Patents by Inventor Peter Alfred
Peter Alfred has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110314900Abstract: An in situ autosampling method and associated sampling device for capturing a material sample from a vessel. Methods of the present invention make use of a sampling device having an extendable sample capture element with a concave sample capture pocket located near a distal end thereof. The sample capture pocket is adapted to capture a known volume of material when the sample capture element is extended into said material. The material sample remains trapped in the sample capture pocket upon sample capture element retraction. Ports in the sample capture pocket may be placed in communication with corresponding material transfer channels extending through the sample capture element to allow for the in situ processing of a material sample, and the subsequent discharge of the sample to an analyzer or another downstream location.Type: ApplicationFiled: June 25, 2010Publication date: December 29, 2011Applicant: Mettler-Toledo AGInventors: Peter Alfred Blacklin, Wayne Fowler, JR., Joel Michael Hawkins, Howard William Ward, II
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Publication number: 20110261473Abstract: The present application relates to a method for enhancing metal corrosion resistance of a metal deposited on a substrate, the method comprises contacting the metal coated substrate with a treating composition comprising metal oxide nano-particles. Furthermore, the present application relates to a method for making a mirror comprising a substrate having a metal coated thereon, wherein the method comprises contacting the metal coated substrate with a treating composition comprising metal oxide nano-particles. Preferably, the metal oxide nano-particles are selected from one or more oxides of zinc, iridium, tin, aluminum, cerium, chromium, vanadium, titanium, iron, indium, copper, gold, palladium, platinum, manganese, cobalt, nickel, zirconium, molybdenum, rhodium, silver, indium, wolfram, iridium, lead, bismuth, samarium, erbium, or mixtures of these materials. In addition, the present application relates to the products obtainable by these methods.Type: ApplicationFiled: February 27, 2009Publication date: October 27, 2011Applicant: VALSPAR SOURCING, INC.Inventors: Hilmar Peter Alfred Weisse, Dirk Hinzmann, Andrea Engels
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Publication number: 20110215048Abstract: The present invention is directed to a fluid flow control assembly for regulating fluid flow, and may find particular application in additive dispenser systems. Typically a baffle arrangement (210) comprises a plurality of baffle elements (202) within a chamber (208). The arrangement forms an alternating sequence of restrictions and cavities for fluid flowing from an inlet (205) to an outlet (201) and tends to restrict fluid flow in an alternative manner to merely providing a fine diameter aperture. The fluid flow control assembly was developed for applications where foreign particles or air bubbles may block fine diameter apertures, such as low pressure additive dispenser systems where low relatively stable flow rates are important to their operation.Type: ApplicationFiled: June 18, 2009Publication date: September 8, 2011Applicant: PETA ENTERPRISES LIMITEDInventors: Douglas Steward Moreland Phillips, Peter Alfred John Phillips
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Patent number: 7906420Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: November 30, 2009Date of Patent: March 15, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20110031750Abstract: The generation of electricity using waves on a body of water is disclosed herein. Two flotation devices floating on a body of water are each attached to cables that extend to anchors at an ocean/sea/lake floor. The cables slideably attach to the anchors, further extend along the floor, and then connect to a stationary generator station located on or near land adjacent the body of water. As the waves propagate on the water, each of the flotation devices moves in an elliptical fashion as each wave passes underneath each flotation device. The periodic oscillatory motion of each of the flotation devices causes the cables to likewise periodically retract and extend from the station. The periodic retraction/extension of the cables provides the mechanical power necessary for the station to generate electricity. The station includes mechanical and electrical equipment associated with the wave-powered electricity generation system, including an electrical generator.Type: ApplicationFiled: August 6, 2009Publication date: February 10, 2011Inventor: Peter Alfred Kreissig
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Patent number: 7867842Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: July 29, 2008Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100217136Abstract: There is disclosed a medical device for implantation in a body comprising: one or more sensors for sensing a physiologically or clinically relevant parameter; and telemetric communications means for telemetrically transmitting data related to a parameter sensed by the one or more sensors to a remote device.Type: ApplicationFiled: February 23, 2010Publication date: August 26, 2010Applicant: L & P 100 LIMITEDInventors: Nicholas McMahon Turner, Peter Alfred Payne, G. Alban Davies, Julia P. Davies, Simon John Patrick O'Riordan
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Publication number: 20100135181Abstract: A network component comprising a plurality of encoders, a plurality of rate-matching modules coupled to the encoders, and a channel interleaver coupled to the rate-matching modules, wherein the rate-matching modules calculate the number of bits for rate matching a plurality of feedback control information based on a total number of bits allocated to a channel traffic without a traffic data. Included is a network component comprising at least one processor configured to encode a plurality of feedback control information, calculate the number of bits for rate-matching the feedback control information based on a total number of bits allocated to a channel traffic without a traffic data. Included is a method comprising receiving a downlink traffic, detecting a request to transmit uplink data in the downlink traffic, and transmitting feedback control information with or without data based on the request.Type: ApplicationFiled: November 25, 2009Publication date: June 3, 2010Applicant: Research In Motion LimitedInventors: Andrew Mark Earnshaw, Zhijun Cai, Klaus-Peter Alfred Wachsmann, Yi Yu
