Patents by Inventor Peter J. Nystrom

Peter J. Nystrom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printhead with nanotips for nanoscale printing and manufacturing
    Patent number: 9038269
    Abstract: A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: May 26, 2015
    Assignee: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Andrew W. Hays, Bijoyraj Sahu
  • MEMS ACTUATOR PRESSURE COMPENSATION STRUCTURE FOR DECREASING HUMIDITY
    Publication number: 20150130876
    Abstract: A printhead including a venting system and an actuator array, wherein each actuator may include an actuator air chamber. The venting system includes an air path that vents each actuator air chamber to the atmosphere. The printhead further includes a dryer configured to remove moisture from air within the air path. The dryer may include a passive desiccant, an active resistive heater, or both.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Barry P. Mandel
  • MEMS actuator pressure compensation structure for decreasing humidity
    Patent number: 9016835
    Abstract: A printhead including a venting system and an actuator array, wherein each actuator may include an actuator air chamber. The venting system includes an air path that vents each actuator air chamber to the atmosphere. The printhead further includes a dryer configured to remove moisture from air within the air path. The dryer may include a passive desiccant, an active resistive heater, or both.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: April 28, 2015
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Barry P. Mandel
  • Thermo-pneumatic actuator working fluid layer
    Patent number: 9004651
    Abstract: An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include a plurality of channels in fluid communication with a plurality of working fluid chambers. After completing formation of the actuator array, working fluid may be injected into a working fluid inlet on an exterior of the actuator array and into the plurality of working fluid chambers through the plurality of channels.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: April 14, 2015
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Andrew W. Hays
  • Thermo-pneumatic actuator fabricated using silicon-on-insulator (SOI)
    Patent number: 9004652
    Abstract: An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include the use of a silicon-on-insulator (SOI) semiconductor wafer including a device layer, a handle layer, and a dielectric layer that physically separates the device layer from the handle layer to simplify printhead formation. During an exemplary process, the SOI wafer is attached to a heater wafer and a nozzle plate is attached to the dielectric layer such that, during use of the printhead, the device layer functions as an actuator membrane. Deflection of the device layer during use of the printhead creates a pressure within an ink chamber which causes ejection of ink from one of the nozzles of the array of nozzles.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: April 14, 2015
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Andrew W. Hays, Peter M. Gulvin
  • MULTI-LAYER ELECTROFORMED NOZZLE PLATE WITH ATTENUATION POCKETS
    Publication number: 20150097897
    Abstract: An ink jet printhead includes a nozzle plate including a nozzle, a recess in the nozzle plate, and a compliant layer that covers the recess and forms a sealed pocket that may be filled with air or another gas during use of the printhead. During actuation of a piezoelectric element during the ejection of ink from the nozzle, the sealed pocket attenuates an acoustic energy generated by the piezoelectric element, thereby reducing crosstalk to adjacent nozzles by the acoustic energy.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: XEROX CORPORATION
    Inventors: Gary D. Redding, Mark A. Cellura, Peter J. Nystrom, Andrew W. Hays
  • DOUBLE SIDED FLEX FOR IMPROVED BUMP INTERCONNECT
    Publication number: 20150085019
    Abstract: A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Applicant: XEROX CORPORATION
    Inventor: Peter J. Nystrom
  • Using saturated mesh to control adhesive bond line quality
    Patent number: 8979241
    Abstract: In some aspects of the present application, a printhead assembly is disclosed that comprise a plurality of functional plates stacked together; an adhesive confinement structure comprising an adhesive-coated mesh substrate arranged between adjacent functional plates to provide bonding between the plates.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 17, 2015
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Yanjia Zuo
  • THERMO-PNEUMATIC ACTUATOR WORKING FLUID LAYER
    Publication number: 20150070441
    Abstract: An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include a plurality of channels in fluid communication with a plurality of working fluid chambers. After completing formation of the actuator array, working fluid may be injected into a working fluid inlet on an exterior of the actuator array and into the plurality of working fluid chambers through the plurality of channels.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 12, 2015
    Applicant: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Andrew W. Hays
  • THERMO-PNEUMATIC ACTUATOR FABRICATED USING SILICON-ON-INSULATOR (SOI)
    Publication number: 20150070440
