Patents by Inventor Peter Alfred

Peter Alfred has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110314900
    Abstract: An in situ autosampling method and associated sampling device for capturing a material sample from a vessel. Methods of the present invention make use of a sampling device having an extendable sample capture element with a concave sample capture pocket located near a distal end thereof. The sample capture pocket is adapted to capture a known volume of material when the sample capture element is extended into said material. The material sample remains trapped in the sample capture pocket upon sample capture element retraction. Ports in the sample capture pocket may be placed in communication with corresponding material transfer channels extending through the sample capture element to allow for the in situ processing of a material sample, and the subsequent discharge of the sample to an analyzer or another downstream location.
    Type: Application
    Filed: June 25, 2010
    Publication date: December 29, 2011
    Applicant: Mettler-Toledo AG
    Inventors: Peter Alfred Blacklin, Wayne Fowler, JR., Joel Michael Hawkins, Howard William Ward, II
  • Publication number: 20110261473
    Abstract: The present application relates to a method for enhancing metal corrosion resistance of a metal deposited on a substrate, the method comprises contacting the metal coated substrate with a treating composition comprising metal oxide nano-particles. Furthermore, the present application relates to a method for making a mirror comprising a substrate having a metal coated thereon, wherein the method comprises contacting the metal coated substrate with a treating composition comprising metal oxide nano-particles. Preferably, the metal oxide nano-particles are selected from one or more oxides of zinc, iridium, tin, aluminum, cerium, chromium, vanadium, titanium, iron, indium, copper, gold, palladium, platinum, manganese, cobalt, nickel, zirconium, molybdenum, rhodium, silver, indium, wolfram, iridium, lead, bismuth, samarium, erbium, or mixtures of these materials. In addition, the present application relates to the products obtainable by these methods.
    Type: Application
    Filed: February 27, 2009
    Publication date: October 27, 2011
    Applicant: VALSPAR SOURCING, INC.
    Inventors: Hilmar Peter Alfred Weisse, Dirk Hinzmann, Andrea Engels
  • Publication number: 20110215048
    Abstract: The present invention is directed to a fluid flow control assembly for regulating fluid flow, and may find particular application in additive dispenser systems. Typically a baffle arrangement (210) comprises a plurality of baffle elements (202) within a chamber (208). The arrangement forms an alternating sequence of restrictions and cavities for fluid flowing from an inlet (205) to an outlet (201) and tends to restrict fluid flow in an alternative manner to merely providing a fine diameter aperture. The fluid flow control assembly was developed for applications where foreign particles or air bubbles may block fine diameter apertures, such as low pressure additive dispenser systems where low relatively stable flow rates are important to their operation.
    Type: Application
    Filed: June 18, 2009
    Publication date: September 8, 2011
    Applicant: PETA ENTERPRISES LIMITED
    Inventors: Douglas Steward Moreland Phillips, Peter Alfred John Phillips
  • Patent number: 7906420
    Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivin
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: March 15, 2011
    Assignee: International Business Machines Corporation
    Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
  • Publication number: 20110031750
    Abstract: The generation of electricity using waves on a body of water is disclosed herein. Two flotation devices floating on a body of water are each attached to cables that extend to anchors at an ocean/sea/lake floor. The cables slideably attach to the anchors, further extend along the floor, and then connect to a stationary generator station located on or near land adjacent the body of water. As the waves propagate on the water, each of the flotation devices moves in an elliptical fashion as each wave passes underneath each flotation device. The periodic oscillatory motion of each of the flotation devices causes the cables to likewise periodically retract and extend from the station. The periodic retraction/extension of the cables provides the mechanical power necessary for the station to generate electricity. The station includes mechanical and electrical equipment associated with the wave-powered electricity generation system, including an electrical generator.
    Type: Application
    Filed: August 6, 2009
    Publication date: February 10, 2011
    Inventor: Peter Alfred Kreissig
  • Patent number: 7867842
    Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivin
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: January 11, 2011
    Assignee: International Business Machines Corporation
    Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
  • Publication number: 20100217136
    Abstract: There is disclosed a medical device for implantation in a body comprising: one or more sensors for sensing a physiologically or clinically relevant parameter; and telemetric communications means for telemetrically transmitting data related to a parameter sensed by the one or more sensors to a remote device.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 26, 2010
    Applicant: L & P 100 LIMITED
    Inventors: Nicholas McMahon Turner, Peter Alfred Payne, G. Alban Davies, Julia P. Davies, Simon John Patrick O'Riordan
  • Publication number: 20100135181
    Abstract: A network component comprising a plurality of encoders, a plurality of rate-matching modules coupled to the encoders, and a channel interleaver coupled to the rate-matching modules, wherein the rate-matching modules calculate the number of bits for rate matching a plurality of feedback control information based on a total number of bits allocated to a channel traffic without a traffic data. Included is a network component comprising at least one processor configured to encode a plurality of feedback control information, calculate the number of bits for rate-matching the feedback control information based on a total number of bits allocated to a channel traffic without a traffic data. Included is a method comprising receiving a downlink traffic, detecting a request to transmit uplink data in the downlink traffic, and transmitting feedback control information with or without data based on the request.
