Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A design structure for noise suppression. A design structure has a noise detection unit, a noise suppression unit, and a control unit. The noise suppression unit has an input and an output, wherein the input of the noise detection unit is connected to a signal and generates a signal change at the output if a change in the signal is detected. The noise suppression unit has an input and an output, wherein the input of the noise suppression unit is connected to the output of the noise detection unit and generates a correction to the signal in response to detecting the signal change at the output of the noise detection unit. The control unit has an input and an output, wherein input to the control unit is connected to the signal and turns off the noise suppression unit if a state change is detected in the signal.

Abstract: A design structure for tuning an integrated circuit design holds a reference clock signal constant across the integrated circuit design and, while the reference clock signal is held constant, optimizes transistors forming a register within the integrated circuit design and thereafter optimizes transistors forming one or more clock buffers coupled to the reference clock signal.

Abstract: A Local Dynamic Power Controller (LDPC) generates and deliver to a load a full swing voltage supply signal and a reduced swing voltage supply signal. Both the full and reduce voltage supply signals are generated from a single power supply. The full swing voltage supply signal is supplied when the load is in full operational mode whereas the reduce voltage supply signal is provided when the load is in a sleep mode. As a consequence, power dissipated in the load is reduced.

Abstract: A configurable, low power high fan-in multiplexer (MUX) and design structure thereof are disclosed. The MUX circuit includes multiple current control elements, which each include multiple inverters coupled to a transmission gate. Each current control element receives a data signal and a select signal that corresponds to the data signal. If a select signal exceeds a threshold value (e.g., a logical “1”), the select signal deactivates a pull-up transistor (e.g., a p-type field effect transistor), and the transmission gate enables the corresponding data signal to provide input to a logic gate (e.g., a NAND gate) coupled to the output of the MUX. If the select signal does not exceed the threshold value, the select signal activates the pull-up transistor, and the transmission gate prevents the corresponding data signal from providing input to the logic gate.

Abstract: Embodiments that decrease power consumption of interconnecting devices in integrated circuits are disclosed. Embodiments reduce power consumption in integrated circuits by generating full and reduced swing signals at an output of a driver module in response to a control signal during and deactivating one or more elements to conserve power after an input signal remains unchanged for a period of time. Another embodiment reduces power consumption in a circuit, the embodiment comprising a swing module coupled with a swing selector and an output controller. The swing module may generate full or low swing signals depending on the state of the swing selector. The output controller may increase the output impedance of the swing module after an input signal to the swing module remains unchanged for a quantity of time. Various apparatus embodiments include portable computing devices and cellular telephones.

Abstract: A technique for operating a multiplexer includes selecting, from multiple transmission gate groups, a transmission gate group. A transmission gate is selected from the selected transmission gate group. Finally, a data signal associated with the selected transmission gate is provided at an output of the multiplexer.

Abstract: A technique for clock gating a clock domain of an integrated circuit includes storing first, second, and third values in a control register. The first value corresponds to a first number of clock cycles to wait before initiating clock gating, the second value corresponds to a second number of clock cycles in which clock gating is performed, and the third value corresponds to a third number of clock cycles in which clock gating is not performed. One of the first, second, and third values is selectively loaded from the control register into a counting circuit. The counting circuit counts from the loaded one of the first, second, and third values to a transition value. A compare signal is received at the control state machine (from the counting circuit) that indicates the counting circuit has reached the transition value.

Abstract: A high performance, low power up/down counter is set forth. The counter presented is controlled by two clock pulses, an up pulse and a down pulse, and updates all bits of the counter in parallel. These bits are then latched using a scannable pulsed limited output switching dynamic logic latch. By using a limited switch dynamic logic latch, the counter is able to utilize the speed of dynamic logic without requiring the traditional dynamic logic power. The area saved and speed gained by using a dynamic latch is significant compared to a typical edge-triggered flip-flop. Additionally, by computing all the next count state bits in parallel, the counter reduces an overall count computation delay by eliminating the counter ripple.

