Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.

Abstract: In some embodiments, an electronic device comprises a circuit board, an antenna structure on the circuit board, and a waveguide mounted on the circuit board above the antenna structure. Other embodiments may be described.

Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Abstract: In some embodiments, an electronic device comprises a circuit board, an antenna structure on the circuit board, and a waveguide mounted on the circuit board above the antenna structure. Other embodiments may be described.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: An emblem that is located within a recess of a cover. The cover may be part of a cartridge which also contains a number of integrated circuit packages that are mounted to a printed circuit board. The emblem is typically attached to the cover by an adhesive. The recess reduces the likelihood of the emblem being removed from the cover. The emblem preferably contains a hologram which can identify a type of cartridge produced by a manufacturer.

Abstract: A socket for an electronic assembly. The socket may include a first finger that is coupled to a second finger. The socket may further have a plurality of contacts that are located within contact openings of the first and second fingers. The fingers may be separated by spaces that reduce the effective coefficient of thermal expansion.