    Type: Application
    Filed: November 25, 2009
    Publication date: June 3, 2010
    Applicant: Research In Motion Limited
    Inventors: Andrew Mark Earnshaw, Zhijun Cai, Klaus-Peter Alfred Wachsmann, Yi Yu
  • Publication number: 20100138407
    Abstract: Histograms formed based on samples of a population, such as histograms created from random page-level samples of a data store, are intelligently scaled to histograms estimating distribution of the entire population of the data store. As an optional optimization, where a threshold number of duplicate samples are observed during page-level sampling, the number of distinct values in the overall population data is presumed to be the number of distinct values in the sample data. Also, during estimation of distinct values of an overall population, a “Chao” estimator can optionally be utilized as a lower bound of the estimate. The resulting estimate is then used when scaling, which can take domain knowledge of the data being scaled into account in order to prevent scaled estimates from exceeding the limits of the domain.
    Type: Application
    Filed: February 4, 2010
    Publication date: June 3, 2010
    Applicant: MICROSOFT CORPORATION
    Inventors: Campbell Bryce Fraser, Ian Jose, Peter Alfred Zabback
  • Patent number: 7707005
    Abstract: Histograms formed based on samples of a population, such as histograms created from random page-level samples of a data store, are intelligently scaled to histograms estimating distribution of the entire population of the data store. As an optional optimization, where a threshold number of duplicate samples are observed during page-level sampling, the number of distinct values in the overall population data is presumed to be the number of distinct values in the sample data. Also, during estimation of distinct values of an overall population, a “Chao” estimator can optionally be utilized as a lower bound of the estimate. The resulting estimate is then used when scaling, which can take domain knowledge of the data being scaled into account in order to prevent scaled estimates from exceeding the limits of the domain.
    Type: Grant
    Filed: September 2, 2006
    Date of Patent: April 27, 2010
    Assignee: Microsoft Corporation
    Inventors: Campbell Bryce Fraser, Ian Jose, Peter Alfred Zabback
  • Publication number: 20100086739
    Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Applicant: International Business Machines Corporation
    Inventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
  • Publication number: 20100072263
    Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivin
    Type: Application
    Filed: November 30, 2009
    Publication date: March 25, 2010
    Applicant: International Business Machines Corporation
    Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
  • Publication number: 20100025862
    Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 4, 2010
    Inventors: Peter Alfred Gruber, Jae-Woong Nah
  • Publication number: 20100028612
    Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivin
    Type: Application
    Filed: July 29, 2008
    Publication date: February 4, 2010
    Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
  • Publication number: 20100025863
    Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.
    Type: Application
    Filed: July 28, 2009
    Publication date: February 4, 2010
    Applicant: International Business Machines Corporation
    Inventors: Peter Alfred Gruber, Jae-Woong Nah
  • Publication number: 20090193258
    Abstract: A method and apparatus for enabling a licensed end user to record digital data as described is particularly useful to the music industry as it enables them to make audio data available over the internet but to retain control of the uses to which that audio data can be put. Thus, upon completing a financial transaction to pay for the required audio tracks, the end user is enabled to download and decrypt encrypted music tracks and to play them on the end user's personal computer. The end user can also be allowed to burn a CD including the downloaded music tracks. However, the end user is only enabled to decrypt and record the music tracks onto the CD if the music tracks are recorded together with copy protection.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 30, 2009
    Inventor: PETER ALFRED NEWMAN
  • Patent number: 7530116
    Abstract: A method and apparatus for enabling a licensed end user to record digital data as described is particularly useful to the music industry as it enables them to make audio data available over the internet but to retain control of the uses to which that audio data can be put. Thus, upon completing a financial transaction to pay for the required audio tracks, the end user is enabled to download and decrypt encrypted music tracks and to play them on the end user's personal computer. The end user can also be allowed to burn a CD including the downloaded music tracks. However, the end user is only enabled to decrypt and record the music tracks onto the CD if the music tracks are recorded together with copy protection.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: May 5, 2009
    Assignee: Macrovision Corporation
    Inventor: Peter Alfred Newman
  • Publication number: 20090039142
    Abstract: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
  • Publication number: 20090039140
    Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
  • Publication number: 20080306903
    Abstract: A system and method that facilitates and effectuates estimating the result of performing a data analysis operation on a set of data. Employing an approximation of the data analysis operation on a statistically valid random sample view of the data allows for a statistically accurate estimate of the result to be obtained. Sequential sampling in the view enables the approximated operation to evaluate accuracy conditions at intervals during the scan of the sample view and obtain the estimated result without having to scan the entire sample view. Feedback regarding the accuracy of the estimated result can be captured when the data analysis operation is performed against the set of data. Process control techniques can be employed with the feedback to maintain the statistical validity of the sample view.
    Type: Application
    Filed: June 8, 2007
    Publication date: December 11, 2008
    Applicant: MICROSOFT CORPORATION
    Inventors: Per-Ake Larson, Wolfgang Martin Josef Lehner, Jingren Zhou, Peter Alfred Zabback