Abstract: The specification describes a pattern transfer technique for forming patterns of thin films of high resolution over large areas. It involves forming a pattern layer on a transfer substrate, patterning the pattern layer while on the transfer substrate, then contacting the transfer substrate with the receiving substrate. The surface of the receiving substrate is treated to activate the surface thereby improving adhesion of the transfer pattern to the receiving substrate. The activation treatment involves forming a layer of metal particles on the surface of the receiving substrate. The pattern layer is preferably of the same metal, or a similar metal or alloy, and is transferred from the transfer substrate to the receiving substrate by metallurgical bonding. The method of the invention is particularly useful for printing metal conductor patterns (metalization), and device features, on flexible polymer substrates in, for example, thin film transistor (TFT) technology.

Abstract: An optically controlled switch includes first and second electrodes, a channel extending between the electrodes, and a light source positioned to illuminate the channel. The light source produces a wavelength capable of changing the material's conductivity. The channel includes a photosensitive organic material and is configured to operate as a light controlled switch.

Abstract: The specification describes a pattern transfer technique for forming patterns of thin films of high resolution over large areas. It involves forming a pattern layer on a transfer substrate, patterning the pattern layer while on the transfer substrate, then contacting the transfer substrate with the receiving substrate. The surface of the receiving substrate is treated to activate the surface thereby improving adhesion of the transfer pattern to the receiving substrate. The activation treatment involves forming a layer of metal particles on the surface of the receiving substrate. The pattern layer is preferably of the same metal, or a similar metal or alloy, and is transferred from the transfer substrate to the receiving substrate by metallurgical bonding.

Abstract: The specification describes a lamination method for thin film transistor TFT devices wherein each ply of the laminate is a polymer and each contains a portion of the TFT or the interconnection circuit. The plies are laminated together using a solid adhesive polymer layer on the surface of one or both of the plies. The solid adhesive polymer layer has a low elastic modulus that provides effective encapsulation of the TFT, and laminates the plies without high heat or pressure.

Abstract: A method for making an apparatus, for example, comprises attaching at least one self-assembled monolayer to a first element formed on a substrate. Thereafter, at least one attaching layer is formed on the substrate, adjacent to the one or more self-assembled monolayers. A second element is then formed on the one or more attaching layers spaced from the first element by about a length of the one or more self-assembled monolayers.

Abstract: An optically controlled switch includes first and second electrodes, a channel extending between the electrodes, and a light source positioned to illuminate the channel. The light source produces a wavelength capable of changing the material's conductivity. The channel includes a photosensitive organic material and is configured to operate as a light controlled switch.