Abstract: Hybrid inorganic-organic, polymeric alloys are prepared by combining atomic layer deposition and molecular layer deposition techniques provide barrier protection against intrusion of atmospheric gases such as oxygen and water vapor. The alloy may be formed either directly on objects to be protected, or on a carrier substrate to form a barrier structure that subsequently may be employed to protect an object. The alloy thus formed is beneficially employed in constructing electronic devices such as photovoltaic cell arrays, organic light-emitting devices, and other optoelectronic devices.

Abstract: Hybrid inorganic-organic, polymeric alloys prepared by combining atomic layer deposition and molecular layer deposition techniques provide barrier protection against intrusion of atmospheric gases such as oxygen and water vapor. The alloy may be formed either directly on objects to be protected, or on a carrier substrate to form a barrier structure that subsequently may be employed to protect an object. The alloy is beneficially employed in constructing electronic devices such as photovoltaic cell arrays, organic light-emitting devices, and other optoelectronic devices. Also provided are methods for preparing the foregoing alloy, barrier structure, and devices.

Abstract: A cassette for supporting a film during a gaseous vapor deposition process includes a central shaft having first and second end plates. A rib on each end plate forms a spiral groove able to accept an edge of a film. Each rib has a cross sectional configuration having substantially linear major edges, a predetermined width dimension and a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The rib could be substantially rectangular with an optional flow spoiler at the free end or substantially wedge-shaped. The interspoke spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the interspoke spacing.

Abstract: A vapor deposition apparatus includes an insert within which a material is deposited on the surface of a film. A cassette includes end plates each having a rib that edgewise receive a spiral wrapping of a film at least 300 mm wide. Spaces between turns of the wrapping define a gas flow channel and spaces between adjacent turns of one rib define inlet openings that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least 300 mm and is also greater than the film width at deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the end plate spacing. A diverging flow director contacts one end plate to directing gaseous fluid toward the inlet openings in that end plate.

Abstract: A cassette for supporting a film during a gaseous vapor deposition has first and second end plates. A rib on each end plate forms a spiral groove that edgewise receives a spiral wrapping of a film having a width greater than 300 mm. Spaces between turns of the film wrapping define a gas flow channel and spaces between adjacent turns of the rib define a plurality of inlet openings in one end plate that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the end plate spacing.

Abstract: Gas permeation barriers can be deposited on plastic or glass substrates by atomic layer deposition (ALD). The use of the ALD coatings can reduce permeation by many orders of magnitude at thicknesses of tens of nanometers with low concentrations of coating defects. These thin coatings preserve the flexibility and transparency of the plastic substrate. Such articles are useful in container, electrical and electronic applications.

Abstract: A durable metallized moisture vapor permeable sheet is formed by coating a moisture vapor permeable sheet with at least one metal coating comprising a layer of a corrosion resistant metal or a plurality of metal layers having differing compositions. The metallized moisture vapor permeable sheet material is suitable for use as a building construction wrap such as roof lining and house wrap, and as EMF radiation shielding material.

Abstract: A multilayer article having a cell substrate; a thin-film photovoltaic cell disposed on the cell substrate; an encapsulant layer disposed on the photovoltaic cell; and at least one plastic substrate coated on at least one side with one or more transparent, amorphous barrier layers disposed on the encapsulant layer. The invention extends to the process of making the article.

Abstract: A cassette for supporting a film during a gaseous vapor deposition has first and second end plates. A rib on each end plate forms a spiral groove that edgewise receives a spiral wrapping of a film having a width greater than 300 mm. Spaces between turns of the film wrapping define a gas flow channel and spaces between adjacent turns of the rib define a plurality of inlet openings in one end plate that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the end plate spacing.

Abstract: A cassette for supporting a film during a gaseous vapor deposition process includes a central shaft having first and second end plates. A rib on each end plate forms a spiral groove able to accept an edge of a film. Each rib has a cross sectional configuration having substantially linear major edges, a predetermined width dimension and a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The rib could be substantially rectangular with an optional flow spoiler at the free end or substantially wedge-shaped. The interspoke spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the interspoke spacing.

Abstract: A vapor deposition apparatus includes an insert within which a material is deposited on the surface of a film. A cassette includes end plates each having a rib that edgewise receive a spiral wrapping of a film at least 300 mm wide. Spaces between turns of the wrapping define a gas flow channel and spaces between adjacent turns of one rib define inlet openings that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least 300 mm and is also greater than the film width at deposition temperature. The width dimension of each rib is between about 0.5% to about 2.0% of the end plate spacing. A diverging flow director contacts one end plate to directing gaseous fluid toward the inlet openings in that end plate.

Abstract: The present invention is a method for making a film cassette end plate and a film cassette comprises two end plates. The uncoated end plates are formed using one of several known plastic forming methods. The end plates are coated with an inorganic coating to impart smoothness and hardness to facilitate film handling and reduce wear. The end plates are mounted on a shaft to form a cassette.

Abstract: A durable metallized moisture vapor permeable sheet is formed by coating a moisture vapor permeable sheet with at least one metal coating comprising a layer of a corrosion resistant metal or a plurality of metal layers having differing compositions. The metallized moisture vapor permeable sheet material is suitable for use as a building construction wrap such as roof lining and house wrap, and as EMF radiation shielding material.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: This invention relates to novel, transparent oxide semiconductor thin film transistors (TFT's) and a process for making them.

Abstract: Gas permeation barriers can be deposited on plastic or glass substrates by atomic layer deposition (ALD). The use of the ALD coatings can reduce permeation by many orders of magnitude at thicknesses of tens of nanometers with low concentrations of coating defects. These thin coatings preserve the flexibility and transparency of the plastic substrate. Such articles are useful in container, electrical and electronic applications.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: Transistors fabricated with transparent oxide semiconductors are provided. The semiconductors are metal oxides deposited without the intentional incorporation of additional doping elements, and enable the fabrication of transparent thin film transistors. The transparent transistors can be used to control pixels in a display, without significantly reducing the active area of the pixels.

Abstract: The present invention relates to a device having a flexible organic electronic device comprising in the order listed: a) a first flexible composite barrier structure comprising at least one layer of a first polymeric film and at least one layer of a first barrier material, the first barrier structure having a first inner surface, b) at least one first electrical contact layer, c) at least one active layer comprising an organic active material, said active layer having dimensions defined by a length and a width, d) at least one second electrical contact layer, e) a second flexible composite barrier structure comprising at least one layer of a second polymeric film and at least one layer of a second barrier material, the second barrier structure having a second inner surface, wherein at least one of the first and second composite barrier structures is light-transmitting and the first and second composite barrier structures are sealed together to envelop the at least one active layer.