Patents by Inventor Peter Gruber

Peter Gruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES
    Publication number: 20080272177
    Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.
    Type: Application
    Filed: July 15, 2008
    Publication date: November 6, 2008
    Inventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
  • ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
    Publication number: 20080251281
    Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
    Type: Application
    Filed: April 11, 2007
    Publication date: October 16, 2008
    Inventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
  • Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling
    Publication number: 20080245847
    Abstract: A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Applicant: International Business Machines Corporation
    Inventors: Russell A. Budd, Evan G. Colgan, Peter A. Gruber, Gareth G. Hougham, John P. Karidis
  • Rotational fill techniques for injection molding of solder
    Patent number: 7416104
    Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: August 26, 2008
    Assignee: International Business Machines Corporation
    Inventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
  • Fill head for injection molding of solder
    Patent number: 7410092
    Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: August 12, 2008
    Assignee: International Business Machines Corporation
    Inventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
  • Conductive bonding material fill techniques
    Patent number: 7410090
    Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: August 12, 2008
    Assignee: International Business Machines Corporation
    Inventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
  • MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS
    Publication number: 20080182124
    Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0 % by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.
    Type: Application
    Filed: January 30, 2007
    Publication date: July 31, 2008
    Inventors: Peter A. Gruber, Donald W. Henderson, Sung K. Kang, Da-Yuan Shih
  • FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER
    Publication number: 20080179035
    Abstract: A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder.
    Type: Application
    Filed: January 25, 2007
    Publication date: July 31, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Peter A. Gruber, John U. Knickerbocker
  • Method and Apparatus Providing a Structure Relative To A Support
    Publication number: 20080176055
    Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
    Type: Application
    Filed: January 19, 2007
    Publication date: July 24, 2008
    Inventors: Peter A. Gruber, Philip Charles Danby Hobbs
  • TECHNIQUES FOR FORMING INTERCONNECTS
    Publication number: 20080175939
    Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 24, 2008
    Applicant: International Business Machines Corporation
    Inventors: David H. Danovitch, Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih
  • Pressure-only molten metal valving apparatus and method
    Patent number: 7401637
    Abstract: A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 22, 2008
    Assignee: International Business Machines Corporation
    Inventors: Glen N. Biggs, John J. Garant, Peter A. Gruber, Bouwe W. Leenstra, Christopher L. Tessler, Thomas Weiss
  • Injection molded microoptics
    Patent number: 7399421
    Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: July 15, 2008
    Assignee: International Business Machines Corporation
    Inventors: Lawrence Jacobowitz, Stephen L. Buchwalter, Casimer DeCusatis, Peter A. Gruber, Da-Yuan Shih
  • INJECTION MOLDED SOLDER BALL METHOD
    Publication number: 20080164609
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Application
    Filed: January 8, 2007
    Publication date: July 10, 2008
    Applicant: International Business Machines Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
    Publication number: 20080156849
    Abstract: An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
    Type: Application
    Filed: January 3, 2007
    Publication date: July 3, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric E. Bouchard, Guy Brouillette, David H. Danovitch, Peter A. Gruber, Jean-Luc Landreville
  • Techniques for forming interconnects
    Patent number: 7348270
    Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: March 25, 2008
    Assignee: International Business Machines Corporation
    Inventors: David H. Danovitch, Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih
  • Particulate form of a pharmaceutical composition which is easy to swallow
    Publication number: 20080063713
    Abstract: The present invention relates to a pharmaceutical composition for direct oral administration which is very easy to swallow especially for young children, comprising at least one pharmaceutically active compound. The pharmaceutical composition is present in the form of one or more particles. The particles comprise a core containing the active ingredient which has been provided with one or more coatings. The pharmaceutical composition is preferably administered in combination with a powder and/or granules which, when applied to the tongue, spontaneously generate additional saliva. With the extra saliva, the coated particles form a soft, smooth, but mechanically stable surface perceived as pleasant in the mouth within seconds so that they may be swallowed easily and practically in the right quantity with the extra saliva formed.
    Type: Application
    Filed: September 7, 2006
    Publication date: March 13, 2008
    Inventors: Peter Gruber, Peter Kraahs
  • Fluxless solder transfer and reflow process
    Patent number: 7332424
    Abstract: Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: February 19, 2008
    Assignee: International Business Machines Corporation
    Inventors: Luc Bélanger, Peter A. Gruber, Valérie Oberson, Christopher L. Tessler
  • Precision fabricated silicon mold
    Publication number: 20080029686
    Abstract: The invention provides a reusable precision fabricated silicon mold comprising a mold made of silicon which comprises a desired pattern of physical features cavities etched into the mold to transfer a patter on bumps to a semiconductor wafer, e.g., computer chip, semiconductor device, silicon on insulator device, etc.; an aperture etched into the mold adapted to allow gases to escape but does not to allow a solder to escape during the process of transferring solder bumps to a chip; a protective oxide or nitride on the mold; alignment marks adapted to properly align the mold with a semiconductor wafer; an organic release material on the mold adapted to release the mold from the semiconductor wafer, wherein the mold precisely defines a conductive adhesive material volume for interconnects on the semiconductor wafer.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 7, 2008
    Applicant: International Business Machines Corporation
    Inventors: Peter A. Gruber, John U. Knickerbocker
  • Pressure-only molten metal valving apparatus and method
    Publication number: 20080023526
    Abstract: A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.
    Type: Application
    Filed: July 28, 2006
    Publication date: January 31, 2008
    Inventors: Glen N. Biggs, John J. Garant, Peter A. Gruber, Bouwe W. Leenstra, Christopher L. Tessler, Thomas Weiss
  • Dosage form of sodium ibuprofen
    Publication number: 20080020042
    Abstract: A non effervescent tablet of ibuprofen, comprising a tablet core and, if desired, a sugar or film coat, wherein the tablet core, based on the weight of the tablet core, consists of 50 to 100% by weight sodium ibuprofen hydrate and 50 to 0% by weight auxiliary material component and contains no lubricant and no disintegrant, and wherein the sodium ibuprofen hydrate has a water content of 8 to 16% by weight, preferably 11 to 16% by weight, possesses a suffcient hardness, is comparably small and leads to a particularly rapid increase in blood level and thereby to an accelerated onset of analgesic effect. Contrary to the current doctrine sodium ibuprofen hydrate having a suitable water content is sufficiently compressible.
    Type: Application
    Filed: August 10, 2007
    Publication date: January 24, 2008
    Inventors: Peter Gruber, Markus Reher
  • Printing apparatus having an eraser for erasing a printed character
    Patent number: 5044802
    Abstract: A printing apparatus including a print mechanism for printing key-input print information; an eraser for erasing a character or symbol printed on a recording medium with the print mechanism; a first memory for storing the key-input information; a second memory for storing information on a print object erased with the eraser; and an erasure controller for controlling the eraser in accordance with a comparison result between the erased object information stored in the second memory and the key-input information stored in the first memory.
    Type: Grant
    Filed: December 26, 1990
    Date of Patent: September 3, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventor: Noriyuki Sugiyama