Abstract: In some aspects of the present application, a print head and a method of forming the print head are disclosed. The print head can include an array of jets formed in a jet stack; at least one ink reservoir operable to deliver ink to the jet stack; an actuator array arranged on the control circuitry formed into an actuator layer to cause the reservoir to deliver ink in response to signals from the control circuitry; a standoff adhesive layer arranged on the actuator layer, the standoff adhesive layer having an array of holes corresponding to the actuators; and a flex circuit layer having an array of bumped contacts pad corresponding to the array of holes of the standoff adhesive layer.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.

Abstract: A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

Abstract: A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.

Abstract: A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module.

Abstract: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

Abstract: A printhead for an ink jet printer can be formed as a plurality of substructures which are connected subsequent to inspection and/or testing. A substructure can include a semiconductor substrate such as a silicon substrate having a plurality of heater traces which are used to maintain a temperature of melted solid ink within a tolerance of a desired temperature. The traces can be accurately formed using semiconductor processing techniques. Testing and/or inspecting the substructures prior to assembly can reduce rework and scrap, and can allow the formation of printhead structures from a wide variety of materials.

Abstract: An ink jet printhead including a plurality of piezoelectric elements and a photosensitive interstitial layer which fills spaces between each adjacent piezoelectric element. The ink jet printhead can be formed using a simplified method to pattern the photosensitive interstitial layer, and to remove a diaphragm attach material which covers a plurality of openings through a diaphragm using laser ablation.

Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component.

Abstract: In some aspects of the present application, a printhead assembly is disclosed that comprise a plurality of functional plates stacked together; an adhesive confinement structure comprising an adhesive-coated mesh substrate arranged between adjacent functional plates to provide bonding between the plates.

Abstract: A method for forming an ink jet printhead subassembly can include the use of a sacrificial form to fabricate a printhead subassembly having a plurality of ink channels therethrough. The sacrificial form can be manufactured using one or more described techniques. The completed printhead subassembly can include a single solid structure manufactured from a single material, or can include more than one solid structures assembled together. A printhead subassembly according to the present teachings can have a reduced number of parts and cost, simplified manufacture, and increased yields and lifetime compared to some other printhead subassemblies.

Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.

Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.

Abstract: In accordance with aspects of the present disclosure, a printhead assembly arranged to dispense ultraviolet curable ink or gel ink and method thereof is disclosed. The printhead assembly includes a plurality of functional plates stacked together; a first adhesive layer arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent function plates to provide chemical resistance to the ultraviolet curable ink or the gel ink.

Abstract: The present application is directed to novel electrostatic actuators and methods of making the electrostatic actuators. In one embodiment, the electrostatic actuator comprises a substrate, an electrode formed on the substrate and a deflectable member positioned in proximity to the electrode so as to provide a gap between the electrode and the deflectable member. The deflectable member is anchored on the substrate via one or more anchors. The gap comprises at least one first region having a first gap height positioned near the one or more anchors and at least one second region having a second gap height positioned farther from the anchors than the first region. The first gap height is smaller than the second gap height.

Abstract: A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.