Patents by Inventor Peter De Dobbelaere
Peter De Dobbelaere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11424837Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between first and second reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: GrantFiled: November 30, 2020Date of Patent: August 23, 2022Assignee: Cisco Technology, INCInventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini
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Publication number: 20210175979Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between first and second reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: ApplicationFiled: November 30, 2020Publication date: June 10, 2021Inventors: Peter DE DOBBELAERE, Attila MEKIS, Gianlorenzo MASINI
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Patent number: 10892845Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a transparent spacer, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through the transparent spacer, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the transparent spacer, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.Type: GrantFiled: July 16, 2019Date of Patent: January 12, 2021Assignee: Luxtera, LLCInventors: Mark Peterson, Subal Sahni, Peter De Dobbelaere
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Patent number: 10879648Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between first and second reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: GrantFiled: December 30, 2019Date of Patent: December 29, 2020Assignee: Luxtera LLCInventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini
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Patent number: 10873399Abstract: Methods and systems for a photonic interposer may include receiving a continuous wave (CW) optical signal in a silicon photonic interposer from an optical source. A modulated optical signal may be generated by processing the received CW optical signal based on a first electrical signal received from an electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signal, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of a processor core, a switch core, memory, or a router.Type: GrantFiled: August 6, 2019Date of Patent: December 22, 2020Assignee: Luxtera LLCInventors: Mark Peterson, Greg Young, Peter De Dobbelaere
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Patent number: 10727944Abstract: Methods and systems for optoelectronics transceivers of a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers, which may include a guard ring. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.Type: GrantFiled: July 2, 2019Date of Patent: July 28, 2020Assignee: Luxtera LLC.Inventors: Thierry Pinguet, Steffen Gloeckner, Sherif Abdalla, Sina Mirsaidi, Peter De Dobbelaere, Lawrence C. Gunn, III
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Patent number: 10686526Abstract: Methods and systems for silicon photonics wavelength division multiplexing transceivers are disclosed and may include, in a transceiver integrated in a silicon photonics chip: generating a first modulated output optical signal at a first wavelength utilizing a first electrical signal, generating a second modulated output optical signal at a second wavelength utilizing a second electrical signal, communicating the first and second modulated output optical signals into an optical fiber coupled to the chip utilizing a multiplexing grating coupler in the chip. A received input optical signal may be split into a modulated input optical signal at the first wavelength and a modulated input optical signal at the second wavelength utilizing a demultiplexing grating coupler in the chip. The first and second modulated input optical signals may be converted to first and second electrical input signals utilizing first and second photodetectors in the chip.Type: GrantFiled: March 14, 2019Date of Patent: June 16, 2020Assignee: Luxtera, Inc.Inventors: Attila Mekis, Peter De Dobbelaere, Lieven Verslegers, Peng Sun, Yannick De Koninck
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Publication number: 20200162185Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a transparent spacer, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through the transparent spacer, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the transparent spacer, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.Type: ApplicationFiled: July 16, 2019Publication date: May 21, 2020Inventors: Mark Peterson, Subal Sahni, Peter De Dobbelaere
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Publication number: 20200136317Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between first and second reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: ApplicationFiled: December 30, 2019Publication date: April 30, 2020Inventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini
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Patent number: 10523337Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: GrantFiled: March 14, 2019Date of Patent: December 31, 2019Assignee: Luxtera, Inc.Inventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini
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Publication number: 20190363797Abstract: Methods and systems for a photonic interposer may include receiving a continuous wave (CW) optical signal in a silicon photonic interposer from an optical source. A modulated optical signal may be generated by processing the received CW optical signal based on a first electrical signal received from an electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signal, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of a processor core, a switch core, memory, or a router.Type: ApplicationFiled: August 6, 2019Publication date: November 28, 2019Inventors: Mark Peterson, Greg Young, Peter De Dobbelaere
