Abstract: A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO2, 5% to 15% of B2O3, 0 to <2% of Al2O3, and at least one alkaline earth metal oxide from the group consisting of MgO, CaO and SrO, wherein CaO is 0% to 5% and the sum of the alkaline earth metal oxides MgO, CaO and SrO is 0% to 20%, preferably 2% to 15%. The glass solder is preferably free from TeO2 and PbO. Preferred embodiments of the glass solder contain from 3 to 15 wt. % of Y2O3 and have low porosity and high stability with respect to a moist fuel gas environment.

Abstract: The invention discloses boron-free neutral glasses having the composition (in % by weight, based on oxide) 65-72 SiO2, 11-17 Al2O3, 0.1-8 Na2O, 3-8 MgO, 4-12 CaO and 0-10 ZnO, a ratio CaO/MgO of 1.4 to 1.6, and having a hydrolytic resistance in accordance with DIN ISO 719 in class 1 and an acid resistance in accordance with DIN 12116 and an alkali resistance in accordance with DIN ISO 695 at least in class 2.

Abstract: The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; 0.0, CeO2; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of <2. The solder glass preferably contains from 80.5 to 85 wt. % of Bi2O3 and is free of lead. This solder glass has a linear thermal expansion coefficient ?(20-300) of <11.5×10?6/K and a transformation temperature Tg of <380° C. A solder glass preparation for connecting or sealing a glass part with a metal part contains the low melting solder glass and up to 20 wt. % of ?-eucryptite, cordierite, mullite, willemite or zircon.

Abstract: The invention relates to a low-radiation cover glass for radiation-sensitive sensors, with low intrinsic ?-radiation, in particular for use with semiconductor technology. The glass includes a glass composition, selected from the following: aluminosilicate glass, aluminoborosilicate glass, borosilicate glass, in particular borosilicate glass that is devoid of alkali, with a TiO2 content of >0.1-10% by weight, in particular 1-8% by weight.

Abstract: The invention relates to a method for producing a low-radiation cover glass with low intrinsic ?-radiation for radiation-sensitive sensors, in particular for use with semiconductor technology, without the production of intermediate moulds, by the direct shaping of plate glass with appropriate dimensions. The invention also relates to a device for carrying out said method.

Abstract: The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilize the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.

Abstract: An aluminoborosilicate glass having a density less than 2.40 g/cm3 and a specific modulus of elasticity greater than 30 GPa·cm3·g?1 is disclosed that comprises the following components (in wt. %): SiO2 58-70, Al2O3 12-20, B2O3 5-15, MgO 0-9, CaO 2-12, BaO 0, 1-5, SnO2 0-1, As2O3 0-2, the glass, apart from random impurities, being free of SrO and free of alkali oxides. The glass is particularly suitable as a substrate glass for LCD displays, for example.

Abstract: The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of <2. The solder glass preferably contains from 80.5 to 85 wt. % of Bi2O3 and is free of lead. This solder glass has a linear thermal expansion coefficient ?(20-300) of <11.5×10?6/K and a transformation temperature Tg of <380° C. A solder glass preparation for connecting or sealing a glass part with a metal part contains the low melting solder glass and up to 20 wt. % of ?-eukryptite, cordierite, mullite, willemite or zircon.

Abstract: The invention relates to a method for producing glass-coated electronic components and the use of the method for passivating electronic components.

Abstract: The invention relates to an alkaline-earth aluminosilicate glass with the following composition (in wt. %, based on oxide content): SiO2 >58-62; B2O3 0 5.5; Al2O3 13.5 17.5; MgO 0-7; CaO 5.5-14; SrO 0-8, BaO 6-14; ZrO2 0-2; CeO2 0.001 0.5; TiO2 0.01-2. The glass is particularly suitable for use as a bulb material for halogen light bulbs.

Abstract: A mesh (36) is placed around a bundle (32) of fused glass fibers. The bundle is then immersed in a leaching bath (44). The ends of the bundle are protected from the bath fluid by furrules (34). Some of the glass of the bundle is leached out, so as to provide a flexible fiber bundle.

Abstract: An aluminoborosilicate glass having a density less than 2.40 g/cm3 and a specific modulus of elasticity greater than 30 GPa·cm3·g?1 is disclosed that comprises the following components (in wt. %): SiO2 58-70, Al2O3 12-20, B2O3 5-15, MgO 0-9, CaO 2-12, BaO 0,1-5, SnO2 0-1, As2O3 0-2, the glass, apart from random impurities, being free of SrO and free of alkali oxides. The glass is particularly suitable as a substrate glass for LCD displays, for example.

