Abstract: [There is disclosed a method for detecting the occurrence of a condition in a respiring subject comprising the steps of: introducing emitted subject respiratory gases to a gas sensing device; detecting certain species present in said emitted subject respiratory gases with said gas sensing device; and correlating the presence of said species with the occurrence of the condition] A method for detecting the occurrence of a condition in a respiring subject includes the steps of: introducing emitted subject respiratory gases to a gas sensing device; detecting certain species present in the emitted subject respiratory gases with the gas sensing device; and correlating the presence of the species with the occurrence of the condition.

Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Abstract: Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer.

Abstract: There is disclosed a gas sampling apparatus (10) adapted for use in a hand-held gas sensing device (12) having at least one gas sensor (14), the apparatus comprising: a gas inlet (16); a gas conductor (18) for conducting gas from the gas inlet to the sensor or sensors; a gas outlet (20), a gas conductor (22) for conducting gas from the sensor or sensors to the gas outlet; and a vacuum containment (24) enclosing an inner region having a pressure below atmospheric pressure and adapted for connection to the gas outlet so that a flow of gas is developed from the gas inlet to the vacuum containment.

Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

Abstract: There is disclosed a method for analysis and therapy of the eye utilizing laser-induced ultrasound.

Abstract: The evaporative emission treatment device comprises a monolith concentrically disposed within a shell, and having one or more sealing agents concentrically disposed about the monolith and in between the monolith and housing. The shell comprises a first shell portion having an inlet portion at one end and a connection element disposed at the opposing end, and a second shell portion having an outlet portion at one end and a connection element disposed at the opposing end. The shell can also include structural features to prevent fluid leakage, enhance fluid flow, enable attachment to other evaporative emission system components, enable mounting to a vehicle, and internally seal the monolith and sealing agents.

Abstract: An integrated wheel end system for a vehicle including a clutch adapted to provide driving engagement/disengagement of a wheel to convert between driven and non-driven modes of wheel movement. A vehicle is provided with both 4×2 and 4×4 capabilities and, when 4×4 capability is required, a negative pressure is applied to a vacuum cavity thus causing a piston, shift fork and spline collar to move inboard. The spline collar is splined to the constant velocity joint and as it moves inboard it locks on the spline plate locking the wheelend to the axle shaft. The invention also provides a default 4×4 embodiment, the spline collar is splined to the joint and as the piston fork and spline collar move inboard, they unlock the wheelend from the axle shaft. A selectively activated actuator is provided for moving the clutch member between its driving and non-driving positions.

Abstract: The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface, The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities.

Abstract: Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer.

Abstract: A microorganism analyzer has a flow-through arrangement into which a microorganism-containing sample may be introduced, and a headspace connected or connectible to a gas analyzer. The headspace is connected to the flow-through arrangement so as to be affected by the sample.

Abstract: The present invention is directed to a rotary air coupling that distributes air to tires mounted on a rotating hub of a driven axle. The coupling is positioned adjacent the parking brake of a rear disk brake configuration. In the preferred design, the rotary member is connected to the hub and rotor assembly via rotor mounting bolts and a stationary component is disposed on the axle tube to provide a rotary air coupling that minimizes change to existing wheel assemblies.

Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip.

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Abstract: A valve, for example a tapered plug valve, having two obturators each rotatable between open and closed positions. The angle between the rotational axes is at least about 90° and may be 180°. The handles used to rotate the obturators are preferably on the same side of the valve.

Abstract: A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.

Abstract: There is disclosed a method for interrogating a sensor comprising the steps: applying a periodic electrical signal to the sensor; obtaining a signal therefrom; and performing an operation on the obtained signal to obtain the sensor response at a plurality of frequencies, said operation including a transformation to the frequency domain of said signal or a quantity related to said signal.

Abstract: An apparatus and method utilize vacuum injected molding of a liquid in a plurality of mold cells for solidification therein. An injection head includes spaced apart vacuum and injection slots positionable atop a mold plate in flow communication with the mold cells therein. Relative axial sliding is effected between the injection head and the mold plate for sequentially evacuating gas from the mold cells using a continuous vacuum followed in turn by sequentially injecting into the evacuated mold cells the liquid from a continuous source thereof. Sliding of the injection head over the mold plate automatically provides self valving for sequentially evacuating and filling the mold cells from the same side of the mold plate. In a preferred embodiment, the vacuum and injection slots are linked together at the mold plate so that surface tension of the liquid restrains flow of the liquid from the injection slot to the vacuum slot while allowing gas flow therebetween for effecting the vacuum in the mold cells.

Abstract: The present invention is directed to a rotary air coupling that distributes air to tires mounted on a rotating hub of a driven axle. The coupling is positioned outside of the axle and hub bearings avoiding interference with the wheel assembly. And the rotary coupling is connected to the brake mounting plate and the wheel hub to take advantage of existing space between these members with minimal change to existing wheel assemblies.