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Publication number: 20190342006Abstract: Methods and systems for optoelectronics transceivers of a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers, which may include a guard ring. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.Type: ApplicationFiled: July 2, 2019Publication date: November 7, 2019Inventors: Thierry Pinguet, Steffen Gloeckner, Sherif Abdalla, Sina Mirsaidi, Peter De Dobbelaere, Lawrence C. Gunn, III
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Patent number: 10374719Abstract: Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.Type: GrantFiled: November 5, 2018Date of Patent: August 6, 2019Assignee: LUXTERA, INC.Inventors: Mark Peterson, Greg Young, Peter De Dobbelaere
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Patent number: 10365447Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. A continuous wave (CW) optical signal may be received in the photonic interposer from the light source assembly, and a modulated optical signal may be communicated between the optical fiber and photonic interposer. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.Type: GrantFiled: February 28, 2018Date of Patent: July 30, 2019Assignee: Luxtera, Inc.Inventors: Attila Mekis, Peter De Dobbelaere, Gianlorenzo Masini, Yannick De Koninck, Thierry Pinguet
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Patent number: 10355805Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a plurality of transparent spacers, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through a first of the plurality of transparent spacers, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the first of the plurality of transparent spacers, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.Type: GrantFiled: August 9, 2018Date of Patent: July 16, 2019Assignee: Luxtera, Inc.Inventors: Mark Peterson, Subal Sahni, Peter De Dobbelaere
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Publication number: 20190215075Abstract: Methods and systems for silicon photonics wavelength division multiplexing transceivers are disclosed and may include, in a transceiver integrated in a silicon photonics chip: generating a first modulated output optical signal at a first wavelength utilizing a first electrical signal, generating a second modulated output optical signal at a second wavelength utilizing a second electrical signal, communicating the first and second modulated output optical signals into an optical fiber coupled to the chip utilizing a multiplexing grating coupler in the chip. A received input optical signal may be split into a modulated input optical signal at the first wavelength and a modulated input optical signal at the second wavelength utilizing a demultiplexing grating coupler in the chip. The first and second modulated input optical signals may be converted to first and second electrical input signals utilizing first and second photodetectors in the chip.Type: ApplicationFiled: March 14, 2019Publication date: July 11, 2019Inventors: Attila Mekis, Peter De Dobbelaere, Lieven Verslegers, Peng Sun, Yannick De Koninck
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Publication number: 20190215079Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: ApplicationFiled: March 14, 2019Publication date: July 11, 2019Inventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini
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Patent number: 10341021Abstract: Methods and systems for optoelectronics transceivers integrated on a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers on a top surface of a CMOS chip, which may include a guard ring. Photodetectors may be integrated in the CMOS chip. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the top surface of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.Type: GrantFiled: November 6, 2017Date of Patent: July 2, 2019Assignee: Luxtera, Inc.Inventors: Thierry Pinguet, Steffen Gloeckner, Sherif Abdalla, Sina Mirsaidi, Peter De Dobbelaere
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Patent number: 10236985Abstract: Methods and systems for silicon photonics wavelength division multiplexing transceivers are disclosed and may include, in a transceiver integrated in a silicon photonics chip: generating a first modulated output optical signal at a first wavelength utilizing a first electrical signal, generating a second modulated output optical signal at a second wavelength utilizing a second electrical signal, communicating the first and second modulated output optical signals into an optical fiber coupled to the chip utilizing a multiplexing grating coupler in the chip. A received input optical signal may be split into a modulated input optical signal at the first wavelength and a modulated input optical signal at the second wavelength utilizing a demultiplexing grating coupler in the chip. The first and second modulated input optical signals may be converted to first and second electrical input signals utilizing first and second photodetectors in the chip.Type: GrantFiled: February 28, 2018Date of Patent: March 19, 2019Assignee: Luxtera, Inc.Inventors: Attila Mekis, Peter De Dobbelaere, Lieven Verslegers, Peng Sun, Yannick De Koninck
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Patent number: 10236996Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an integrated optical communication system including CMOS electronics die coupled to a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.Type: GrantFiled: April 11, 2018Date of Patent: March 19, 2019Assignee: Luxtera, Inc.Inventors: Peter De Dobbelaere, Attila Mekis, Gianlorenzo Masini