Patents by Inventor Peter Nell

Peter Nell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130267700
    Abstract: The present application relates to novel 6-alkylamino-substituted dicyanopyridines, to their amino acid ester prodrugs, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular disorders.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 10, 2013
    Applicant: BAYER INTELLECTUAL PROPERTY GMBH
    Inventors: Alexandros VAKALOPOULOS, Daniel MEIBOM, Barbara ALBRECHT-KÜPPER, Katja ZIMMERMANN, Jörg KELDENICH, Hans-Georg LERCHEN, Peter NELL, Frank SÜßMEIER, Ursula KRENZ
  • Patent number: 8513255
    Abstract: The invention relates to substituted dihydroquinazolines and to processes for their preparation and also to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, in particular for use as antiviral agents, in particular against cytomegalo viruses.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 20, 2013
    Assignee: AiCuris GmbH + Co. KG.
    Inventors: Tobias Wunberg, Judith Baumeister, Ulrich Betz, Mario Jeske, Thomas Lampe, Susanne Nikolic, Juergen Reefschlaeger, Rudolf Schohe-Loop, Frank Suessmeier, Holger Zimmermann, Rolf Grosser, Kerstin Henninger, Guy Hewlett, Joerg Keldenich, Dieter Lang, Peter Nell
  • Publication number: 20130210795
    Abstract: The present application relates to novel substituted dicyanopyridines, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prophylaxis of cardiovascular disorders.
    Type: Application
    Filed: June 27, 2011
    Publication date: August 15, 2013
    Applicant: BAYER INTELLECTUAL PROPERTY GMBH
    Inventors: Alexandros Vakalopoulos, Daniel Meibom, Peter Nell, Frank Sussmeier, Barbara Albrecht-Kupper, Katja Zimmermann, Joerg Keldenich, Dirk Schneider, Ursula Krenz
  • Patent number: 8440700
    Abstract: The present application relates to novel substituted aryloxazole derivatives, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular and metabolic disorders.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: May 14, 2013
    Assignee: Bayer Intellectual Property GmbH
    Inventors: Peter Nell, Walter Hübsch, Barbara Albrecht-Küpper, Jorg Keldenich, Alexandros Vakalopoulos, Frank Süssmeier, Katja Zimmermann, Dieter Lang, Daniel Meibom
  • Patent number: 8426602
    Abstract: The present application relates to novel heteroaryl-substituted dicyanopyridines, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular disorders.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: April 23, 2013
    Assignee: Bayer Intellectual Property GmbH
    Inventors: Daniel Meibom, Alexandros Vakalopoulos, Barbara Albrecht-Küpper, Katja Zimmermann, Peter Nell, Frank Süβmeier
  • Patent number: 8420825
    Abstract: The present application relates to novel 6-alkylamino-substituted dicyanopyridines, to their amino acid ester prodrugs, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular disorders.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: April 16, 2013
    Assignee: Bayer Intellectual Property GmbH
    Inventors: Alexandros Vakalopoulos, Daniel Meibom, Barbara Albrecht-Küpper, Katja Zimmermann, Jörg Keldenich, Hans-Georg Lerchen, Peter Nell, Frank Süssmeier, Ursula Krenz
  • Patent number: 8343981
    Abstract: The invention relates to heterocyclyl-substituted dihydroquinazolines of formula (I), to processes for their preparation, to medicaments containing them, and to methods for the treatment and/or prophylaxis of diseases, in particular, for use as anti-viral agents, in particular, against cytomegaloviruses.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: January 1, 2013
    Assignee: AiCuris GmbH & Co. KG
    Inventors: Tobias Wunberg, Judith Baumeister, Mario Jeske, Peter Nell, Susanne Nikolic, Frank Suessmeier, Holger Zimmermann, Rolf Grosser, Kerstin Henninger, Guy Hewlett, Joerg Keldenich, Dieter Lang
  • Patent number: 8314113
    Abstract: The invention relates to substituted dihydroquinazolines and to a method for the production thereof, the use thereof for treating and/or preventing diseases and for producing drugs for treating and/or preventing diseases, in particular for the use of the inventive dihydroquinazolines in the form of antiviral agents, in particular against cytomegaloviruses.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: November 20, 2012
    Assignee: Aicuris GmbH & Co. KG
    Inventors: Tobias Wunberg, Judith Baumeister, Mario Jeske, Peter Nell, Susanne Nikolic, Frank Suessmeier, Holger Zimmermann, Rolf Grosser, Guy Hewlett, Jorg Keldenich, Dieter Lang, Kerstin Henninger
  • Patent number: 8304412
    Abstract: The present application relates to novel 4-cycloalkyl- and 4-heterocycloalkyl-3,5-dicyano-2-thio-pyridine derivatives, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of hypertension and other cardiovascular disorders.
    Type: Grant
    Filed: November 17, 2007
    Date of Patent: November 6, 2012
    Assignee: Bayer Intellectual Property GmbH
    Inventors: Peter Nell, Walter Hübsch, Barbara Albrecht-Küpper, Alexandros Vakalopoulos, Frank Süssmeier, Jörg Keldenich, Joachim Telser
  • Patent number: 8188592
    Abstract: An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the heat sink plate. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 29, 2012
    Assignee: Infineon Technologies AG
    Inventors: Peter Nelle, Matthias Stecher
  • Publication number: 20120061811
    Abstract: An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the heat sink plate. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.
