Abstract: A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

Abstract: A user interface is provided for conducting online conversations that span asynchronous and synchronous modes of communications. Users can initiate a new conversation or find existing conversations by choosing images of friends from a drop down list based on text input of friends' names. Conversations are represented in a tree-branch configuration such that new comments added to a conversation are associated directly to the existing comments to which they respond. Branches can be opened or collapsed automatically or at the users' option, allowing the user focus his attention on part(s) of the conversation. Content from the web can be searched and found content can be included into the body of a comment. All participants in a conversation see the same representation of the conversation and links to referenced Web content are maintained in tact regardless of the length and complexity of the conversation.

Abstract: Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.

Abstract: A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

Abstract: Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.

Abstract: A three piece spherical bearing has a race having two axial halves. One axial half has a spherical bore. The other axial half has a bore which tapers radially outward and axially inward at an angle of about 11.degree. or more to an axial direction. The tapered wall has one or more annular depressions with radial walls and walls at angles to the radial walls. A ball having a spherical outer surface and an axial bore is placed in the race. An insert having a curved inner surface and having an outer surface with a diameter slightly less than the minimum diameter of the tapered wall is pressed into the race and is expanded around the ball into contact with the tapered wall. Forces which tend to force the insert cause sharp linear pointed surfaces at the insert of the tapered wall and radial walls of the grooves to bite into the outer surface of the insert, tightly gripping the insert within the race and holding the three part spherical bearing together.