Abstract: A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.

Abstract: A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.

Abstract: The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance.

Abstract: The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts and a dielectric carrier material with a metallization and a ground plane provided on a respective first main side and second main side Surface-mountable waveguide parts comprise a first wall, a second wall, and a third wall, which second and third walls are arranged to contact a part of the metallization, all the walls together essentially forming a U-shape, the surface-mountable waveguide parts also comprising respective bend parts. The metallization on the first main side is removed such that a first aperture and a second aperture are formed, the apertures being enclosed by a frame of via holes electrically connecting the ground plane with the metallization, the bend parts being fitted such that the apertures permit passage of a microwave signal propagating via the bend parts. Then the dielectric carrier material itself acts as a waveguide transition between the first aperture and the second aperture.

Abstract: A filter device for a printed circuit board, wherein the filter device comprises a selected pattern of conductive material arranged to be electromagnetically coupled to an electrically conductive plane comprised in the printed circuit board. The invention is characterized in that the filter device is a separate unit from the printed circuit board and is connectable to the printed circuit board via first connectors positioned on the filter device and second connectors correspondingly positioned onto the printed circuit board.

Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4) and a second surface-mountable waveguide part (5), each waveguide part (4, 5) comprising a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a dielectric carrier material (1), all the walls (7, 8, 9; 10, 11, 12) together essentially forming a U-shape, where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mounted waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other.

Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other.

Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.

Abstract: A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.

Abstract: A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.

Abstract: A waveguide filter comprising a matching means for matching the filter. The waveguide filter comprises a housing comprising a cavity having a predetermined first volume. The matching means is in the form of a volume element having a predetermined second volume being matched to the first volume forming a predetermined volume to volume ratio. The matching means is fitted into the cavity in a fixed non-adjustable manner in relationship to the housing. The invention refers also to a method for manufacturing of such a waveguide filter.

Abstract: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

Abstract: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

Abstract: The present invention relates to a longitudinal board guide rail for taking up an outer edge of a circuit board and for being provided in a board connection housing and comprising a board receiving portion e.g. a groove or similar, for receiving the circuit board edge. It comprises side plane contact means, flexible and/or displaceable board contact means comprising or being associated with said side plane contact means. Said flexible and/or displaceable contact means are in a first state so arranged or disposed that no contact is enabled with a board, e.g. a board insertion or contact-less state, and in a second state, e.g. a contact state, they are so arranged that contact is established with a board introduced or provided in the board receiving portion. The invention also relates to a board connection having arrangement with a number of such board guide rails.

Abstract: The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.

Abstract: A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.

Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

Abstract: Printed circuit board (1, 2, 3) comprising at least a first layer (13) on which a first stationary contact terminal (18) is formed and one or more second layers (9, 22) being spaced apart from the first layer (13) by at least one intermediate layer (10, 11, 12) is shown, whereby at least a portion (5) of said one or more second layers (11, 12) extend into a recess (26) formed by at least a discontinuity of the intermediate layers (10, 11, 12). The portion in the printed circuit board is flexible and has a second terminal (6). Which can be brought into contact with the first stationary terminal (20).

Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).