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Publication number: 20100138407Abstract: Histograms formed based on samples of a population, such as histograms created from random page-level samples of a data store, are intelligently scaled to histograms estimating distribution of the entire population of the data store. As an optional optimization, where a threshold number of duplicate samples are observed during page-level sampling, the number of distinct values in the overall population data is presumed to be the number of distinct values in the sample data. Also, during estimation of distinct values of an overall population, a “Chao” estimator can optionally be utilized as a lower bound of the estimate. The resulting estimate is then used when scaling, which can take domain knowledge of the data being scaled into account in order to prevent scaled estimates from exceeding the limits of the domain.Type: ApplicationFiled: February 4, 2010Publication date: June 3, 2010Applicant: MICROSOFT CORPORATIONInventors: Campbell Bryce Fraser, Ian Jose, Peter Alfred Zabback
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Patent number: 7707005Abstract: Histograms formed based on samples of a population, such as histograms created from random page-level samples of a data store, are intelligently scaled to histograms estimating distribution of the entire population of the data store. As an optional optimization, where a threshold number of duplicate samples are observed during page-level sampling, the number of distinct values in the overall population data is presumed to be the number of distinct values in the sample data. Also, during estimation of distinct values of an overall population, a “Chao” estimator can optionally be utilized as a lower bound of the estimate. The resulting estimate is then used when scaling, which can take domain knowledge of the data being scaled into account in order to prevent scaled estimates from exceeding the limits of the domain.Type: GrantFiled: September 2, 2006Date of Patent: April 27, 2010Assignee: Microsoft CorporationInventors: Campbell Bryce Fraser, Ian Jose, Peter Alfred Zabback
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Publication number: 20100086739Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Applicant: International Business Machines CorporationInventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
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Publication number: 20100072263Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Applicant: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100025862Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.Type: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Inventors: Peter Alfred Gruber, Jae-Woong Nah
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Publication number: 20100028612Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100025863Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.Type: ApplicationFiled: July 28, 2009Publication date: February 4, 2010Applicant: International Business Machines CorporationInventors: Peter Alfred Gruber, Jae-Woong Nah
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Publication number: 20090193258Abstract: A method and apparatus for enabling a licensed end user to record digital data as described is particularly useful to the music industry as it enables them to make audio data available over the internet but to retain control of the uses to which that audio data can be put. Thus, upon completing a financial transaction to pay for the required audio tracks, the end user is enabled to download and decrypt encrypted music tracks and to play them on the end user's personal computer. The end user can also be allowed to burn a CD including the downloaded music tracks. However, the end user is only enabled to decrypt and record the music tracks onto the CD if the music tracks are recorded together with copy protection.Type: ApplicationFiled: March 23, 2009Publication date: July 30, 2009Inventor: PETER ALFRED NEWMAN
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Patent number: 7530116Abstract: A method and apparatus for enabling a licensed end user to record digital data as described is particularly useful to the music industry as it enables them to make audio data available over the internet but to retain control of the uses to which that audio data can be put. Thus, upon completing a financial transaction to pay for the required audio tracks, the end user is enabled to download and decrypt encrypted music tracks and to play them on the end user's personal computer. The end user can also be allowed to burn a CD including the downloaded music tracks. However, the end user is only enabled to decrypt and record the music tracks onto the CD if the music tracks are recorded together with copy protection.Type: GrantFiled: June 6, 2002Date of Patent: May 5, 2009Assignee: Macrovision CorporationInventor: Peter Alfred Newman
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Publication number: 20090039142Abstract: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
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Publication number: 20090039140Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
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Publication number: 20080306903Abstract: A system and method that facilitates and effectuates estimating the result of performing a data analysis operation on a set of data. Employing an approximation of the data analysis operation on a statistically valid random sample view of the data allows for a statistically accurate estimate of the result to be obtained. Sequential sampling in the view enables the approximated operation to evaluate accuracy conditions at intervals during the scan of the sample view and obtain the estimated result without having to scan the entire sample view. Feedback regarding the accuracy of the estimated result can be captured when the data analysis operation is performed against the set of data. Process control techniques can be employed with the feedback to maintain the statistical validity of the sample view.Type: ApplicationFiled: June 8, 2007Publication date: December 11, 2008Applicant: MICROSOFT CORPORATIONInventors: Per-Ake Larson, Wolfgang Martin Josef Lehner, Jingren Zhou, Peter Alfred Zabback