Abstract: An aluminoborosilicate glass with a coefficient of thermal expansion CTE ?3.3·10?6/K is disclosed, comprising the constituents (in wt. %): SiO2 58-70, Al2O3 17-18, B2O3 5-15, MgO 0-9, CaO 2-12, BaO 0.1-5, SnO2 0-1, As2O3 0-2, the glass, apart from random impurities, being free of strontium oxide and free of alkali oxides. The proportion (in wt. %) of SiO2.B2O3/Al2O3 is between 32 and 38, and the mean gradient of the viscosity curve is less than or equal to ?5.50·10?3 dPas/K in the range between the common logarithm of the viscosities between 4 and 2 (i.e. for viscosities between 104 dPas and 102 dPas). The glass is particularly suitable as a substrate glass, for example for LCD displays.

Abstract: To improve the cutting properties, especially the cutting rate, of thin flat glass by means of a laser cutting beam from a Nd:YAG solid-state laser, the flat glass is provided during its manufacture with at least one additive ingredient that effectively absorbs radiation at a wavelength of 1.064 ?m. Preferably the additive ingredient is preferably samarium oxide (Sm2O3). A method of cutting through a flat glass sheet whose composition contains at least one additive ingredient that absorbs a significant amount of radiation at a wavelength of 1.064 ?m, which includes cutting the flat glass sheet with the focused radiation of a Nd:YAG laser, is also part of the present invention.

Abstract: The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilise the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.

Abstract: An alkali-free aluminoborosilicate glass having a coefficient of thermal expansion ?20/300 of between 2.8×10?6/K and 3.8×10?6/K, which has the following composition (in % by weight, based on oxide): silicon dioxide (SiO2)>58–65, boric oxide (B2O3)>6–11.5, magnesium oxide (MgO) 4–8, barium oxide (BaO) 0–<0.5, zinc oxide (ZnO) 0–2 and aluminum oxide (Al2O3)>14–25, calcium oxide (CaO) 0–8, strontium oxide (SrO) 2.6–<4, with barium oxide (BaO)+strontium oxide (SrO)>3, or aluminum oxide (Al2O3)>14–25, calcium oxide (CaO) 0–<2, strontium oxide (SrO)>0.5–<4, or aluminum oxide (Al2O3)>21–25, calcium oxide (CaO) 0–8, strontium oxide (SrO)>2.6–<8, with barium oxide (BaO)+strontium oxide (SrO)>3, and which is highly suitable for use as a substrate glass both in display technology and in thin-film photovoltaics.

Abstract: A light device, preferably a metal halide high pressure discharge lamp, which includes a first body which has a light element, a second body which encompasses the first body, whereby the second body consists essentially of an Al-silicate glass, for example a hard glass. The Al-silica glass has a Tg of >600° C., preferred >650° C., especially preferred >700° C., particularly preferred >750° C., and a thermal expansion coefficient ?20/300>0, preferably in the range of 3??20/300?6, particularly preferred 3.5??20/300?5.

Abstract: The lead-free glass tubing of the SiO2—B2O3—R2O—BaO—ZnO—TiO2 system has a composition, in percent by weight on an oxide basis, consisting essentially of: SiO2, 34 to 52; B2O3, 10 to 25; Al2O3, 0 to 25; Li2O, 2 to 6; Na2O, 4 to 10; K2O, 2 to 6; CaO, 0 to 4; BaO, 1 to 5; ZnO, 4 to 12; TiO2, 2 to 6, and at least one refining agent in an effective amount for refining. An encapsulated diode consisting of a diode encapsulated with this lead-free glass tubing is also disclosed.

Abstract: A method of mounting electro-optical devices on an optical element using an auxiliary substrate is provided herein. Electro-optical fiber optic assemblies are also described herein.

Abstract: The lead-free glass tubing of the SiO2—B2O3—R2O—BaO—ZnO—TiO2 system has a composition, in percent by weight on an oxide basis, consisting essentially of: SiO2, 34 to 52; B2O3, 10 to 25; Al2O3, 0 to 25; Li2O, 2 to 6; Na2O, 4 to 10; K2O, 2 to 6; CaO, 0 to 4; BaO, 1 to 5; ZnO, 4 to 12; TiO2, 2 to 6, and at least one refining agent in an effective amount for refining. An encapsulated diode consisting of a diode encapsulated with this lead-free glass tubing is also disclosed.