Abstract: A system and method of selective row energization based on write data, with a selective row energization system including a storage array 102 having M rows 104 and N columns 106; an N-bit data word register 108; a uniform-detect circuit 110 responsive to a data word to generate a uniform word data bit having a first value when the data word is uniform; an M-bit uniform-detect register 112 having M uniform-detect latches 114, each being associated with one of the M rows 104 and storing the uniform word data bit for the data word stored in the associated M row 104; and an M-bit row driver device 116 responsive to the uniform word data bit for each of the M rows 104 to inhibit energization of the M rows 104 for which the uniform word data bit is the first value.

Abstract: A circuit that has a limited switch dynamic logic gate having a front end logic circuit and a latch. The output of the front end logic circuit is connected to an input of the latch, and the front end logic circuit evaluates a set of input signals applied to the front end logic circuit to generate an output signal. The latch receives and holds the output signal. The circuit also has a logic circuit having an output connected to a clock input in the front end logic circuit. The logic circuit generates a modified clock signal in response to receiving a clock signal from a clock source, and the modified clock signal has a duration that provides a minimum period of time for the front end logic to evaluate the set of input signals and generate the output signal.

Abstract: Methods and apparatuses to decrease power consumption and reduce leakage current of integrated circuits are disclosed. New leakage power saving techniques for various types of integrated circuits, including cache memory circuits, are discussed. Embodiments comprise methods and apparatuses to reduce power consumption in integrated circuits by using virtual voltage rails, or virtual power rails, to supply power to integrated circuit loads. The methods and apparatuses generally involve using one or two virtual power control devices to “head” and “foot”, or sandwich, the integrated circuit loads from firm power supply rails. In these method embodiments, one or more elements sense the voltage of the virtual power rails, or nodes, and make adjustments to control the voltage at certain “virtual” voltage potentials. While controlling the voltage in this manner, the virtual power control devices may serve to restrict unnecessary current flow through the integrated circuit loads.

Abstract: A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.

Abstract: A design structure for a circuit that has a limited switch dynamic logic gate having a front end logic circuit and a latch. The output of the front end logic circuit is connected to an input of the latch, and the front end logic circuit evaluates a set of input signals applied to the front end logic circuit to generate an output signal. The latch receives and holds the output signal. The circuit also has a logic circuit having an output connected to a clock input in the front end logic circuit. The logic circuit generates a modified clock signal in response to receiving a clock signal from a clock source, and the modified clock signal has a duration that provides a minimum period of time for the front end logic to evaluate the set of input signals and generate the output signal.

Abstract: A circuit that has a limited switch dynamic logic gate having a front end logic circuit and a latch. The output of the front end logic circuit is connected to an input of the latch, and the front end logic circuit evaluates a set of input signals applied to the front end logic circuit to generate an output signal. The latch receives and holds the output signal. The circuit also has a logic circuit having an output connected to a clock input in the front end logic circuit. The logic circuit generates a modified clock signal in response to receiving a clock signal from a clock source, and the modified clock signal has a duration that provides a minimum period of time for the front end logic to evaluate the set of input signals and generate the output signal.

Abstract: A design structure for noise suppression. A design structure has a noise detection unit, a noise suppression unit, and a control unit. The noise suppression unit has an input and an output, wherein the input of the noise detection unit is connected to a signal and generates a signal change at the output if a change in the signal is detected. The noise suppression unit has an input and an output, wherein the input of the noise suppression unit is connected to the output of the noise detection unit and generates a correction to the signal in response to detecting the signal change at the output of the noise detection unit. The control unit has an input and an output, wherein input to the control unit is connected to the signal and turns off the noise suppression unit if a state change is detected in the signal.

Abstract: A method and apparatus for noise suppression. A circuit has a noise detection unit, a noise suppression unit, and a control unit. The noise suppression unit has an input and an output, wherein the input of the noise detection unit is connected to a signal and generates a signal change at the output if a change in the signal is detected. The noise suppression unit has an input and an output, wherein the input of the noise suppression unit is connected to the output of the noise detection unit and generates a correction to the signal in response to detecting the signal change at the output of the noise detection unit. The control unit has an input and an output, wherein input to the control unit is connected to the signal and turns off the noise suppression unit if a state change is detected in the signal.