Patents by Inventor Peter A. Benson

Peter A. Benson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
    Publication number: 20040159340
    Abstract: A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
    Type: Application
    Filed: November 10, 2003
    Publication date: August 19, 2004
    Inventors: William M. Hiatt, Warren M. Farnworth, David R. Hembree, Peter A. Benson
  • Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
    Publication number: 20040158343
    Abstract: A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
    Type: Application
    Filed: November 10, 2003
    Publication date: August 12, 2004
    Inventors: William M. Hiatt, Warren M. Farnworth, David R. Hembree, Peter A. Benson
  • Non-chemical, non-optical edge bead removal process
    Publication number: 20040126923
    Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Applicant: Micron Technology, Inc.
    Inventor: Peter A. Benson
  • Composition for circuit board manufacture
    Patent number: 6261466
    Abstract: A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: July 17, 2001
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin W. Bayes, Peter W. Hinkley, John P. Cahalen, Peter A. Benson