passage, such that differently-named terminals of the windings are located on the same end face of the magnetic core.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Jinping ZHOU, Shouyu HONG, Jianhong ZENG, Mingzhun ZHANG, Min ZHOU
  • Publication number: 20200220473
    Abstract: The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.
    Type: Application
    Filed: December 29, 2019
    Publication date: July 9, 2020
    Inventors: Pengkai JI, Shouyu HONG, Xiaoni XIN, Le LIANG, Zhenqing ZHAO
  • Patent number: 10685895
    Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 16, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Pengkai Ji, Shouyu Hong, Zhenqing Zhao, Jianhong Zeng