Patents by Inventor Peter Emmi

Peter Emmi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma RIE polymer removal
    Patent number: 6758223
    Abstract: A method for removal of post reactive ion etch by-product from a semiconductor wafer surface or microelectronic composite structure comprising: supplying a reducing gas plasma incorporating a forming gas mixture selected from the group consisting of a mixture of N2/H2 or a mixture of NH3/H2 into a vacuum chamber in which a semiconductor wafer surface or a microelectronic composite structure is supported to form a post-RIE polymer material by-product on the composite structure without significant removal of an organic, low K material which has also been exposed to the reducing gas plasma; and removing the post-RIE polymer material by-product with a wet clean.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: July 6, 2004
    Assignee: Infineon Technologies AG
    Inventors: Andy Cowley, Peter Emmi, Timothy Dalton, Christopher Jahnes
  • Plasma RIE polymer removal
    Publication number: 20020088476
    Abstract: A method for removal of post reactive ion etch by-product from a semiconductor wafer surface or microelectronic composite structure comprising:
    Type: Application
    Filed: January 10, 2002
    Publication date: July 11, 2002
    Applicant: Infineon Technologies North America Corp.
    Inventors: Andy Cowley, Peter Emmi, Timothy Dalton, Christopher Jahnes