    Type: Application
    Filed: September 8, 2011
    Publication date: March 15, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Peter Nelle, Matthias Stecher
  • Publication number: 20110294719
    Abstract: The present application relates to dipeptide-like prodrug derivatives of 2-amino-6-({[2-(4-chlorophenyl)-1,3-oxazol-4-yl]methyl}sulfanyl)-4-(4-{[2,3-dihydroxypropyl]oxy}phenyl)pyridine-3,5-dicarbonitrile, processes for their preparation, their use for the treatment and/or prophylaxis of diseases, and their use for the manufacture of medicaments for the treatment and/or prophylaxis of diseases, especially of cardiovascular disorders.
    Type: Application
    Filed: December 3, 2009
    Publication date: December 1, 2011
    Inventors: Hans-Georg Lerchen, Daniel Meibom, Alexandros Vakalopoulos, Barbara Albrecht-Küpper, Joerg Keldenich, Katja Zimmermann, Peter Nell, Ursula Krenz
  • Publication number: 20110237629
    Abstract: The present application relates to amino acid ester prodrug derivatives of 2-amino-6-({[2-(4-chlorophenyl)-1,3-oxazol-4-yl]methyl}sulfanyl)-4-(4-{[2,3-dihydroxypropyl]oxy}phenyl)pyridine-3,5-dicarbonitriles, processes for their preparation, their use for the treatment and/or prophylaxis of diseases, and their use for the manufacture of medicaments for the treatment and/or prophylaxis of diseases, especially of cardiovascular disorders.
    Type: Application
    Filed: December 3, 2009
    Publication date: September 29, 2011
    Applicant: Bayer Schering Pharma Aktiengesellschaft
    Inventors: Daniel Meibom, Hans-Georg Lerchen, Alexandros Vakalopoulos, Barbara Albrech-Küpper, Peter Nell, Jörg Keldenich, Katja Zimmermann, Ursula Krenz
  • Patent number: 8021929
    Abstract: An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a lead frame and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the lead frame. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: September 20, 2011
    Assignee: Infineon Technologies AG
    Inventors: Peter Nelle, Matthias Stecher
  • Publication number: 20110207698
    Abstract: The present application relates to novel heteroaryl-substituted dicyanopyridines, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular disorders.
    Type: Application
    Filed: February 26, 2009
    Publication date: August 25, 2011
    Applicant: BAYER SCHERING PHARMA AKTIENGESELLSCHAFT
    Inventors: Daniel Meibom, Alexandros Vakalopoulos, Barbara Albrecht-Küpper, Katja Zimmermann, Peter Nell, Frank Süßmeier
  • Patent number: 7960387
    Abstract: The invention relates to dihydroquinazolines and methods for the production thereof, the use thereof in the treatment and/or prophylaxis of diseases, in addition to the use thereof in the production of medicaments in the treatment and/or prophylaxis of diseases, especially for use as anti-viral agents, especially against cytomegalo viruses.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: June 14, 2011
    Assignee: Bayer Schering Pharma Aktiengesellschaft
    Inventors: Tobias Wunberg, Judith Baumeister, Ulrich Betz, Mario Jeske, Gerald Kleymann, Thomas Lampe, Susanne Nikolic, Jürgen Reefschläger, Rudolf Schohe-Loop, Frank Süβmeier, Holger Zimmermann, Rolf Grosser, Kerstin Henninger, Guy Hewlett, Jörg Keldenich, Thomas Krämer, Peter Nell, Tse-I Lin
  • Publication number: 20110136871
    Abstract: The present application relates to novel 2-alkoxy-substituted dicyanopyridines, to processes for their preparation, to their use for the treatment and/or prophylaxis of diseases and to their use for preparing medicaments for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular disorders.
    Type: Application
    Filed: May 22, 2009
    Publication date: June 9, 2011
    Applicant: BAYER SCHERING AKTIENGESELLSCHAFT
    Inventors: Walter Hübsch, Daniel Meibom, Alexandros Vakalopoulos, Barbara albrecht-Küpper, Peter Nell, Katja Zimmermann, Frank Süssmeier, Joerg Keldenich
  • Publication number: 20110130377
    Abstract: The present application relates to novel substituted aryloxazole derivatives, a method for the production thereof, the use thereof for the treatment and/or prophylaxis of diseases and the use thereof for the production of drugs for the treatment and/or prophylaxis of diseases, preferably for the treatment and/or prevention of cardiovascular and metabolic disorders.
    Type: Application
    Filed: July 17, 2008
    Publication date: June 2, 2011
    Applicant: BAYER SCHERING PHARMA AKTIENGESELLSCHAFT
    Inventors: Peter Nell, Walter Hübsch, Barbara Albrecht-Küpper, Jorg Keldenich, Alexandros Vakalopoulos, Frank Süssmeier, Katja Zimmermann, Dieter Lang, Daniel Meibom
  • Patent number: 7943960
    Abstract: An integrated circuit arrangement. In one embodiment, the arrangement includes at least one first semiconductor zone of a first conduction type which is doped more highly than the basic doping of a first semiconductor layer and which is arranged at a distance from a first component zone adjoining the first semiconductor layer. At least one connecting zone extends as far as the at least one first semiconductor zone proceeding from the first side. A second semiconductor zone of the second conduction type, is arranged in the first semiconductor layer and is electrically conductively connected to the at least one connecting zone.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: May 17, 2011
    Assignee: Infineon Technologies AG
    Inventors: Joachim Weyers, Peter Nelle
  • Publication number: 20110089545
    Abstract: An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a lead frame and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arranged between the semiconductor chip and the lead frame. The buffer layer includes a material, which is soft in comparison to a material of the diffusion solder layer, and includes a layer thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during temperature fluctuations within a temperature range.
    Type: Application
    Filed: December 22, 2010
    Publication date: April 21, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Peter Nelle, Matthias Stecher