Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index &egr;r than the dielectric material.

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract: An antenna arrangement includes a first portion and a second portion, each portion being arranged spaced apart and on first and second sides of at least one carrier structure. Each of said first and second portions includes at least one antenna element. The antenna elements of each antenna portion are electrically connected and the antenna element of said first portion is arranged to transmit an incident electromagnetic radiation on said first side of said carrier in form of an electrical signal to the antenna element of said second portion on said second side of said carrier. The antenna element of said second portion is arranged to transform and radiate the electrical signal from the second side of the carrier. Each antenna element comprises a thin layer of a conductive coating arranged on at least part of surface of said carrier.

Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

Abstract: The present invention relates an antenna arrangement (23, 330, 430, 530, 630) comprising a fit layer (331, 431, 531, 631) consisting of a dielectric material and a second reflective layer (335, 435, 535, 640, The dielectric material has variable dielectric characteristics. An electromagnetic radiation (50) passing through said first layer (331, 431, 531, 631) and at least partly reflected by said second layer (335, 435, 535, 640) is modulated by varying said variable dielectric characteristics of said first layer.

Abstract: The invention concerns a PC board with laminates for electrical circuits, the PC board comprising at least one carrier (1) and at least one copper surface layer (7), intended to, after the removal of selected parts, e.g. by etching, function as conductors on the PC board. The new thing is that the carrier at least at some parts has a surface roughness of up to mainly the same size as the thickness of the copper layer and that at least at the above named rough parts is arranged a surface levelling layer (5a,b) between the carrier (1) and the copper layer (7). Further, the invention concerns a method for producing PC board laminate for electrical circuits as above, the laminate comprising a copper layer and a carrier that has a surface roughness of mainly the same size as the thickness of the copper layer.

Abstract: An encapsulated circuit board arrangement comprising a thin interface layer with one or more vias for input/output interface to the circuit. The encapsulated circuit board arrangement further comprises one or more sequentially processed layers added to one side of the interface circuit. The sequentially processed layers are preferably made by additive offset printing technology. The encapsulated circuit board arrangement further comprises a layer of adhesive. A first side of the adhesive layer is attached on top of the uppermost and most exposed layer. The encapsulated circuit board arrangement further comprises a support carrier attached on a second side of the adhesive layer.

Abstract: The invention concerns a PC board with laminates for electrical circuits, the PC board comprising at least one carrier (1) and at least one copper surface layer (7), intended to, after the removal of selected parts, e.g. by etching, function as conductors on the PC board. The new thing is that the carrier at least at some parts has a surface roughness of up to mainly the same size as the thickness of the copper layer and that at least at the above named rough parts is arranged a surface levelling layer (5a,b) between the carrier (1) and the copper layer (7). Further, the invention concerns a method for producing PC board laminate for electrical circuits as above, the laminate comprising a copper layer and a carrier that has a surface roughness of mainly the same size as the thickness of the copper layer.

Abstract: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier.

Abstract: An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.