Abstract: A gas-turbine blade has a root 5 and an airfoil 2, with the airfoil 2 including an internal load carrier 6 as well as an airfoil element 8 enclosing the internal load carrier 6 by forming a cavity 7 extending along the longitudinal blade axis. The load carrier 6 is designed as a central element without cooling ducts and cooling air is introduced into the cavity 7 via the root 5.

Abstract: A turbine blade locking device axially retains a turbine blade (1) inserted in an axial, profiled slot (10) of a turbine disk (6). The turbine disk (6) is provided with a locking groove (8) passing through the slot (10) and extending radially in the plane of the turbine disk (6). A locking pin (4) is inserted in the locking groove (8) and the blade root (3) is provided at its bottom side with a notch (9) aligning with the locking groove (8). A portion of an elastic element (5) is arranged radially below the locking pin (4) to pre-load the locking pin (4) in a radially outward direction and into the notch (9).

Abstract: In some embodiments, an electronic device comprises a circuit board, an antenna structure on the circuit board, and a waveguide mounted on the circuit board above the antenna structure. Other embodiments may be described.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

Abstract: A hollow turbine blade cooled with compressor air is divided into a cooling air chamber (6) and into impingement air cooling chambers (8, 9) by inner, supporting partitions (3, 4). The cooling air is conveyed from the cooling air chamber into the impingement air cooling chamber via impingement air channels (7) provided in the partitions. The impingement air channels are concave with regard to the adjacent outer wall (2) of the blade airfoil (1) and arranged completely in the hot area near the outer wall and, in addition, have an oblong or elliptical cross-section whose longitudinal axis agrees with the radial orientation of the turbine blade. By reduced stress concentration in the area of the impingement air channels, the fatigue and creep characteristics are improved and life is increased.

Abstract: An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

Abstract: A turbine blade locking device axially retains a turbine blade (1) inserted in an axial, profiled slot (10) of a turbine disk (6). The turbine disk (6) is provided with a locking groove (8) passing through the slot (10) and extending radially in the plane of the turbine disk (6). A locking pin (4) is inserted in the locking groove (8) and the blade root (3) is provided at its bottom side with a notch (9) aligning with the locking groove (8). A portion of an elastic element (5) is arranged radially below the locking pin (4) to pre-load the locking pin (4) in a radially outward direction and into the notch (9).

Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

Abstract: A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.

Abstract: A method and apparatus to imprint or emboss dielectric substrates for high-density electronic circuitry using tool foils having a special release coating.

Abstract: A hollow turbine blade cooled with compressor air is divided into a cooling air chamber (6) and into impingement air cooling chambers (8, 9) by inner, supporting partitions (3, 4). The cooling air is conveyed from the cooling air chamber into the impingement air cooling chamber via impingement air channels (7) provided in the partitions. The impingement air channels are concave with regard to the adjacent outer wall (2) of the blade airfoil (1) and arranged completely in the hot area near the outer wall and, in addition, have an oblong or elliptical cross-section whose longitudinal axis agrees with the radial orientation of the turbine blade. By reduced stress concentration in the area of the impingement air channels, the fatigue and creep characteristics are improved and life is increased.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.