    Abstract: An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include the use of a silicon-on-insulator (SOI) semiconductor wafer including a device layer, a handle layer, and a dielectric layer that physically separates the device layer from the handle layer to simplify printhead formation. During an exemplary process, the SOI wafer is attached to a heater wafer and a nozzle plate is attached to the dielectric layer such that, during use of the printhead, the device layer functions as an actuator membrane. Deflection of the device layer during use of the printhead creates a pressure within an ink chamber which causes ejection of ink from one of the nozzles of the array of nozzles.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 12, 2015
    Applicant: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Andrew W. Hays, Peter M. Gulvin
  • Laser transmission laminating of materials for ink jet printheads
    Patent number: 8931879
    Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: January 13, 2015
    Assignee: Xerox Corporation
    Inventors: Peter J Nystrom, Mark A. Cellura, Bijoyraj Sahu
  • Ultrasonic laminating of materials for ink jet printheads
    Patent number: 8919915
    Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: December 30, 2014
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Mark A. Cellura, Bijoyraj Sahu
  • High density three-dimensional electrical interconnections
    Patent number: 8888254
    Abstract: Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. A piezoelectric element array for an ink jet print head can include a plurality of piezoelectric elements spaced from adjacent piezoelectric elements by an interstitial space. Each piezoelectric element can include a central void space formed in a first intermediate layer between the piezoelectric element array and a second intermediate layer that is operable to function as a free space for portions of the piezoelectric elements to actuate into when subjected to the voltage.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: November 18, 2014
    Assignee: Xerox Corporation
    Inventors: Xuejin Wen, Peter J. Nystrom, Gary D. Redding, Jun Ma
  • Laser welded bonding pads for piezoelectric print heads
    Patent number: 8857021
    Abstract: An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: October 14, 2014
    Assignee: Xerox Corporation
    Inventors: Bradley James Gerner, Peter J. Nystrom, Bryan R. Dolan
  • PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING
    Publication number: 20140295064
    Abstract: A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.
    Type: Application
    Filed: April 2, 2013
    Publication date: October 2, 2014
    Applicant: XEROX CORPORATION
    Inventors: Peter J. Nystrom, Andrew W. Hays, Bijoyraj Sahu
  • Structure and method to fabricate tooling for bumping thin flex circuits
    Patent number: 8845907
    Abstract: A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: September 30, 2014
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Bryan R. Dolan, Gary D. Redding
  • Method for flex circuit bonding without solder mask for high density electrical interconnect
    Patent number: 8826539
    Abstract: In some aspects of the present application, a method of manufacturing a print head is disclosed. The method can include providing a jet stack including an array of jets, bonding an actuator layer to the jet stack, the actuator layer including an actuator array, applying a standoff adhesive layer to the actuator layer and the jet stack, the standoff layer having an array of holes, wherein each hole of the array of holes overlies one of the actuators of the actuator array. A flex circuit layer having an array of bumped contact pads is aligned such that each bumped contact pad aligns with one of the holes of the standoff adhesive. Further, the flex circuit layer is boned to the jet stack layer.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: September 9, 2014
    Assignee: Xerox Corporation
    Inventors: Bryan R. Dolan, Peter J. Nystrom
  • Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
    Patent number: 8828750
    Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: September 9, 2014
    Assignee: Xerox Corporation
    Inventors: Peter J Nystrom, Peter M Gulvin, Paul W Browne
  • Reduced mechanical coupling with structured flex circuits
    Patent number: 8814326
    Abstract: An actuator assembly including a flexible printed circuit and a method for making such an actuator assembly are provided. The flexible printed circuit includes a body having a top side and a bottom side, with the body defining a plurality of bumps extending from the bottom side. A first bump of the plurality of bumps is disposed adjacent to a second bump of the plurality of bumps, and the body further defines at least one relief configured to reduce movement of the second bump caused by movement of the first bump. The flexible printed circuit also includes a plurality of contact pads disposed on the bottom side of the body at least partially at the plurality of bumps, with the plurality of contacts pads being configured to be electrically coupled to a power source and to a piezoelectric transducer.
    Type: Grant
    Filed: October 3, 2012
    Date of Patent: August 26, 2014
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Bryan R. Dolan, Bradley James Gerner
  • Polymer film as an interstitial fill for PZT printhead fabrication
    Patent number: 8814328
    Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: August 26, 2014
    Assignee: Xerox Corporation
    Inventors: Gary D Redding, Bryan R Dolan, Mark A Cellura, Peter J Nystrom