Abstract: An interface, apparatus, and method are described for communication between a radio equipment control (REC) node and a radio equipment (RE) node in a radio base station that tranceives information over radio interface using multiple antenna carriers. The REC node is separate from and coupled to the RE node by a transmission link. Both control information and user information are generated for transmission over the transmission link from one of the REC node and the RE node to the other. Many advantageous interface features are described.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

Abstract: The present invention is directed to a method for testing the leakage rate of an encapsulated device comprising the step: bombing the device with a Neon and/or Argon atmosphere using a bombing pressure of at least more than environmental pressure and measuring the quality factor before and after bombing. Preferably, the bombing time is about 10 to 100 hours, and the bombing pressure is 1.5 to 100 bar, more preferably 1.5 to 5 bar and most preferably about 4 bar. With this test, the leakage rate of fine leaks of the device may be determined. This test is helpful in determining statistical surface contaminations or defects caused by wafer processing that affect the seal integrity just enough to cause shorter lifetimes. Further, dicing, die assembly and transfer molding may also introduce physical defects which may be detected with the present method. Finally, the inventive test method may be useful for process optimization: Hermeticity tests are a great help to optimize sealing processes.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1 and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2 comprises a compound E, which includes at least two isocyanate groups.

Abstract: A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

Abstract: The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface reg

Abstract: Data IQ of a first mobile radio system are processed in the baseband unit BB of the base station BS, and are converted from or into the high-frequency range inside a high-frequency unit RF of the base station. The data IQ of the first mobile radio system are transmitted between the baseband unit BB and the high-frequency unit RF via an interface IC. Data IP to be transmitted of a second mobile radio system are, before a processing in the baseband, and/or received data IP of the second mobile radio system are, after a processing, also transmitted via the interface IC.

Abstract: Two-component systems are described which are suitable for underlining, adhesive bonding of the crimped fold and sealing of auto body sections, particularly for crimped fold sealing of add-on vehicle parts. The two-component systems attain the requisite grip strength for mounting the add-on parts on the body as well as the requisite strength and dimensional stability for the production process up to and with the CIP passage, within the predetermined cycle time, on the basis of cross-linking of the sealant composition twice. In one embodiment, the surface of the two-component system is pre-cross-linked by a UV-induced reaction and by the cross-linking of the two-component system to the extent of portability. In addition, two-component systems are described which cross-link intentionally only partially up to a consistency that permits a rugged course of the process through cleaning baths and which harden completely only by means of a further hardening process, for instance in the CIP forced circulation oven.

Abstract: Disclosed is a method for producing single microlenses or an arrays of microlenses composed of a glass-type material, in which method a first substrate is provided with a surface containing impressions over which a second substrate composed of a glass-type material is placed at least partially overlapping it and is joined therewith under vacuum conditions, and in which method the substrate composite is tempered in such a manner that the second substrate softens and flows into the impressions of the first substrate, thereby structuring the side of the second substrate facing away from the first substrate in order to form at least one microlens surface. The invention is distinguished in that for forming the at least one microlens surface, the softened glass-type material of the second substrate flows into at least two impressions of the first substrate, the shape, size and arrangements of the two impression determining the curvature of the forming microlens surface.

Abstract: The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface region

Abstract: The invention relates to a method and a device for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding said circumferential line and which has a lens underside facing the convex lens surface.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type substrate in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: A storage-stable moisture-curing one-component fire-retardant polyurethane system, useful as adhesive, sealant or coating material, comprising at least one hydrated mineral having a water-content of less than 0.1% and being treated with a moisture-reactive compound, and at least one binder on isocyanate basis. Such PU-systems preferably further comprise at least one phosphorus-containing compound, most preferably a phosphorus-containing plasticizer, which is preferably halogen-free. The binder on isocyanate basis has preferably an isocyanate content in the range of from 0.01 to 10% by weight referred to the total weight of the system.

Abstract: A storage-stable moisture-curing one-component fire-retardant polyurethane system, useful as adhesive, sealant or coating material, comprising at least one hydrated mineral having a water-content of less than 0.1% and being treated with a moisture-reactive compound, and at least one binder on isocyanate basis. Such PU-systems preferably further comprise at least one phosphorus-containing compound, most preferably a phosphorus-containing plasticizer, which is preferably halogen-free. The binder on isocyanate basis has preferably an isocyanate content in the range of from 0.01 to 10% by weight referred to the total weight of the system.

Abstract: A morpholine group comprising catalyst of the general formula, ##STR1## wherein n+m is >1 and R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11, R.sub.12, R.sub.13 and R.sub.14 are independently from each other hydrogen or an alkyl group, particularly a methyl or an ethyl group, is described. Said catalyst is particularly suitable for the use in storage stable polyurethane (PU)-compositions usable as adhesives, sealings, coatings or pretreatments with a primer. Said PU compositions have a delayed skinning time and thus an extended assembly time but nevertheless a fast development of strength, and they are suitable for the application on metal, glass, ceramics, wood, cementitious substratums and plastic substratums.

Abstract: Two-component adhesive-, sealing- or coating compositions are being described which are separately packed, and comprise the component A and the component D, whereby the component A is curing as soon as it gets in touch with water or the component D which contains the curing agent for the component A.The component D can be, or a component B containing an ingredient which is curing at the contact of water, or, possibly, at the contact with the component A, orthe component D can also be a mixture of solid matter and a volatile ingredient which is causing the cross-linking of the component A.The advantage of the novel two-component systems is that the component D is working as a curing agent for the component A, however, a surplus thereof is, or self-curing, or it does not leave a nuissance residue in the cured composition.